HEAD acoustics Introduces ViBRIDGE Holistic In-Ear Headset Testing Solution

As many audioXpress readers already learned from reading the article by Hans W. Gierlich on the Benefits of Using Structure-Borne Sound in Headset Signal Processing, HEAD acoustics created a complete test solution for in-ear and headset devices using bone-conduction sensors. There are good reasons for developers and manufacturers to explore the use of bone-conduction sensors and test them with the new ViBRIDGE solution.

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced it is opening access to its sensor interface specification, MIPI I3C. All companies, including those not currently members of MIPI Alliance, may access the MIPI I3C v1.0 specification so they may evaluate the incorporation of the specification into their design applications.

STMicroelectronics and Austrian company USound GmbH announced their collaboration on the industrialization and production of the world's first miniature piezoelectric MEMS (Micro-Electro-Mechanical Systems) actuators for smart audio systems in portable devices. The patented micro-speaker technology from USound aims to replace commonly used balanced-armature and electrodynamic receivers for handsets with a small piezo-MEMS actuator.