All items tagged with xMEMS Labs (40)

xMEMS Designs Thinner Microspeaker Engineered for Smart Watches and Fitness Bands

May 13, 2025 by Joao Martins

xMEMS Designs Thinner Microspeaker Engineered for Smart Watches and Fitness Bands

Following the debut of the original Sycamore microspeaker in late 2024, xMEMS Labs is already working on expanding the technology to even thinner form factors with the Sycamore-W. This new full-range driver is an evolution of the company's Cypress "sound from ultrasound" MEMS platform introduced in 2023, and currently waiting for the results of safety reports on long-term ultrasound exposure for humans. xMEMS is confident in those reports and is doubling down with the even thinner, Sycamore-W.

Microspeakers to High-End Tweeters in Voice Coil May 2025

April 29, 2025 by audioXpress Staff

Microspeakers to High-End Tweeters in Voice Coil May 2025

Voice Coil May 2025 is now available and in this issue, Vance Dickason explores the popular miniDSP Flex HTx processor, while Mike Klasco dives into the world of microspeakers. For this issue's Test Bench, Vance Dickason characterizes his first driver from the new Italian brand RS Speakers, a new TW 104.28 N/Ag 1.1” tweeter, and next measures the 27TFC/T 1” Soft Dome Tweeter from the SEAS Prestige Titan Line.

xMEMS Labs Powers BleeqUp Sports Glasses with Cowell MEMS Tweeter

April 22, 2025 by Joao Martins

xMEMS Labs Powers BleeqUp Sports Glasses with Cowell MEMS Tweeter

xMEMS Labs announced that its Cowell MEMS drivers are now implemented in a new sports glasses product from BleeqUp, a hardware startup based in China. The BleeqUp product launch, following a spectacular crowdfunding campaign on Kickstarter, marks the first commercial deployment of a MEMS tweeter in glasses frames, paving the way to further opportunities in the - so far elusive - smart eyewear market.

xMEMS Introduces Amplifier-Less MEMS Tweeter for 2-Way Wireless Earbuds

March 27, 2025 by Joao Martins

xMEMS Introduces Amplifier-Less MEMS Tweeter for 2-Way Wireless Earbuds

xMEMS unveiled Lassen, the company’s latest member of its growing µFidelity range of MEMS drivers, and the first “amplifier-less” MEMS tweeter optimized for 2-way True Wireless Stereo (TWS) earbuds. According to xMEMS, Lassen brings a number of advantages with no need for a piezo amplifier, reducing cost, size, and power consumption while maintaining exceptional sound performance with up to 115dB SPL in the 6kHz–20kHz range. For manufacturers, Lassen lowers integration costs by 25% making room for other advanced features, and allowing consistent sound quality in mass production.

Creative and Mimi Join Forces to Elevate Personalized Audio

January 3, 2025 by Joao Martins

Creative and Mimi Join Forces to Elevate Personalized Audio

Creative Technology and Mimi have teamed up to offer more personalized audio options with the launch of the Aurvana Ace Mimi, the latest TWS earbuds to join the brand's Aurvana series. This collaboration offers users customized audio tuned to their unique hearing profiles, with the assurance that the xMEMS dual-driver system will respond accordingly without distortion. The Aurvana Ace Mimi also deliver LDAC high resolution audio support for the best audio experience on wireless earbuds.

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

December 3, 2024 by Joao Martins

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

Underscoring the potential of solid-state MEMS microspeakers over-the-ear headphones, xMEMS Labs and Merry Electronics announced they will demonstrate a new production-ready reference design at CES 2025. Targeting both premium wireless over-the-ear headphones and gaming applications, Merry highlights xMEMS’ patented 2-way module architecture as a way to improve spatial audio accuracy and reduce weight for gamers, among other benefits.

xMEMS Introduces Nearfield Full-Range Ultrasonic MEMS Microspeaker

November 19, 2024 by Joao Martins

xMEMS Introduces Nearfield Full-Range Ultrasonic MEMS Microspeaker

xMEMS Labs, recognized for its piezo MEMS innovation and creating a leading range of all-silicon microspeakers that until now mostly target earbuds and in-ear applications, has announced a new full-range driver that meets the requirements for nearfield applications. The newly announced xMEMS Sycamore full-range driver uses the company "sound from ultrasound" platform, making it suitable for laptops, smart glasses, or open ear designs.

COMSOL Conference 2024, Boston: Acoustics Up Front

October 11, 2024 by Roger Shively

COMSOL Conference 2024, Boston: Acoustics Up Front

After a five-year gap for in-person conferences from COMSOL, the 2024 event in Boston, MA - part of a planned series now expanding to Europe (Florence, Italy) and Asia (Shanghai, China) - was a very successful return. audioXpress was invited to attend, as more and more audio developers and manufacturers use COMSOL's Acoustics Module, Structural Mechanics Module, and the AC/DC Module, among others integrated in the leading Multiphysics modeling and simulation software.

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

August 20, 2024 by Joao Martins

xMEMS Introduces 1mm-Thin Active Micro-Cooling "Fan on a Chip"

xMEMS Labs announced an innovation in a completely new direction for the company. The new xMEMS XMC-2400 µCooling chip is the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation AI solutions. xMEMS recently revamped its website to reflect the new strategic directions for the company, now with piezoMEMS microspeakers and the actively controlled acoustic vent transducers DynamicVent segments complemented by the new cooling products category.

AMPACS Announces Industry's First 2-Way Over-Ear Headphone Reference Design Based on xMEMS MEMS Speakers

July 23, 2024 by Joao Martins

AMPACS Announces Industry's First 2-Way Over-Ear Headphone Reference Design Based on xMEMS MEMS Speakers

Furthering the integration of solid-state microspeakers in over-the-ear headphones, global ODM/OEM AMPACS announced a turnkey 2-way headphone solution designed in collaboration with MEMS pioneer xMEMS Labs. The patented 2-way module architecture improves spatial audio accuracy and reduces weight, among other benefits versus conventional single-driver architectures. Pre-production prototypes are ready now, and the production-ready solution will be available in September 2024.

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