All items in category Industry News
HEAD acoustics Promotes Free Online Seminar on Listening Effort Inside Vehicles
by audioXpress Staff

HEAD acoustics Promotes Free Online Seminar on Listening Effort Inside Vehicles

HEAD acoustics will promote a new online presentation titled "Optimizing Listening Effort in Vehicles." This new free online seminar - October 13, 2020 - will address HEAD acoustics's vast research in both communications and automotive audio, detailing how to explore the company's listening effort evaluation tool called ABLE (Assessment of Binaural Listening Effort). This implementation allows researchers to evaluate listening efforts inside vehicles, including for telecommunication applications.
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Amazon Music Partners with Universal Music Group and Warner Music Group to Remaster Thousands of Songs and Albums in High Resolution
by Joao Martins

Amazon Music Partners with Universal Music Group and Warner Music Group to Remaster Thousands of Songs and Albums in High Resolution

Amazon Music announced a partnership with Universal Music Group and Warner Music Group to remaster thousands of songs and albums to be streamed in its Ultra High Definition premium tier music service, upgrading the digital streaming audio quality of these songs to the highest available. Music from Eagles, Marvin Gaye, Nirvana, Tom Petty, Diana Ross, Linkin Park, J. Cole, Waylon Jennings, Ramones, 2 Chainz, Lady Gaga, Ariana Grande, Selena Gomez and more, is now available in exclusive remasters on Amazon Music HD.
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Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones
by audioXpress Staff

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

Swedish digital audio pioneer Dirac announced that its latest spatial audio solution, which leverages the company's patented Dynamic HRTF technology, is now available for direct integration into the digital signal processors (DSP) of Bluetooth wireless headphones. The solution is now compatible with chipsets from Qualcomm, BES, and MediaTek and allows headphone manufacturers to deliver spatial audio to consumers, independent of playback devices or media players.
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FM Synthesis Pioneer John Chowning to Deliver AES Show 2020 Heyser Lecture
by audioXpress Staff

FM Synthesis Pioneer John Chowning to Deliver AES Show 2020 Heyser Lecture

“Realizing a Dream, a Discovery, and Lissajous Figures,” will be the title of the presentation where Chowning will detail sound spatialization and synthesis innovations from his 50-plus years of research and development in the industry. John Chowning, FM Synthesis pioneer, researcher and composer, will deliver the AES Show 2020 Heyser Lecture on Tuesday, October 27, at 1PM EDT during the AES Show Fall 2020 Convention.
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WiSA Introduces SoundSend Home Cinema Audio Transmitter to Instantly Connect Smart TVs to WiSA Certified Speakers
by audioXpress Staff

WiSA Introduces SoundSend Home Cinema Audio Transmitter to Instantly Connect Smart TVs to WiSA Certified Speakers

WiSA unveiled its WiSA SoundSend audio transmitter, the Association’s first branded product to hit the market since its inception. The SoundSend is an HDMI (or optical)-connected transmitter designed to make wireless multichannel audio accessible in minutes to nearly every smart TV. SoundSend allows for instant transmission of smart TV content to WiSA Certified speakers for a true cinema sound experience at home without speaker wires. The product will be available for purchase in November of 2020 and will retail for $179 US MSRP.
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Audio Product Education Institute Hosts Product Development Symposium During AES Show Fall 2020
by Audio Engineering_Society

Audio Product Education Institute Hosts Product Development Symposium During AES Show Fall 2020

The newly formed Audio Product Education Institute (APEI), an initiative of the Audio Engineering Society (AES), will host a three-day Product Development Symposium as part of the online events of AES Show Fall 2020. The sessions are scheduled for October 14, 15 and 16. All Access registration for AES Show Fall 2020 is required to attend the Product Development Symposium, available now at AESShow.com.
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Bluetooth SIG to Begin Qualifying Products Using LC3 Codec
by Joao Martins

Bluetooth SIG to Begin Qualifying Products Using LC3 Codec

The Bluetooth Special Interest Group (SIG) announced it will start qualifying products using the LC3 Low Complexity Communication Codec, part of the new LE Audio Specification announced at CES 2020, back in January. Even though the organization doesn't expect the rest of the specifications that define all the use cases for LE Audio to be released before mid-year 2021, manufacturers are officially encouraged to start implementing the new Fraunhofer/Ericsson codec.
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CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones
by audioXpress Staff

CEVA and VisiSonics Offer 3D Spatial Audio Development for True Wireless Earbuds and Headphones

CEVA and VisiSonics, a developer of patented 3D spatial audio technologies, announced that the companies have collaborated closely together to develop a comprehensive 3D spatial audio solution for embedded devices, including true wireless audio (TWS) earbuds, headphones and other hearables. The collaboration combines VisiSonics' RealSpace 3D audio software optimized for CEVA’s low power audio and sensor hub DSPs together with CEVA’s MotionEngine head tracking algorithms running on its BNO080 9-axis System in Package (SiP).
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CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software
by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.
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Next Generation Audio and Video Technologies and the Future of Broadcast and Streaming
by audioXpress Staff

Next Generation Audio and Video Technologies and the Future of Broadcast and Streaming

Learn more about next generation audio and MPEG-H Audio, the industry’s most advanced audio system for UHD-TV and streaming. A new webinar series promoted by Fraunhofer IIS, featuring a distinguished panel of experts in standardization, broadcast and production workflows will talk about pioneering solutions for immersive audio and video production, efficient delivery formats and live encoders for broadcast and OTT, as well as creation of enhanced consumer experiences. Register now for the three sessions, October 6, 8, 13, 2020.
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