All items tagged with sensors (57)

ams Announces New Augmented Hearing Engine with ANC for True Wireless Earbuds

June 27, 2019 by audioXpress Staff

ams Announces New Augmented Hearing Engine with ANC for True Wireless Earbuds

ams announced a new digital noise cancellation technology that the Austrian sensor solutions supplier says will transform the experience of hearing music and voice calls when wearing new, more comfortable, loose-fit true wireless earbuds. The new Augmented Hearing Engine from ams supports development of features such as selectable noise cancellation to optimize listening when in social situations and allows audio manufacturers to develop highly differentiated product designs with unique capabilities.

QuickLogic Announces Time Series EOS S3AI Development Platform for Endpoint AI and Machine Learning Applications

March 18, 2019 by audioXpress Staff

QuickLogic Announces Time Series EOS S3AI Development Platform for Endpoint AI and Machine Learning Applications

QuickLogic, the developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced the launch of its EOS S3AI platform for endpoint Artificial Intelligence (AI) and Machine Learning (ML) applications. The new AI platform provides all the hardware blocks needed to enable low power AI at the connected device endpoint. It comes with time-series (continuous) sensors, including accelerometer / gyroscope / magnetometer motion sensors and two digital microphones (PDMs).

Dialog Semiconductor Provides Audio and Configurable Mixed Signal Chipset for Huawei Honor FlyPods

March 12, 2019 by audioXpress Staff

Dialog Semiconductor Provides Audio and Configurable Mixed Signal Chipset for Huawei Honor FlyPods

Dialog Semiconductor announced that its audio and Configurable Mixed Signal ICs (CMICs) have been adopted by Huawei for their Honor FlyPods, the company’s latest True Wireless Stereo (TWS) earbuds. Five Dialog ICs provide voice control and power to Huawei’s recently announced TWS earbuds. A Dialog’s SmartBeat DA14195 System-on-Chip (SoC) is integrated into each FlyPod earbud and is connected to a pair of Voice Pick Up (VPU) sensors.

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

February 20, 2019 by audioXpress Staff

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

Nanusens, a research venture working on nano-sensors built inside CMOS devices, has announced that its proprietary technology can significantly increase the operational life of earbuds by up to 20%. This can be achieved by replacing the MEMS sensors in an earbud with a single multi-sensor chip solution that is up to ten times smaller, freeing up space for larger batteries. The company will be announcing this technology solution at MWC 2019 in Barcelona, Spain.

New ANC, True Wireless, and Intelligent Connectivity Sensor Solutions from ams at MWC 2019

February 13, 2019 by audioXpress Staff

New ANC, True Wireless, and Intelligent Connectivity Sensor Solutions from ams at MWC 2019

ams, a leading worldwide supplier of high performance sensor solutions, is a rising force in the industry with many important innovations that are meeting next-gen consumer demands. And that includes many of the main market trends for the audio industry, such as hearing enhancers, hearables, voice capture and recognition and acoustic sensing. The Austrian company will showcase several industry-first technologies for mobile devices at MWC 2019 in Barcelona later this month, including exciting developments in active noise cancelling.

CEVA Announces New CEVA-BX All-Purpose Hybrid DSP / Controller Architecture

January 4, 2019 by audioXpress Staff

CEVA Announces New CEVA-BX All-Purpose Hybrid DSP / Controller Architecture

CEVA announced its new all-purpose, hybrid DSP / Controller architecture to address new algorithms of digital signal processing in voice, video, communication, sensing and digital signal control applications. Offering general purpose DSP capabilities required for motor control and electrification, the new CEVA-BX architecture extends CEVA's market reach into the burgeoning automotive and industrial markets currently underserved by legacy DSPs or MPU/MCUs with low performance DSP co-processing.

Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub

January 4, 2019 by audioXpress Staff

Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub

Universal Electronics (UEI), a company specializing in universal control and sensing technologies for the smart home, announced a collaboration with Microsoft to launch a new digital assistant platform for the home built on the Microsoft Azure cloud platform using AI and IoT services. The UEI’s Nevo Butler turnkey smart home hub with nevo.ai built-in digital assistant will be launched at CES 2019 and will be available as a white-label solution for other manufacturers.

Juniper Predicts Hearables To Revolutionize Personal Audio Tech by 2022

December 12, 2018 by audioXpress Staff

Juniper Predicts Hearables To Revolutionize Personal Audio Tech by 2022

Predicting that over 50% of all wireless headphones will incorporate Hearable Voice assistants, touch sensors and other interface technologies, a new report by Juniper Research forecasts that hearables will become the new standard for personal audio in under 5 years. The new report from Juniper has found that there will be an estimated 417 million hearables in use by 2022. This includes fitness-focused devices, hearing augmentation and purely audio-focused devices.

MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond

December 12, 2018 by audioXpress Staff

MIPI Alliance Releases I3C Basic Interface Specification for Widespread Implementation in Mobile and Beyond

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today released MIPI I3C Basic v1.0, a subset of the MIPI I3C specification that bundles the most commonly needed I3C features for developers and other standards organizations. Released under royalty-free terms, MIPI I3C Basic provides a streamlined upgrade path from the ubiquitous I2C, with the most commonly needed developer capabilities for smartphones, IoT devices, connected vehicles and more.

Starkey Announces New Livio AI Hearing Aid Platform with Integrated Sensors and Artificial Intelligence

August 30, 2018 by Audio Engineering_Society

Starkey Announces New Livio AI Hearing Aid Platform with Integrated Sensors and Artificial Intelligence

The unveiling of the new Starkey Livio AI platform was a major event for Starkey Hearing Technologies, with the US-based company multiple times mentioning the market disruption caused by the iPhone on the communications market, and declaring its ambition to do the same with smart hearing. Starkey intends to reivent "both the hearing experience and the hearing aid,” markets with Livio AI, “the world’s first Healthable hearing aid to utilize integrated sensors and artificial intelligence and the first device to track physical activity and cognitive health as measured by hearing aid use in social situations.

«
1
2
3
4
5
6
»