All items tagged with product development (919)
Elliptic Labs Low-Power Touchless Sensing Solutions Now Supported on Latest Maxim Smart Audio Amplifier
July 27, 2021 by audioXpress Staff

Elliptic Labs Low-Power Touchless Sensing Solutions Now Supported on Latest Maxim Smart Audio Amplifier

Elliptic Labs, the AI smart sensor software company from Norway, has announced that it certified the operation of its AI Virtual Smart Sensor Platform with the MAX98396 smart audio amplifier from Maxim Integrated Products. Elliptic Labs and Maxim Integrated are targeting next-generation smart devices to run critical and innovative user experiences, like presence detection and 3D touchless gesture sensing, on Maxim Integrated’s audio amplifier technology.
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CEVA Announces RivieraWaves with Bluetooth 5.3 IP for Wireless Audio Streaming and Low Power IoT
July 22, 2021 by audioXpress Staff

CEVA Announces RivieraWaves with Bluetooth 5.3 IP for Wireless Audio Streaming and Low Power IoT

CEVA announced the general release of its RivieraWaves Bluetooth 5.3 IP. Supporting a multitude of features to further enhance security, robustness and low power operation, the RivieraWaves Bluetooth 5.3 IP is now available as a complete hardware and software solution for new designs, and as a software-only upgrade for compatible existing designs. All the latest features of Bluetooth are supported, including Isochronous Channels for LE Audio.
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Acroname Launches First Programmable USB Type-C Hub Designed for USB-PD Debug and Validation
July 22, 2021 by audioXpress Staff

Acroname Launches First Programmable USB Type-C Hub Designed for USB-PD Debug and Validation

USB Specifications, unified by products using a USB Type-C connector, commonly called USB-C, promise standardized power and data delivery. Unfortunately, poorly tested devices in the market can make USB-C systems unpredictable, expensive, and frustrating to consumers. Improving USB-C testing is critical to delivering on the “one connector to rule them all” promise of USB-C. Acroname's new USBHub3c makes testing USB-C devices easier, safer, and cheaper.
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Resonado Labs Closes $3M Series-Seed Round and Gains New High-Profile Investors
July 20, 2021 by audioXpress Staff

Resonado Labs Closes $3M Series-Seed Round and Gains New High-Profile Investors

Resonado Labs announced the closing of its Series-Seed venture capital round at $3M, bringing the total raised to date to $5.2M including Pre-Seed funding. The capital will accelerate the commercialization of Resonado Labs’ proprietary, novel Flat Core Speaker (FCS) technology, help the company develop a wider array of drivers, and invest in new talent and test and measurement equipment. Resonado is intent on rapidly expand into the automotive, marine, and home audio industries.
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Microchip Announces Qi 1.3 Wireless Charging Reference Design
July 14, 2021 by audioXpress Staff

Microchip Announces Qi 1.3 Wireless Charging Reference Design

The Wireless Power Consortium (WPC) has recently released the Qi 1.3 specification that requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver. To meet the specification, Microchip Technology announced a new Qi 1.3 wireless charging reference design providing developers of wireless charging systems for automotive and consumer applications with the necessary tools and support for the seamless integration and certification of new-generation product designs.
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Build Your Own AIAIAI TMA-2 Modular Headphones
July 13, 2021 by Joao Martins

Build Your Own AIAIAI TMA-2 Modular Headphones

Danish headphone brand AIAIAI is an interesting example of differentiation based on design, product and user focus. Cleverly combining a simple but effective design that serves multiple needs, AIAIAI offers a range of headphones for home studio, DJs, and contemporary lifestyle. Understanding its user-base, the brand gained a cult-following that is the envy of many larger audio brands. And the latest concept from AIAIAI is now a totally customizable headphone.
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Qualcomm Snapdragon Sound: Questions, Development, Audio Momentum and the Market
July 2, 2021 by Joao Martins

Qualcomm Snapdragon Sound: Questions, Development, Audio Momentum and the Market

In early March 2021, following a series of announcements in development platforms and solutions for wireless audio, Qualcomm announced Qualcomm Snapdragon Sound, a new end-to-end approach to promote high-resolution digital audio and enhanced voice communications across devices. The systems' approach combines and optimizes multiple Qualcomm technologies for mobile platforms, processing, connectivity, plus the latest aptX Adaptive audio technologies needed to improve the sound experience for consumers. But how can manufacturers and new brands benefit? Will there be a lossless extension for aptX Adaptive? We asked the questions to Jonny McClintock, Director of aptX Sales & Marketing at Qualcomm.
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Alango Extended Voice Communication Package Available for DBMD7 Processor from DSP Group
July 2, 2021 by audioXpress Staff

Alango Extended Voice Communication Package Available for DBMD7 Processor from DSP Group

DSP Group and Alango Technologies announced the availability of Alango’s Extended Voice Communication Package (eVCP), a universal software package of digital signal processing technologies for voice applications, running on DSP Group’s DBMD7 SmartVoice processor. The combination allows companies developing high-performance voice conferencing systems to quickly bring to market solutions with the best in voice clarity and system flexibility.
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Automotive OEM Engineering and Business - An Opportunity for Audio Brands
June 25, 2021 by Roger Shively

Automotive OEM Engineering and Business - An Opportunity for Audio Brands

Branded Sound Signatures? Unique Brand Simulation Presets? All Part of Automotive OEM Engineering and Business. In this article, originally published in The Audio Voice newsletter, Roger Shively (Co-founder, JJR Acoustics) writes about automotive opportunities for branded audio and how, as audio system and vehicle acoustic simulation is on the rise, modeling and tuning of sound signatures also becomes a possibility.
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CEVA Expands Wireless Connectivity Options for Developers with New RivieraWaves UWB Platform
June 24, 2021 by audioXpress Staff

CEVA Expands Wireless Connectivity Options for Developers with New RivieraWaves UWB Platform

CEVA unveiled its new ultra-low power RivieraWaves UWB platform IP targeting mobile, automotive, consumer and IoT applications, lowering the entry barriers for companies to include UWB in their chip designs. With this new solutions, developers are able to benefit from CEVA's combined IP offering of Bluetooth and UWB technologies for new use cases in emerging high-volume applications.
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