All items tagged with smart speakers and DSP (9)

SK Broadband AI Sound Max Powered by DSP Concepts and Tuned by Bang & Olufsen

December 20, 2021 by audioXpress Staff

SK Broadband AI Sound Max Powered by DSP Concepts and Tuned by Bang & Olufsen

Is it a Soundbar? Is it a Smart Speaker? Is it a TV Set-Top Box? Korean telecom operator SK Broadband has introduced its new AI Sound Max set-top box and TV sound speaker featuring three-dimensional audio perfectly tuned by Bang & Olufsen and implemented using the power of the Audio Weaver framework by DSP Concepts. The innovative AI Sound Max is a great example of an immersive home entertainment speaker design with sophisticated features built with Audio Weaver.

Find Solutions for Different Speaker Designs in Voice Coil September 2021

August 26, 2021 by audioXpress Staff

Find Solutions for Different Speaker Designs in Voice Coil September 2021

In Voice Coil September 2021, Vance Dickason writes about DSP crossovers from Danville Signal, Joe Hayes (Vastigo) writes about the DaS AuReality patented 3D loudspeaker technology, and Mike Klasco finds speaker-related technologies that help support smart speaker design efforts. This edition's Test Bench characterizes three new 25mm high-frequency tweeters from BlieSMa, using silk, beryllium, and diamond domes: BlieSMa’s T25S-6, T25B-6, and T25D-6.

Servo-Control in Mainstream Audio: From Motional Feedback to the Bend-Sensor

July 16, 2020 by Mike Klasco

Servo-Control in Mainstream Audio: From Motional Feedback to the Bend-Sensor

Imagine a new class of speaker diaphragm position sensors that enable audio engineers to reduce distortion and extend bass response from studio monitors, soundbars, smart speakers, and even smartphone microspeakers. With the precision of laser displacement instrumentation, this sensor is located between a stationary component of the speaker and an appropriate moving part to provide an error correction reference signal back to the amplifier. Well, that sensor has already been developed. This article was originally published in The Audio Voice weekly email newsletter.

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

January 13, 2020 by audioXpress Staff

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

Swedish sound pioneer Dirac and NXP Semiconductors announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete range of products. The strategic partnership announcement was made at CES 2020.

Dirac Research to Debut New Calibre of Mobile Audio with Breakthrough Dirac Bass Solution at MWC 2019

February 21, 2019 by audioXpress Staff

Dirac Research to Debut New Calibre of Mobile Audio with Breakthrough Dirac Bass Solution at MWC 2019

Dirac Research, the Swedish pioneer of digitally optimized sound solutions, announced the debut of its breakthrough Dirac Bass solution that enables smartphones, smart speakers, and wireless & portable speakers to reproduce deeper bass with higher transparency than ever before. Dirac will feature a new Dirac Bass demo experience developed in partnership with leading micro-speaker manufacturer AAC Technologies, showcasing the next-generation of mobile audio performance at MWC 2019, in Barcelona.

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

January 10, 2019 by audioXpress Staff

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

Microchip Technology, via its Microsemi Corporation subsidiary, announced that its AcuEdge ZLK38AVS Development Kit for Amazon Alexa Voice Service (AVS) now introduces far-field voice pick up and the flexibility to build devices with multiple mic array configurations. The audio front-end solution with one, two and three mic configurations reduces bill of materials costs while addressing the requirements of small-form-factor designs.

CEVA Introduces ClearVox Solution for Enhanced Speech Intelligibility in Voice-Enabled Devices

January 8, 2018 by audioXpress Staff

CEVA Introduces ClearVox Solution for Enhanced Speech Intelligibility in Voice-Enabled Devices

CEVA, a leading licensor of signal processing platforms for smart, connected devices, introduced ClearVox, a new software suite of advanced voice input processing algorithms aimed at enhancing speech intelligibility and voice clarity for voice-enabled devices. ClearVox is licensed exclusively for the CEVA-TeakLite-4 and CEVA-X2 audio/voice DSPs, and extends the company’s voice portfolio with multi-mic beamforming, speaker direction of arrival, noise suppression and echo cancellation algorithms.

Knowles Announces The World’s First Context-Aware, Machine Learning Optimized Audio Processor For Complex Voice Interactions

October 17, 2017 by audioXpress Staff

Knowles Announces The World’s First Context-Aware, Machine Learning Optimized Audio Processor For Complex Voice Interactions

Knowles announced a new audio processor platform, the IA8508 open DSP platform, with four high performance, power efficient, heterogeneous cores and 5.7MB of shared memory for a variety of new use cases. The IA8508 advanced audio processor is optimized for performance and power in both near and far-field voice applications – making it the perfect solution for mobile phones, ear-worn products, and IoT devices such as digital assistants, smart speakers and TVs.

XMOS Delivers Amazon Alexa Voice Service Development Kit with Linear Mic Array for Far-Field Voice Capture

October 5, 2017 by audioXpress Staff

XMOS Delivers Amazon Alexa Voice Service Development Kit with Linear Mic Array for Far-Field Voice Capture

XMOS announced its VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS). A far-field linear mic array solution available, the XMOS kit is ideal for developers who want to integrate Alexa into smart panels, kitchen appliances, and other commercial and industrial electronics. Being a leading supplier of voice and audio solutions to the consumer electronics market, XMOS can combine its unique silicon architecture and software at the interface between voice processing, biometrics and artificial intelligence.