All items tagged with product development and CES 2024 (10)

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

January 12, 2024 by audioXpress Staff

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

Frontier Smart Technologies unveiled a collaboration with Realtek for its AURIA Bluetooth LE Audio and Wi-Fi module, which features Auracast support. The audio module has been designed and engineered for simple integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support. The latest Realtek Ameba chips ensure support for the latest technologies.

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

January 9, 2024 by Joao Martins

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

Analog Devices is now sampling its latest audio processor and low power ANC codec, the ADAU1797. This high-performance device with integrated HiFi 3z and FastDSP cores is able to efficiently support front-end audio processing with beamforming and noise reduction, as well as neural network-assisted speech recognition (ASR) processing. An ideal, low latency, low power, three times more powerful processor for true wireless stereo (TWS) ANC earbuds and headphones.

Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals

January 8, 2024 by Joao Martins

Packetcraft Introduces Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio to Accelerate New Category of Peripherals

At CES 2024, Packetcraft announced a new Wireless Multi-Microphone Demo Kit based on Bluetooth LE Audio technology that incorporates the company’s newly available Link Robustness Package. Packetcraft’s software solution supports a new standards-based ultra-low latency solution for wireless microphone accessories. These can typically be integrated into mobile devices and computers, in addition to supporting specialized commercial audio applications, voice announcement systems, and conference room wireless microphones.

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

January 5, 2024 by Joao Martins

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

Orosound, a company with patented signal processing and noise-canceling technologies, has unveiled Orosound Labs, its advanced innovation division that has operated sub rosa for the last couple of years. As the company stands at the forefront of AI-enabled active noise cancellation and reduction technologies that are ready to be embedded in consumer brand products, Orosound Labs is committed to empowering partners with a faster and more reliable way to introduce hearables with unique AI features to the market.

Newauro Brings Smart Speakers Into the Immersive Audio Domain at CES 2024

January 4, 2024 by Joao Martins

Newauro Brings Smart Speakers Into the Immersive Audio Domain at CES 2024

In July 2022, the Saffelberg Investment group acquired all assets, teams and rights of AURO-3D and founded a new company, Newauro, with the intention to further support the growth of the format and technology suite across all markets. Based in Belgium like the original Auro Technologies company, Newauro announced that it's collaborating with Eastech to demonstrate its latest AURO-Scene virtual immersive audio technology at CES 2024.

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

January 2, 2024 by audioXpress Staff

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

Following the announcement that Tymphany partnered with the Fraunhofer Institute for Integrated Circuits (IIS) in Germany to provide new state-of-the-art spatial audio solutions to audio manufacturers, Tymphany now confirms that at the CES 2024 show in Las Vegas, the two companies will demonstrate new reference designs for both headphones and speakers. These demonstrations will take place at Suite #26336 of the Venetian.

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

December 19, 2023 by Joao Martins

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

December 15, 2023 by Joao Martins

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

December 11, 2023 by Joao Martins

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps, will partner with XMOS for its Headphone 3.0 demonstrations at CES 2024. The two companies will showcase a first joint development that will greatly enhance wireless audio quality with huge benefits to the feature set in Sonical's roadmap.

xMEMS Achieves Extended Bass Response, Making ANC Applications Possible From a Single MEMS Driver

November 14, 2023 by Joao Martins

xMEMS Achieves Extended Bass Response, Making ANC Applications Possible From a Single MEMS Driver

The new Cypress MEMS speaker from xMEMS Labs achieves 40X louder bass response on a single monolithic, miniaturized device, achieving well above the 130dB SPL at low frequencies, required for ANC implementations on TWS earbuds. The new xMEMS Cypress achieves this groundbreaking performance by using ultrasound technology. The new development will be demonstrated at CES 2024 by appointment only, with mass production scheduled for late-2024.