All items tagged with voice recognition and SoC (12)

Synaptics Introduces World's First AI SoC Optimized for Unified Communication and Collaboration Products

October 31, 2023 by audioXpress Staff

Synaptics Introduces World's First AI SoC Optimized for Unified Communication and Collaboration Products

Synaptics announced the availability of the DVF120, a power-efficient and cost-optimized system on chip (SoC) that is optimized for advanced Unified Communication and Collaboration (UC&C) products, and leverages the company's experience to integrate all major features required for such applications. The SoC extends its range of compute engines with a field-proven Linux and Android SDK, enterprise-grade security, and native support of popular collaboration platforms.

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

June 27, 2023 by audioXpress Staff

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection.

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

January 27, 2021 by Joao Martins

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

Qualcomm Technologies and Amazon announced new joint efforts to pre-integrate the Alexa Custom Assistant with the Qualcomm Snapdragon Automotive Cockpit Platforms - the new-generation of automotive-optimized SoCs from Qualcomm. This new system is designed to support automotive OEMs and Tier-1 suppliers to build customizable, in-vehicle intelligent assistants and is offered as an extension module to the Alexa Automotive Software Development Kit (SDK).

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

September 14, 2020 by audioXpress Staff

Apollo4 SoC Family from Ambiq Redefines Ultra-low Power in Wearables, Connected Devices and Always-on Voice-Processing

Ambiq unveiled its latest Apollo4 SoC family, enabling next generation endpoint devices with record-setting energy efficiency - running as low as 3µA/MHz - and new levels of performance. The new Apollo4 systems enable manufacturers to create leading-edge endpoint devices leveraging the unique SPOT platform with Ambiq’s easy-to-use, rich peripheral set. The Apollo4 is available now with CSP and BGA package offerings, as well as an Apollo4 Blue SoC with Bluetooth LE.

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

March 11, 2020 by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.

Fraunhofer IIS Licenses Comprehensive MPEG Audio Codec Suite to NXP Semiconductors

March 2, 2020 by Joao Martins

Fraunhofer IIS Licenses Comprehensive MPEG Audio Codec Suite to NXP Semiconductors

Fraunhofer Institute for Integrated Circuits IIS, the inventor of mp3 and primary developer of the xHE-AAC and MPEG-H Audio standards, announced that NXP Semiconductors has licensed Fraunhofer’s MPEG audio SDK. The complete software package covers four generations of audio codecs, from legacy MPEG Layer-1/2/3 to the next-generation MPEG-H 3D Audio standard and the AAC codec family, including xHE-AAC. NXP will incorporate these codecs in home entertainment product development, from set-top boxes and soundbars to smart speakers.

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

October 21, 2019 by audioXpress Staff

Sonion Combines Voice Pick Up Bone Sensor With Qualcomm Bluetooth SoC to Improve Speech Intelligibility

Sonion, the manufacturer of components and solutions for hearing aids and in-ear headphones, announced that it is now a member of the Qualcomm Extension Program and will offer the Sonion Voice Pick Up Bone Sensor on the Qualcomm Ultra-Low Power QCC5100 Bluetooth SoC series in Q1 2020. The combination will allow other audio manufacturers to implement reliable voice quality and voice recognition applications that are not hindered by surrounding noise.

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

March 19, 2019 by audioXpress Staff

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

Qualcomm made two important announcements for audio developers, both bound to significantly impact the fast-growing market of smart speakers and new generation whole-home audio systems. The San Diego company announced the new QCS400 family of audio SoCs and the Smart Audio Platform 400 development kit, bringing smart speakers high-performance processing, Qualcomm AI Engine, superior connectivity, and multiple advanced audio and visual display capabilities in a single, power-optimized chip architecture.

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

February 26, 2019 by audioXpress Staff

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.

«
1
2
»