All items tagged with sensors (110)

Sony Announces Noise-Cancelling, IP55-Rated, True Wireless WF-SP800N Sport Headphones

May 8, 2020 by audioXpress Staff

Sony Announces Noise-Cancelling, IP55-Rated, True Wireless WF-SP800N Sport Headphones

Sony Electronics announced the WF-SP800N sport headphones, its newest truly wireless noise canceling model. Designed for an active lifestyle, the WF-SP800N allows users to run, workout at the gym, and enjoy improved music experiences with a secure fit, IP55 rating for water and dust resistance, and long battery life. Based on the same Bluetooth chip from the successful WF-1000XM3, the new WF-SP800N model adds interesting audio processing and personalization feature, with support for 360 Reality Audio.

Hearables Predicted to Reach More Than 50% of the Wireless Headphones Market by 2024

April 21, 2020 by audioXpress Staff

Hearables Predicted to Reach More Than 50% of the Wireless Headphones Market by 2024

A new report from Juniper Research says that the number of hearables in-use will grow to more than 970 million by 2024. This is an increase of 270% over the 260 million estimated for 2020. This updated report identifies vendors that are leveraging hearable technology to add value to premium audio products, such as Bose and Sennheiser, while technology companies are producing earbuds that incorporate sensor platforms and AI capabilities. Juniper predicts a convergence of the market towards Multimedia Hearables.

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

April 7, 2020 by audioXpress Staff

CEVA Announces SensPro High Performance Sensor Hub DSP Architecture for Smart Devices

CEVA announced a new high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices. The new SensPro device family serves as a hub for processing and fusing of data from multiple sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units. This highly-configurable and self-contained architecture brings together scalar and parallel processing for floating point and integer data types, as well as deep learning training and inferencing.

Sonion Announces Niels Svenningsen as New CEO & President

February 12, 2020 by audioXpress Staff

Sonion Announces Niels Svenningsen as New CEO & President

Sonion announced the appointment of Niels Svenningsen as CEO & President of the Sonion Group. Niels Svenningsen was most recently President of Northern Europe in Schneider Electric and brings a wealth of commercial and management experience acquired in the IT and technology sectors. He will start in his new position March 1st, 2020.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

January 7, 2020 by audioXpress Staff

CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware Connected Devices

At CES 2020 CEVA unveiled SenslinQ, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connectivity technologies to enable contextually aware connected devices. The CEVA SenslinQ integrated hardware IP and software platform collects, processes and links data from multiple sensors to enable intelligent devices to understand their surroundings - a key development for augmented hearing using wireless headphones and earbuds.

PCB Completes Construction of $1 Million Clean Room Facility

January 6, 2020 by audioXpress Staff

PCB Completes Construction of $1 Million Clean Room Facility

As a leading global sensor supplier, PCB Piezotronics continues to invest in state-of-the-art pressure assembly operations. The company, a wholly owned subsidiary of MTS Systems Corporation, announced the completion of new environmentally controlled clean rooms totaling 4,300 sq. ft. at their Walden Avenue headquarters. Earlier this year, the sensor manufacturer began assembly of all pressure and force products in this new state-of-the-art facility.

TDK Announces InvenSense CTO as Inductee to MSIG Hall of Fame

October 25, 2019 by audioXpress Staff

TDK Announces InvenSense CTO as Inductee to MSIG Hall of Fame

Dr. Peter G. Hartwell, Chief Technology Officer at InvenSense, a TDK group company, has been named a 2019 inductee into the SEMI-MEMS & Sensors Industry Group (MSIG) Hall of Fame for his outstanding contributions to MSIG and well-known industry activity.. The recognition honors those who inspire a sense of mission, purpose and dedication that drives the MEMS and sensors industry forward.

How Motion Sensors Can Revolutionize Hearables

October 8, 2019 by Charles Pao

How Motion Sensors Can Revolutionize Hearables

The hearables market is exploding, growing at a CAGR of 37.6%. And, like nearly all wireless devices, hearables need low-latency motion sensors in order to not only perform their critical functions but also enable a variety of enhanced features that improve the user experience. This article takes a look at five key features that a sensor must have in order to deliver enhanced functionality such as activity tracking.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

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