All items tagged with product development and beamforming (16)

AES Audio Product Education Institute Webinar Helps Demystify Beamforming for Voice Applications

July 6, 2022 by Audio Engineering_Society

AES Audio Product Education Institute Webinar Helps Demystify Beamforming for Voice Applications

The Audio Product Education Institute (APEI), an Audio Engineering Society initiative, is promoting a webinar exploring application and optimization of microphone beamforming techniques, and the latest optimizations for voice recognition platforms. The knowledge-sharing online session features presentations from DSP Concepts, Soundskrit, and Fluent.ai, with presentation by Dave Lindberg from DB Enterprises in Hong Kong.

Staying Connected in Hostile Sound Environments

September 9, 2021 by Bruce Ryan

Staying Connected in Hostile Sound Environments

Consumers are increasingly looking to have high quality sound integrated into their lives in creative ways. However, ensuring that their demands are met across connectivity and sound can be hard to achieve. Often, the more creative and interesting the application, the higher chance it’s harder to produce a sound that is perfect for every use case.

NXP Semiconductors Completes Acquisition of Retune DSP

August 30, 2021 by Joao Martins

NXP Semiconductors Completes Acquisition of Retune DSP

NXP expanded its already broad portfolio of voice enablement solutions with the acquisition of Retune DSP, the Denmark-based provider of Digital Signal Processing (DSP) software and algorithms for voice control and communication applications. Announced in July and now confirmed, the acquisition of Retune DSP adds three powerful voice DSP software products that will merge with NXP’s voice solutions. The combination with NXP’s broad customer base, global footprint and scale, promises to expand breakthrough voice solutions through combined R&D, sales force and customer support teams.

El axer? All eggs er? Alexa! Conditioning Voice Input for Recognition

July 29, 2021 by Ofer Shahen-Tov

El axer? All eggs er? Alexa! Conditioning Voice Input for Recognition

Great voice recognition can only start with great voice pickup. Just “OK” pickup will greatly compromise recognition accuracy and increase user frustration. The high speech quality you need demands a high-quality audio front-end. And if cost is no object, of course you can build a great solution. But can you also satisfy mid-range markets with attractive pricing?

Spotify Uses Audio Weaver in Audio Front-End Development for Car Thing

May 20, 2021 by Joao Martins

Spotify Uses Audio Weaver in Audio Front-End Development for Car Thing

Spotify partnered with DSP Concepts to build and deploy the audio front-end (AFE) software for its limited release of Car Thing, a dedicated smart player for the car. Spotify did the development for Car Thing using TalkTo, DSP Concepts’ proprietary AFE that acts as a ‘microphone cleaner’ by combining advanced signal processing techniques to create clean audio signals so Car Thing can detect voice commands regardless of road noise and other in-cabin sound.

ArkX Labs EveryWord Far-Field Reference Design Kit Receives Amazon AVS Qualification

November 13, 2020 by audioXpress Staff

ArkX Labs EveryWord Far-Field Reference Design Kit Receives Amazon AVS Qualification

ArkX Laboratories, a joint venture between hardware design and development firm Surfaceink and consumer electronics manufacturing company Ark USA, announced its EveryWord Ultra Far-Field Reference Design Kit has been qualified by Amazon AVS. The advanced far-field development kit features Cirrus Logic SoundClear Technology and NXP i.MX 8 host processor technology and is a powerful solution for manufacturers dealing with noisy environments, different mic array geometry challenges, and the need to support 3 or 5 channels for surround use cases.

CUI Devices Adds Digital I2S Output Devices to MEMS Microphone Line

October 22, 2020 by audioXpress Staff

CUI Devices Adds Digital I2S Output Devices to MEMS Microphone Line

CUI Devices' Audio Group announced the addition of two new digital I2S output models to its comprehensive line of MEMS microphones. The bottom port CMM-3526D-261-I2S-TR and top port CMM-4030D-261-I2S-TR are housed in extremely compact, low profile packages measuring 3.50 x 2.65 x 0.98 mm and 4.00 x 3.00 x 1.25 mm, respectively. Thanks to their digital I2S interface, these MEMS microphones eliminate the need for a codec, allowing for the microphones to connect directly to digital signal processors and microcontrollers in an end application.

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

November 13, 2019 by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.

New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances

November 5, 2019 by audioXpress Staff

New TI Burr-Brown Audio Quad-Channel ADC Captures Voice at Four Time Larger Distances

No more yelling at smart speakers. Texas Instruments (TI) introduced a new audio analog-to-digital converter (ADC) capable of capturing clear audio up to four times farther away than competing devices. The new TI Burr-Brown TLV320ADC5140 audio ADC enables far-field voice capture and achieves a 120-dB dynamic range for clear, high-fidelity audio in smart home applications. The TLV320ADC5140 is the industry’s smallest quad-channel audio ADC with this level of performance.

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.

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