All items tagged with xMEMS Labs (36)

Creative and Mimi Join Forces to Elevate Personalized Audio

January 3, 2025 by Joao Martins

Creative and Mimi Join Forces to Elevate Personalized Audio

Creative Technology and Mimi have teamed up to offer more personalized audio options with the launch of the Aurvana Ace Mimi, the latest TWS earbuds to join the brand's Aurvana series. This collaboration offers users customized audio tuned to their unique hearing profiles, with the assurance that the xMEMS dual-driver system will respond accordingly without distortion. The Aurvana Ace Mimi also deliver LDAC high resolution audio support for the best audio experience on wireless earbuds.

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

December 3, 2024 by Joao Martins

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

Underscoring the potential of solid-state MEMS microspeakers over-the-ear headphones, xMEMS Labs and Merry Electronics announced they will demonstrate a new production-ready reference design at CES 2025. Targeting both premium wireless over-the-ear headphones and gaming applications, Merry highlights xMEMS’ patented 2-way module architecture as a way to improve spatial audio accuracy and reduce weight for gamers, among other benefits.

xMEMS Introduces Nearfield Full-Range Ultrasonic MEMS Microspeaker

November 19, 2024 by Joao Martins

xMEMS Introduces Nearfield Full-Range Ultrasonic MEMS Microspeaker

xMEMS Labs, recognized for its piezo MEMS innovation and creating a leading range of all-silicon microspeakers that until now mostly target earbuds and in-ear applications, has announced a new full-range driver that meets the requirements for nearfield applications. The newly announced xMEMS Sycamore full-range driver uses the company "sound from ultrasound" platform, making it suitable for laptops, smart glasses, or open ear designs.

COMSOL Conference 2024, Boston: Acoustics Up Front

October 11, 2024 by Roger Shively

COMSOL Conference 2024, Boston: Acoustics Up Front

After a five-year gap for in-person conferences from COMSOL, the 2024 event in Boston, MA - part of a planned series now expanding to Europe (Florence, Italy) and Asia (Shanghai, China) - was a very successful return. audioXpress was invited to attend, as more and more audio developers and manufacturers use COMSOL's Acoustics Module, Structural Mechanics Module, and the AC/DC Module, among others integrated in the leading Multiphysics modeling and simulation software.

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

August 20, 2024 by Joao Martins

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

xMEMS Labs announced an innovation in a completely new direction for the company. The new xMEMS XMC-2400 µCooling chip is the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation AI solutions. xMEMS recently revamped its website to reflect the new strategic directions for the company, now with piezoMEMS microspeakers and the actively controlled acoustic vent transducers DynamicVent segments complemented by the new cooling products category.

AMPACS Announces Industry's First 2-Way Over-Ear Headphone Reference Design Based on xMEMS MEMS Speakers

July 23, 2024 by Joao Martins

AMPACS Announces Industry's First 2-Way Over-Ear Headphone Reference Design Based on xMEMS MEMS Speakers

Furthering the integration of solid-state microspeakers in over-the-ear headphones, global ODM/OEM AMPACS announced a turnkey 2-way headphone solution designed in collaboration with MEMS pioneer xMEMS Labs. The patented 2-way module architecture improves spatial audio accuracy and reduces weight, among other benefits versus conventional single-driver architectures. Pre-production prototypes are ready now, and the production-ready solution will be available in September 2024.

Practical T&M: Measuring MEMS Microspeakers

July 17, 2024 by Steve Temme and Michael Ricci

Practical T&M: Measuring MEMS Microspeakers

MEMS microspeakers are a completely new class of product with its unique challenges. MEMS drivers are now commercially available and seeing fast evolution and adoption in true wireless stereo (TWS) earbuds and in-ear monitors (IEM). With the emergence of these small form-factor transducers comes the need to address how to measure its performance and ensure product quality, even before its integration in finished products.

HEAD acoustics' MOBILITY Voice and Noise Conference 2024

June 6, 2024 by Roger Shively

HEAD acoustics' MOBILITY Voice and Noise Conference 2024

audioXpress attended the HEAD acoustics' MOBILITY Voice and Noise Conference 2024 (May 8-9, 2024). An immersive event with the most advanced solutions and an application-based approach for testing and evaluating sound for automotive. On the southern shore of the Golden Gate strait, located on the headlands of the San Francisco Peninsula inside the Presidio, not far from the historic Officer's Club, HEAD acoustics hosted this conference as a way to provide an updated and practical look at all automotive and mobility voice and noise applications.

xMEMS Labs Debuts Reference Designs for True Wireless Stereo Earbuds and In-Ear-Monitors

June 4, 2024 by Joao Martins

xMEMS Labs Debuts Reference Designs for True Wireless Stereo Earbuds and In-Ear-Monitors

Intended to accelerate the adoption of its MEMS microspeakers in true wireless earbuds and in-ear monitors, xMEMS Labs announced the availability of two innovative reference designs available for purchase directly at the xMEMS web store. These reference designs, featuring production-ready MEMS drivers, allow developers to get familiarized with the implementation and performance of xMEMS products, setting brands or manufacturers on a clear and accelerated path to market.

audioXpress June 2024 Models Automotive Audio Development

May 13, 2024 by audioXpress Staff

audioXpress June 2024 Models Automotive Audio Development

audioXpress June 2024 puts automotive audio development into perspective. Starting with how AI and SDV are impacting the industry, an analysis of Integrated Audio Development Frameworks, how sound defines the driving experience of Electric Vehicles, and lessons learned from aftermarket car audio. Learn how to measure MEMS microspeakers, enjoy two great multiphysics simulation articles by Jinlan Huang and René Christensen, and much more.

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