All items tagged with product development and processing algorithms (10)

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

November 4, 2024 by Joao Martins

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

Alango Technologies announced a new digital sound processing module for Qualcomm's Bluetooth SoCs, including the latest S7 Gen1 Sound platform that features five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to previous solutions. According to Alango, this first to market platform offers a pre-integrated, ready-to-use modular solution for the latest generation of hearables and advanced audio designs.

Microchip Technology Expands dsPIC Digital Signal Controller Family to Enhance Real-Time Precision and Execution

August 2, 2024 by Cristina Costa

Microchip Technology Expands dsPIC Digital Signal Controller Family to Enhance Real-Time Precision and Execution

Meeting the requirements for more complex and higher performance embedded systems, Microchip Technology has launched its new dsPIC33A Core family of Digital Signal Controllers (DSCs). The new DSCs feature a 32-bit architecture with a double-precision floating-point unit and DSP engine for faster computation in time-critical applications, ideal for fast-charging, wireless charging, and sensing systems such as those required for adaptive audio applications.

CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family

August 18, 2023 by audioXpress Staff

CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family

CEVA announced its enhanced NeuPro-M NPU family, directly addressing the processing needs of the next era of Generative AI with industry-leading performance and power efficiency for any AI inferencing workload, from cloud to the edge. The new NeuPro-M processor family delivers an industry leading 350 TOPS/Watt to bring the power of generative AI to any application, including for consumer and mobile markets, with exceptional cost and power efficiency.

HEAD acoustics Announces coreIP-Alexa Extension Module for Voice Quality Measurements of Alexa Built-In Devices

October 4, 2022 by Joao Martins

HEAD acoustics Announces coreIP-Alexa Extension Module for Voice Quality Measurements of Alexa Built-In Devices

HEAD acoustics announced availability of its labCORE extension module coreIP-Alexa, specifically created for measurement and validation of the user experience using voice on Alexa-built-in devices. This new labCORE module allows developers and manufacturers to assess the numerous services that Amazon Alexa enables on Alexa-built-in devices, including evaluation of qualified devices that offer Alexa-to-Alexa calls to other Alexa users.

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

July 11, 2022 by Joao Martins

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

December 7, 2021 by audioXpress Staff

RISC-V International Ratifies 15 New Specifications Opening Up New Possibilities for RISC-V Designs

RISC-V is bringing together different companies and industries, combining a modular technical approach with an open license business model for the RISC-V Instruction Set Architecture (ISA). RISC-V International, the global non-profit open hardware standards organization, incorporated in Switzerland, just announced a new set of specifications that will be key for advanced audio applications using machine learning (ML).

Alango Technologies Introduces VoiceDefender Advanced 4-Mic Voice Processing Technology

December 2, 2020 by Joao Martins

Alango Technologies Introduces VoiceDefender Advanced 4-Mic Voice Processing Technology

Alango VoiceDefender is a new advanced voice enhancement signal processing solution, ready to be used by developers and manufacturers in new on-ear and over-ear headphone designs without the need of an ugly boom mic. VoiceDefender enables noise-free voice communication for on-ear/over ear headphones virtually eliminating dominant noise sources and highlighting voice and speech signals, effectively taking augmented audio to a whole new level.

DSP Group Announces Support of TensorFlow Lite for Microcontrollers on its DBMD7 AI/ML SoC

October 22, 2020 by audioXpress Staff

DSP Group Announces Support of TensorFlow Lite for Microcontrollers on its DBMD7 AI/ML SoC

DSP Group announced TensorFlow Lite for Microcontrollers SDK support for its DBMD7 family of low-cost, high-performance, multicore AI and DSP processors. The SDK for the DBMD7 allows developers of AI and high-performance machine learning applications on edge devices to avoid latencies and ensure end-user privacy devices to cost-effectively deploy high-performance machine learning (ML) inference at the edge to avoid network latencies, minimize power consumption, ensure end-user privacy, and free up scarce network bandwidth.

Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

November 1, 2018 by audioXpress Staff

Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

Cadence Design Systems announced the Cadence Tensilica HiFi 5 DSP for audio and voice, the company's first IP core optimized for high-performance far-field processing and artificial intelligence (AI)-based speech recognition processing. This fifth-generation HiFi DSP offers 2X audio processing and 4X neural network (NN) processing improvements versus the HiFi 4 DSP, making it ideal for voice-controlled user interfaces in digital home assistants and automotive infotainment.