All items tagged with smart home (225)

More Than 5.5 Billion Smart Home Matter-Compliant Devices Forecasted to Ship Between 2022 and 2030

February 9, 2022 by audioXpress Staff

More Than 5.5 Billion Smart Home Matter-Compliant Devices Forecasted to Ship Between 2022 and 2030

Still months from its completion, the Matter smart home specification is already driving new products and strategies across the smart home and consumer electronics market. With a host of major players, technology suppliers, and partners already pledged to delivering Matter compliant offerings, the specification is expected to dominate the smart home landscape within five years, according to a new report from market intelligence firm ABI Research.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

January 28, 2022 by audioXpress Staff

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

Wireless connectivity specialists Telit announced the launch of their new WE310G4 module, which enables manufacturers to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products. Based on Realtek's Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded designs, including smart home devices and appliances, wearables, fitness trackers, smart city sensors, aftermarket telematics and industrial automation sensors.

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

MaxLinear WAV600 Series-2 Chipset Selected for Wi-Fi Alliance Wi-Fi 6 Release 2 Certification Test Bed

January 6, 2022 by Cristina Costa

MaxLinear WAV600 Series-2 Chipset Selected for Wi-Fi Alliance Wi-Fi 6 Release 2 Certification Test Bed

MaxLinear, the provider of radio frequency (RF), analog, digital and mixed-signal integrated circuits, headquartered in Carlsbad, California, announced that their WAV600 Series-2 Chipset SoCs have been selected as access point test bed devices for the Wi-Fi Alliance Wi-Fi CERTIFIED 6 Release 2 certification process. The test bed uses a MaxLinear WAV615 and two MaxLinear WAV665 Wi-Fi Transceiver SoCs to enable tri-band interoperability testing at 2.4GHz, 5GHz, and 6GHz, delivering on performance and increased network capacity.

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17, 2021 by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.

XMOS Strengthens Its Position In Voice Interfaces with XVF3610 and XVF3615 Voice Processors

November 16, 2021 by Joao Martins

XMOS Strengthens Its Position In Voice Interfaces with XVF3610 and XVF3615 Voice Processors

British chip company XMOS announced the launch of the XVF3610 and XVF3615 next generation voice processors. These high-performance two-mic voice interfaces for wireless speakers, TVs, set-top boxes, smart home appliances, gateway products and more, are built on the company's xcore.ai chip infrastructure, and are available in a cost-effective and easy-to-integrate package. XMOS also kick-started an alpha program for its all new ‘Avona’ voice reference design.

NXP Introduces i.MX 93 Applications Processor Family for Secure Connected Devices with Edge AI

November 9, 2021 by audioXpress Staff

NXP Introduces i.MX 93 Applications Processor Family for Secure Connected Devices with Edge AI

NXP Semiconductors is gradually catching up from the time the company wasted in the attempted merger with Qualcomm. The company announced the i.MX 93 family of applications processors designed for automotive, smart home, smart building and smart everything applications. The i.MX 93 family leverages a heterogenous multicore SoC architecture designed to leverage efficient edge machine learning.

Knowles Launches Raspberry Pi Development Kit to Enable Voice Integration for New Applications and Industries

September 23, 2021 by audioXpress Staff

Knowles Launches Raspberry Pi Development Kit to Enable Voice Integration for New Applications and Industries

Knowles announced the availability of the Knowles AISonic IA8201 Raspberry Pi Development Kit to bring voice, audio edge processing, and machine learning (ML) listening capabilities to devices and systems in a range of new industries. The new development kit bundles all of the hardware, add-on open software and algorithms required to test, prototype, and debug voice and audio functionality and integration in new applications for smart home, consumer technology, industrial, and beyond.

Syntiant Introduces NDP102 Neural Decision Processor for Edge AI Sensor Applications

September 16, 2021 by audioXpress Staff

Syntiant Introduces NDP102 Neural Decision Processor for Edge AI Sensor Applications

Syntiant, a provider of deep learning solutions making edge AI a reality for always-on applications in battery-powered devices, announced its new Syntiant NDP102 Neural Decision Processor (NDP) for sensor applications that delivers 100x improvement in efficiency and performance compared to current MCU-based offerings. The fourth edge AI chip from the Californian company enables highly accurate inference performance at industry leading low power consumption.

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