All items tagged with product development and sensor fusion (19)

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

December 16, 2024 by Joao Martins

AONDevices Unveils Edge AI Sensor Module in Collaboration with P-Logic Consulting

AONDevices announced the launch of its AONix Edge AI sensor module, a new platform that addresses key challenges for battery-operated connected devices running artificial intelligence on the edge. Developed in collaboration with P-Logic Consulting and featuring sensor integration from TDK InvenSense, this compact 32mm x 32mm module is an energy-efficient platform with the ability to deliver real-time AI performance in always-on applications, particularly for consumer electronics.

Azoteq Appoints Iton as Independent Design House

December 4, 2024 by audioXpress Staff

Azoteq Appoints Iton as Independent Design House

Azoteq, the semiconductor company that pioneered sensor fusion and multi-sensor technologies on single ICs for consumer electronics, announced the signing of Iton as an independent design house (IDH). This partnership reinforces Azoteq's commitment to delivering cutting-edge solutions while speeding up product development processes and turnkey design, leveraging Iton's expertise in embedded systems, and manufacturing.

Microchip Technology Expands dsPIC Digital Signal Controller Family to Enhance Real-Time Precision and Execution

August 2, 2024 by Cristina Costa

Microchip Technology Expands dsPIC Digital Signal Controller Family to Enhance Real-Time Precision and Execution

Meeting the requirements for more complex and higher performance embedded systems, Microchip Technology has launched its new dsPIC33A Core family of Digital Signal Controllers (DSCs). The new DSCs feature a 32-bit architecture with a double-precision floating-point unit and DSP engine for faster computation in time-critical applications, ideal for fast-charging, wireless charging, and sensing systems such as those required for adaptive audio applications.

Analog Devices Now Sampling New ADXL380 and ADXL382 Triaxial MEMS Accelerometers

July 22, 2024 by Joao Martins

Analog Devices Now Sampling New ADXL380 and ADXL382 Triaxial MEMS Accelerometers

It was a big product announcement from Analog Devices at Sensors Converge 2024, but aside for what was revealed to those attending the event, there has yet to be a formal announcement. The ADXL380 and ADXL382 are low noise, low power, wide bandwidth, 16-bit sensors that cover a dynamic range of 85dB, making them good options for precision applications with minimal calibration, with the ADXL380 being ideal for new true wireless ANC earbuds. audioXpress explores here all the important details about these two new 3-axis MEMS accelerometers.

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

March 7, 2023 by audioXpress Staff

STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

June 10, 2022 by Cristina Costa

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA announced an expansion to its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection. The FSP201 is ideal for consumer robotics and other emerging smart devices employing sensor fusion technologies, including XR glasses, 3D audio headsets and the wide range of 6-axis motion use cases across IoT and the metaverse.

AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

December 17, 2021 by audioXpress Staff

AONDevices Announces Ultra-Low Power AON1100 Always-On Edge AI Processor and Development Kit

AONDevices, a Californian startup provider of ultra-low power, high-performance processors for edge AI applications, announced that engineering samples of its new AON1100 processor are now available. The AON1100 enables sensing capabilities in battery-powered always-on devices that need to support local wake words, voice commands, sound recognition, context recognition, and sensor fusion at high accuracy.

Upgrade Sensing for Your True Wireless Stereo Designs. Why Buy Four Chips if You Only Need One?

October 1, 2021 by Special Content

Upgrade Sensing for Your True Wireless Stereo Designs. Why Buy Four Chips if You Only Need One?

Azoteq recently released its second-generation four-in-one chip for earbuds. The IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The 1.62 x 1.62 mm chip allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.

Sondrel Unveils Edge Computing IP Platform for Smart Devices

September 8, 2021 by audioXpress Staff

Sondrel Unveils Edge Computing IP Platform for Smart Devices

Sondrel has created a powerful, quad core IP platform that is ideal for ASIC solutions for remote gathering and processing of video and data at the Edge with secure onwards transmission of the results. The SFA 200 reference design is targeted at battery powered applications in Smart Home, Sensor Fusion, voice-control, and other devices where a compact chip can add processing ‘smarts’ by providing local end-point data processing for data collection and analysis along with inference processing.

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