Better Acoustics, Better Designs in audioXpress August 2024!

Better Acoustics, Better Designs in audioXpress August 2024!
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Audio Amplification Meets Product Development in audioXpress July 2024

Audio Amplification Meets Product Development in audioXpress July 2024
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The Audio Voice - Weekly Newsletter for audioXpress and Voice Coil Communities

The Audio Voice - Weekly Newsletter for audioXpress and Voice Coil Communities
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Aiming for Better Loudspeaker Designs in Voice Coil July 2024

Aiming for Better Loudspeaker Designs in Voice Coil July 2024
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Fulcrum Acoustic Releases DF4 Dual High-Frequency Horn Loudspeaker
by audioXpress Staff

Fulcrum Acoustic Releases DF4 Dual High-Frequency Horn Loudspeaker

Fulcrum Acoustic continues to create new innovative loudspeakers at an impressive pace. Now, the Massachusetts-based manufacturers has released the DF4 Dual High-Frequency Horn, a spot fill loudspeaker aimed at supplemental high frequency coverage for areas shaded by obstructions. Dual four inch diaphragm high frequency compression drivers provide substantial output suitable for mid to long throw applications. And the new DF443 is particularly effective in applications where supplemental HF coverage may be required due to occlusion from the primary loudspeakers by venue obstructions.
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USound Raises $30M to Ramp Manufacturing of Second-Generation MEMS Technology
by audioXpress Staff

USound Raises $30M to Ramp Manufacturing of Second-Generation MEMS Technology

USound, the Austria-based developer and manufacturer of micro-electromechanical systems (MEMS) speakers for personal devices and wearable technology, announced that it has raised $30 million USD (€25 million EUR) to move into mass production of its second generation MEMS devices, with commitments from several global companies. The investment will ensure that USound will be in a position to build a stable supply chain to meet growing demand for its second-generation MEMS technology.
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Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution
by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.
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    AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit
    by audioXpress Staff

    AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

    AONDevices, a Californian startup provider of ultra-low power, high-performance processors for edge AI applications, announced that engineering samples of its new AON1100 processor are now available. The AON1100 enables sensing capabilities in battery-powered always-on devices that need to support local wake words, voice commands, sound recognition, context recognition, and sensor fusion at high accuracy.
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    Martin Audio Awarded Patent for XE Monitor Waveguide
    by audioXpress Staff

    Martin Audio Awarded Patent for XE Monitor Waveguide

    Martin Audio has extended its list of notable patents with the addition of a United Kingdom Patent for its XE stage monitor waveguide. The patent covers the use of Martin Audio’s differential dispersion coaxial drive units and the continuation of their waveguide shape to form the baffle, as seen in the XE monitors to achieve the desired HF coverage. The geometry of the static HF horn, the LF cone/moving waveguides and the static baffle combine to form a single HF horn.
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    Knowles Partners with Ole Wolff to Offer Compact Hybrid Driver for TWS Earphones
    by audioXpress Staff

    Knowles Partners with Ole Wolff to Offer Compact Hybrid Driver for TWS Earphones

    Knowles Corporation and Ole Wolff, the Danish manufacturer of high quality speakers, receivers, and provider of acoustic system integration, announced the result of their cooperation to improve the comfort and performance of True Wireless Stereo (TWS) earphones with high-definition audio and active noise cancellation (ANC). The two companies have announced an innovative dynamic driver matched to a new balanced armature tweeter that meets the premium sound, high-performance ANC, and hearing personalization in a smaller size.
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    Neumann Introduces KK 14 Electret Capsule and Miniature Clip Mic System
    by Joao Martins

    Neumann Introduces KK 14 Electret Capsule and Miniature Clip Mic System

    Humanity rejoice! Neumann.Berlin announced a new microphone. And not only one, but a whole range. In a surprising sign of life, the German microphone specialists announced their first product range designed especially for close miking musical instruments. The new modular range is based on a new electret capsule that Neumann’s developers spent six years researching, together with the production processes that would be necessary to make this a reality.
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    GRAS Releases 12BE, 12BC, 12BF, and 12BD Microphone Power Modules with TEDS
    by audioXpress Staff

    GRAS Releases 12BE, 12BC, 12BF, and 12BD Microphone Power Modules with TEDS

    GRAS Sound and Vibration added four new power modules to its existing line, with the introduction of the GRAS 12BE, 12BC, 12BF, and 12BD Microphone Power Modules aimed at engineers who need to power CCP or LEMO measurement microphones and would like seamless integration of microphone sensitivity via TEDS. These new power modules have the ability to take advantage of the latest GRAS SysCheck2-enabled microphones.
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    COMSOL Announces Multiphysics Version 6.0 with Valuable New Features in the Acoustics Module
    by Joao Martins

    COMSOL Announces Multiphysics Version 6.0 with Valuable New Features in the Acoustics Module

    With the latest release of COMSOL Multiphysics 6, users of the Acoustics Module will benefit from many new and highly requested features that reflect the software's increasing use in the audio industry. Expanding the level of detail and applicability of multiphysics simulation to every area of development, COMSOL Multiphysics V6 introduces a new platform feature for model management, uncertainty quantification analysis, and important updates and performance enhancements to all modules.
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    Audyssey Announces Updated MultEQ-X Software With New Room Equalization Capabilities for Home Theater and Listening Rooms
    by audioXpress Staff

    Audyssey Announces Updated MultEQ-X Software With New Room Equalization Capabilities for Home Theater and Listening Rooms

    Audyssey, the Californian company created in 2002 by Prof. Chris Kyriakakis and Prof. Tomlinson Holman, and the pioneer in room correction as an integrated solution in AVRs and pre-processors, announced that it has released MultEQ-X, a powerful new software application for calibrating home theater audio visual receivers (AVRs) that have Audyssey’s MultEQ room equalization technology built-in. The new software offers greater control and new MultEQ features.
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