All items in category Electronics Corner
InvenSense And Sonion Announce Ultra Low-Noise, Low-Power, Miniature O-Series MEMS Microphones for Hearing Aid Applications
by audioXpress Staff

InvenSense And Sonion Announce Ultra Low-Noise, Low-Power, Miniature O-Series MEMS Microphones for Hearing Aid Applications

InvenSense, a leading provider of micro electrical mechanical systems (MEMS) sensor platforms, and Sonion, manufacturer of micro acoustic and micro mechanical solutions for hearing instruments, in-ear earphones and specialty headsets, announced the release of the O-series MEMS microphone in 2 very small form factors: O8 (8mm³) and O11 (11mm³). The O-series products offer hearing aid manufacturers greater flexibility in hearing aid design.
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Tektronix Announces Automated USB 3.1 Type-C Test Solution
by audioXpress Staff

Tektronix Announces Automated USB 3.1 Type-C Test Solution

Tektronix announced an automated USB 3.1 Type-C transmitter test solution for Gen1 and Gen 2 that combines full SigTest support with DPOJET debug and analysis tools, allowing designers to bring devices with improved margins to market in less time. The new solution delivers 100 percent compliance test coverage as well as full support for the new Type-C connector, fixtures and associated channel tests.
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Texas Instruments Introduces Industry’s First 2.1-MHz Four-channel Class-D Amplifier for Automotive Audio Design
by Ward Maas

Texas Instruments Introduces Industry’s First 2.1-MHz Four-channel Class-D Amplifier for Automotive Audio Design

Texas Instruments (TI) introduced the first 2.1-MHz Class-D four-channel audio amplifier specifically designed for automotive applications. Supporting high-resolution 96-kHz digital input, the compact TAS6424-Q1 enables high-fidelity audio with low distortion in automotive infotainment systems. This impressive small footprint device combines low voltage and low noise, while providing lots of software settings, offering manufacturers more freedom to tailor their designs.
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Cirrus Logic Introduces Cost-Effective CS47L15 SmartHIFI Audio IC with Advanced Audio Features
by audioXpress Staff

Cirrus Logic Introduces Cost-Effective CS47L15 SmartHIFI Audio IC with Advanced Audio Features

Cirrus Logic's newest smart codec - CS47L15 SmartHIFI Audio IC - expands advanced audio features to a wider range of smartphones, including “always on” voice activation and virtual stereo for high-fidelity music playback experiences. The new low-power smart codec allows delivering better audio quality and many of the same advanced audio features found in its premium audio and voice ICs to smartphones beyond flagship models.
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Silicon Labs Introduces New Bluetooth Solution and SDK for Apple HomeKit Development
by Cristina Costa

Silicon Labs Introduces New Bluetooth Solution and SDK for Apple HomeKit Development

Silicon Labs has introduced a Bluetooth software solution that enables developers to efficiently create Apple HomeKit-enabled accessories. Silicon Labs’ Bluetooth solution with HomeKit support is pre-tested by Apple. Available as a library with clean, easy-to-use APIs, the Bluetooth 4.2-compliant software is pre-tested and certified by Apple to provide accessory developers with a low-risk solution that accelerates time-to-market.
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Cypress Streamlines Connected Designs with New Turnkey Development Platform
by Cristina Costa

Cypress Streamlines Connected Designs with New Turnkey Development Platform

Cypress Semiconductor announced a new version of its development platform for the Internet of Things (IoT) and consumer electronics that enables wireless connectivity in minutes. The Wireless Internet Connectivity for Embedded Devices (WICED) Studio 4 platform provides a single development environment for multiple wireless technologies, including Cypress's Wi-Fi, Bluetooth and combo solutions, with an easy-to-use application programming interface.
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Microchip Launches New Generation of 8-bit AVR MCUs with Core Independent Peripherals
by audioXpress Staff

Microchip Launches New Generation of 8-bit AVR MCUs with Core Independent Peripherals

Microchip Technology released a new generation of 8-bit tinyAVR MCUs. The four new devices range from 14 to 24 pins and 4 KB to 8 KB of Flash and are the first tinyAVR microcontrollers to feature Core Independent Peripherals (CIPs). The new devices will be supported by Atmel START, an innovative online tool for intuitive, graphical configuration of embedded software projects.
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Panasonic Introduces High-speed Gate Driver Dedicated to GaN Power Transistor X-GaN
by audioXpress Staff

Panasonic Introduces High-speed Gate Driver Dedicated to GaN Power Transistor X-GaN

Panasonic Corporation announced that it will start mass production of a high-speed gate driver (AN34092B) optimized for driving its GaN power transistor X-GaN in November 2016. The company will also start mass production of two types of X-GaN (PGA26E07BA and PGA26E19BA) and provide solutions in combination with high-speed gate drivers. The high-speed gate driver for X-GaN power transistors contributes to space and energy savings in power conversion applications.
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Connect One Introduces Pico WiReach Highly Secure and Cloud Ready IoT Wi-Fi Module
by Cristina Costa

Connect One Introduces Pico WiReach Highly Secure and Cloud Ready IoT Wi-Fi Module

Connect One introduced the first Wi-Fi module in its next-generation family of 802.11b/g/n Wi-Fi modules for the Internet of Things (IoT) market at the electronica 2016 show in Munich, Germany. The new Pico WiReach IoT Wi-Fi module is a small size, sub $10 price, highly secure and cloud ready development solution which is ready to power new-generation connected devices.
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Silicon Labs Introduces World’s Smallest Bluetooth SiP Module
by Cristina Costa

Silicon Labs Introduces World’s Smallest Bluetooth SiP Module

Silicon Labs has introduced the industry’s smallest Bluetooth low energy system-in-package (SiP) module with a built-in chip antenna, offering a complete, cost-effective connectivity solution with no compromises in performance. Available in a tiny 6.5 mm x 6.5 mm package, the BGM12x Blue Gecko SiP module enables developers to miniaturize IoT designs by minimizing the PCB footprint including the antenna clearance area to 51 mm2.
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