All items tagged with product development (919)
Knowles Releases New Voice Control Development Kit for Smart Home Appliances
May 27, 2021 by audioXpress Staff

Knowles Releases New Voice Control Development Kit for Smart Home Appliances

Knowles Corporation announced the AISonic White Goods Standard Solution, a new, complete development solution that enables fast and easy voice integration for smart appliances. The development kit enables OEM and ODMs to build voice-activated control and far-field speech recognition capabilities into smart appliances, including refrigerators, ovens and microwaves, clothes washing and drying machines, vacuums, dishwashers, and more.
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Nordic Launches Apple Find My Network Compatible Software Development Kit
May 27, 2021 by audioXpress Staff

Nordic Launches Apple Find My Network Compatible Software Development Kit

Nordic Semiconductor announced the availability of its Apple Find My network compatible Software Development Kit (SDK). The SDK enables manufacturers and brands to easily build Find My network capable Bluetooth Low Energy (Bluetooth LE) devices that maximize battery performance leveraging Nordic’s nRF52 or nRF53 Series System-on-Chip's (SoC) ultra-low power consumption.
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Resonado Labs Welcomes Loudspeaker Legend Benny Danovi as VP of Engineering
May 25, 2021 by audioXpress Staff

Resonado Labs Welcomes Loudspeaker Legend Benny Danovi as VP of Engineering

Resonado Labs is rapidly growing its US engineering team, and now announced the appointment of Benny Danovi as the new company Vice President of Engineering and Principal Transducer Engineer. In his new role leading the transducer team, Danovi will spearhead the expansion of the company’s proprietary Flat Core Speaker (FCS) technology architecture with a focus on next generation driver designs for automotive and multimedia applications.
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STMicroelectronics Acquires Edge AI Software Specialist Cartesiam
May 21, 2021 by audioXpress Staff

STMicroelectronics Acquires Edge AI Software Specialist Cartesiam

STMicroelectronics announced a transaction with Cartesiam to acquire its assets (including its IP portfolio) and to transfer and integrate its employees. Cartesiam, based in Toulon (France), is a software company founded in 2016, which specializes in artificial intelligence (AI) development tools enabling machine-learning and inferencing on Arm-based microcontrollers, which today power billions of devices.
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Spotify Uses Audio Weaver in Audio Front-End Development for Car Thing
May 20, 2021 by Joao Martins

Spotify Uses Audio Weaver in Audio Front-End Development for Car Thing

Spotify partnered with DSP Concepts to build and deploy the audio front-end (AFE) software for its limited release of Car Thing, a dedicated smart player for the car. Spotify did the development for Car Thing using TalkTo, DSP Concepts’ proprietary AFE that acts as a ‘microphone cleaner’ by combining advanced signal processing techniques to create clean audio signals so Car Thing can detect voice commands regardless of road noise and other in-cabin sound.
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Goertek Announces Rox Earbud Reference Design with Support for Qualcomm Snapdragon Sound Technology
May 18, 2021 by Joao Martins

Goertek Announces Rox Earbud Reference Design with Support for Qualcomm Snapdragon Sound Technology

Goertek has unveiled a new earbud reference design to help manufacturers looking to implement Qualcomm Snapdragon Sound technology speed their time to market. Powered by the Qualcomm QCC5141 Bluetooth Audio SoC, the Rox reference design is optimized for use in TWS earbuds and hearables and is designed to deliver high-resolution music, crystal-clear voice calls, and lag-free gaming — with superior connectivity and extended battery life.
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Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC
May 18, 2021 by audioXpress Staff

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

Nordic Semiconductor announced that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’.
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Biamp Hires Charlie Hughes as Principal Engineer for its Electroacoustics Division
May 12, 2021 by audioXpress Staff

Biamp Hires Charlie Hughes as Principal Engineer for its Electroacoustics Division

Biamp, the former manufacturer of professional audiovisual solutions from Beaverton, Oregon, now covering virtually every major market segment in pro audio and commercial installation, has appointed Charlie Hughes as Principal Engineer within the company's fast-growing Electroacoustics division. Charlie will have the opportunity to expand the company’s loudspeaker catalog that already encompasses products from Community and Apart.
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CEVA to Acquire Intrinsix to Offer Full Turnkey SoC Platforms
May 10, 2021 by audioXpress Staff

CEVA to Acquire Intrinsix to Offer Full Turnkey SoC Platforms

CEVA announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is anticipated to take place during the second quarter of 2021. The acquisition allows CEVA to offer IP, software and chip development.
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R&D Stories: The Evolution of True Wireless Stereo
May 6, 2021 by Jean-Marc Luneau

R&D Stories: The Evolution of True Wireless Stereo

Adding a valuable perspective to the topic of True Wireless Stereo (TWS) earbuds and hearables development, Jean-Marc Luneau (7 Sensing Software) details meaningful new features and improvements for brands to differentiate their products and make them stand out in today’s crowded market. This article was originally published in audioXpress April 2021.
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