All items tagged with product development and Thread networking (9)

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

November 22, 2022 by Cristina Costa

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

Enabling smarter connections to the world around us, Texas Instruments (TI) introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline adoption of the Matter protocol in connected applications (also named sometimes as Internet of Things or IoT). The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in the 2.4-GHz connectivity space.

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17, 2021 by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.

Texas Instruments Announces New Low-Power Multi-Standard Multi-Band SimpleLink MCU Platform

February 28, 2018 by Cristina Costa

Texas Instruments Announces New Low-Power Multi-Standard Multi-Band SimpleLink MCU Platform

To meet growing connectivity needs, Texas Instruments (TI) introduced its newest SimpleLink wireless and wired microcontrollers (MCUs). These new devices offer industry-leading low power consumption and concurrent multi-standard and multi-band connectivity for Thread, Zigbee, Bluetooth 5 and Sub-1 GHz. With more memory and unlimited connectivity options, the expanded SimpleLink MCU platform offers 100 percent code reuse across TI’s Arm Cortex-M4-based MCUs to enhance and connect sensor networks to the cloud.

Qorvo and HUMAX Provide Complete Zigbee-based Smart Home Voice Assistant System

December 29, 2017 by audioXpress Staff

Qorvo and HUMAX Provide Complete Zigbee-based Smart Home Voice Assistant System

RF solutions specialist Qorvo announced that its multi-stack, multi-protocol GP712 System-on-Chip was implemented in the new Zigbee-based HUMAX Chorus Voice Assistant. The pairing allows creating a turnkey ultra-compatible smart home system for IoT operators that integrates gateways, sensor devices, cloud platforms and mobile applications. The new Qorvo/HUMAX voice solution will be showcased during CES 2018, in Las Vegas, Nevada.

Libre Wireless Technologies Launches “MAVID”, Miniaturized Low Power Integrated Wireless Voice/Audio/IoT Device

November 3, 2017 by audioXpress Staff

Libre Wireless Technologies Launches “MAVID”, Miniaturized Low Power Integrated Wireless Voice/Audio/IoT Device

At a one day industry summit focused on the Amazon Alexa Voice Service (AVS), Libre Wireless Technologies, announced “MAVID,” an entirely new embedded voice enabled multiprotocol wireless connectivity and IoT platform. This ultra low power and incredibly small new device incorporates a complete hardware and software solution for embedded voice, IoT, audio and wireless connectivity. The new Libre platform will enable OEMs and ODMs to build unique voice-enabled products.

Nordic Semiconductor Shows Development Kit and Other Solutions for Bluetooth 5 Implementation

March 28, 2017 by audioXpress Staff

Nordic Semiconductor Shows Development Kit and Other Solutions for Bluetooth 5 Implementation

Following the announcement at CES 2017 of its Bluetooth 5-compatible nRF52 Series SoCs (nRF52832 and nRF52840 devices), Nordic Semiconductor is showing new development tools for Bluetooth 5 at Bluetooth World, the official event of Bluetooth SIG, taking place at Santa Clara Convention Center, 28-29 March, 2017. Demonstrations include the new Preview Development Kit (nRF52840-PDK) and its first Thread networking SDK.

Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017

December 27, 2016 by Cristina Costa

Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017

Nordic Semiconductor in collaboration with its design partners are unveiling latest Bluetooth low energy and IEEE 802.15.4-enabled innovations at International CES 2017 in Las Vegas. The Norwegian company will demonstrate the capabilities of its Bluetooth 5-compatible nRF52 Series SoCs. Product demonstrations include contactless payment, wearables wireless charging, thread networking, voice-activated remote control, educational platforms, home automation and Bluetooth 5 enhancements.