All items tagged with product development (903)

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

April 26, 2021 by audioXpress Staff

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

Cadence Design Systems expanded its popular Tensilica Vision DSP product family with the debut of two new DSP IP cores for demanding and always-on AI applications. The Tensilica Vision P1 DSP is optimized for always-on and smart sensor applications in the consumer market, providing an energy-efficient solution. Packing an industry-leading 3.8 tera operations per second (TOPS), the flagship Cadence Tensilica Vision Q8 DSP delivers 2X performance and memory bandwidth compared to the Tensilica Vision Q7 DSP.

DSP Concepts Launches TalkTogether Module for Audio Weaver

April 22, 2021 by Joao Martins

DSP Concepts Launches TalkTogether Module for Audio Weaver

DSP Concepts launched TalkTogether, a fully-integrated solution focused on human-to-human communication. The new module for Audio Weaver allows brands to instantly add voice comms to any device - from a conference room speaker, to a gaming soundbar to a connected exercise device and more. Given the numerous possibilities, DSP Concepts is also opening up TalkTogether so developers can customize it to fit their precise needs, offering unprecedented design flexibility.

AES Audio Product Education Institute Invites Product Development Houses to Discuss Turning Ideas Into Actual Products

April 15, 2021 by Audio Engineering_Society

AES Audio Product Education Institute Invites Product Development Houses to Discuss Turning Ideas Into Actual Products

The Audio Product Education Institute (APEI) initiative launched by the Audio Engineering Society (AES), will host its seventh online event addressing Supply Chain & Sourcing on Wednesday, April 21 (12:00pm EDT). In this new webinar, moderated once again by supply chain and sourcing experts David Lindberg (DB Enterprises) and Mike Klasco (Menlo Scientific), two Silicon Valley product development firms will discuss their role and contributions in bringing new audio products to market.

Microchip Offers Comprehensive Programming Environment and Code Base for USB Type-C with Power Delivery (PD) Designs

April 15, 2021 by audioXpress Staff

Microchip Offers Comprehensive Programming Environment and Code Base for USB Type-C with Power Delivery (PD) Designs

With Microchip's new Power Delivery Software Framework (PSF), designers can now modify and own the IP in their USB Type-C with Power Delivery (PD) systems. By merging their proprietary code with Microchip's fully functional PD stack, designers have the ultimate flexibility for creating differentiated products while choosing from a wide variety of Microchip SmartHubs, microcontrollers (MCUs) and standalone PD solutions for their USB systems.

ESS Technology Announces New Sabre ES9033Q 2-Channel DAC With Built-In 2Vrms Line Drivers

April 13, 2021 by audioXpress Staff

ESS Technology Announces New Sabre ES9033Q 2-Channel DAC With Built-In 2Vrms Line Drivers

ESS Technology announced their newest addition to the Sabre audio series of DACs, the ES9033Q, a 32-bit, 2-channel DAC with built-in 2Vrms, ground-centered line drivers, resulting in an optimum system performance with no need for external amplifiers. The new Sabre ES9033Q DAC simplifies stereo line level setups with best-in-class performance in one small package, offering D/A conversion with a DNR of 122+dB A-weighted with DRE, and -108dB of THD+N per channel.

Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on Connected Devices

April 9, 2021 by audioXpress Staff

Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on Connected Devices

Renesas Electronics Corporation introduced the RX23W Module with full Bluetooth 5.0 Low Energy support for system control and wireless communication on endpoint connected devices. Featuring the RX23W 32-bit RX MCU supporting fully integrated Bluetooth Low Energy communication, the new RX23W module is equipped with an antenna, oscillator and custom-matched circuit. A solution ready for the development of connected home appliances, healthcare and sports and fitness equipment.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

New DC/DC Controllers with Integrated Active EMI Filter for Compact Power Supplies

April 9, 2021 by audioXpress Staff

New DC/DC Controllers with Integrated Active EMI Filter for Compact Power Supplies

Texas Instruments (TI) introduced a new family of synchronous DC/DC buck controllers that enable smaller power-supply solutions with lower electromagnetic interference (EMI). Featuring an integrated active EMI filter (AEF) and dual-random spread-spectrum (DRSS) technology, the LM25149-Q1 and LM25149 enable designers to cut the area of the external EMI filter in half, lower the conducted EMI of the power design by as much as 55 dBµV across multiple frequency bands, or achieve a combination of reduced filter size and low EMI.

TDK Launches Inductors for Small Power Systems in True Wireless Stereo Devices

March 29, 2021 by audioXpress Staff

TDK Launches Inductors for Small Power Systems in True Wireless Stereo Devices

TDK Corporation has developed the PLEA67 Series of inductors for use in true wireless stereo (TWS) devices. TDK’s original structure design and newly developed materials in the new thin-film power inductors achieve a rated current of 500mA in a small-sized component with an inductance of 2.2μH. The unique magnetic shield structure reduces magnetic flux leakage, while the low-loss magnetic material provides a highly efficient power supply circuit, ideal for small power supply and low power consumption Bluetooth LE modules.

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

March 25, 2021 by audioXpress Staff

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

Ellisys released a broad complement of innovative features to support development of emerging Bluetooth LE Audio products, including controllers, stacks, and devices. These features, available on the company's Bluetooth protocol analysis systems, broaden support for the latest Bluetooth LE Audio specifications and deliver unique technical innovations that solve complex issues for developers.

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