All items tagged with product development and MEMS sensors (9)

Upgraded Sensor Board from STMicroelectronics Accelerates Plug-and-Play Evaluation with ST MEMS Studio

January 28, 2025 by Cristina Costa

Upgraded Sensor Board from STMicroelectronics Accelerates Plug-and-Play Evaluation with ST MEMS Studio

Developing context-aware applications with MEMS sensors is faster, more powerful, and more flexible with ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. Now upgraded with an STM32H5 microcontroller, USB-C connector, and extra digital interfaces including I3C for flexible communication, the new board lets users quickly evaluate sensors and confidently handle demanding projects with a convenient, graphical development environment.

SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

December 23, 2024 by Joao Martins

SonicEdge Presents Integrated MEMS Speaker and Microphone Solution at CES 2025

To be unveiled at CES 2025 is a new example of a MEMS microspeaker company that now offers an integration with a MEMS microphone. SonicEdge, the startup that pioneered ultrasound MEMS drivers and has yet to enter the market, will present SonicTwin, an integrated speaker-microphone in a single package. Combining the company's patented modulated ultrasound technology that eliminates traditional mechanical vibrations, makes the integration with a microphone and sensors much easier with potential benefits also for ANC and lower-power in TWS earbuds and headphones.

Analog Devices Now Sampling New ADXL380 and ADXL382 Triaxial MEMS Accelerometers

July 22, 2024 by Joao Martins

Analog Devices Now Sampling New ADXL380 and ADXL382 Triaxial MEMS Accelerometers

It was a big product announcement from Analog Devices at Sensors Converge 2024, but aside for what was revealed to those attending the event, there has yet to be a formal announcement. The ADXL380 and ADXL382 are low noise, low power, wide bandwidth, 16-bit sensors that cover a dynamic range of 85dB, making them good options for precision applications with minimal calibration, with the ADXL380 being ideal for new true wireless ANC earbuds. audioXpress explores here all the important details about these two new 3-axis MEMS accelerometers.

Nanusens Announces That It Can Now Create ASICs With Embedded Sensors

May 26, 2023 by audioXpress Staff

Nanusens Announces That It Can Now Create ASICs With Embedded Sensors

Nanusens has announced that it has successfully created a fully digital circuit design to measure the capacitance of its nanosensors. This means that both the sensor structure and its detection circuitry can be made at the same time within a chip using standard CMOS processes on whatever process node is required. As a result, ASICs can now be made with several different sensors embedded within them, helping to expand MEMS applications in hearables.

February 22, 2022 by audioXpress Staff

STMicroelectronics Intelligent Sensor Processing Unit Integrates DSP into MEMS Sensors

STMicroelectronics, a global semiconductor company that is also a top manufacturer of Micro-Electro-Mechanical Systems (MEMS), announced the launch of its new Intelligent Sensor Processing Unit (ISPU) that combines a Digital Signal Processor (DSP) suited to run AI algorithms and MEMS sensor on the same silicon. By combining signal processing and AI algorithms onto MEMS sensors, ST enables standalone devices that are able to sense, process, and take action, while substantially saving space and power.

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

February 20, 2019 by audioXpress Staff

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

Nanusens, a research venture working on nano-sensors built inside CMOS devices, has announced that its proprietary technology can significantly increase the operational life of earbuds by up to 20%. This can be achieved by replacing the MEMS sensors in an earbud with a single multi-sensor chip solution that is up to ten times smaller, freeing up space for larger batteries. The company will be announcing this technology solution at MWC 2019 in Barcelona, Spain.

Bosch Sensortec Launches New Generation of Smart Sensor Hubs for Hearables

July 9, 2018 by audioXpress Staff

Bosch Sensortec Launches New Generation of Smart Sensor Hubs for Hearables

During the Sensors Expo (June 27-28) in San Jose, California, Bosch Sensortec announced the BHI260 and BHA260, the first two members of a new generation of smart sensor hubs. These new devices are optimized for 24/7, always-on sensor processing and feature ultra-low power consumption, and a high performance co-processor, ideal for the development of new wearables, hearables, AR/VR and other mobile devices and battery-operated devices.

COMSOL Announces Integration of Simulation and 3D Design in the Latest Version of LiveLink for Solidworks

February 4, 2016 by audioXpress Staff

COMSOL Announces Integration of Simulation and 3D Design in the Latest Version of LiveLink for Solidworks

The latest release of COMSOL Multiphysics provides capabilities for building custom simulation applications. With LiveLink for Solidworks and the Application Builder from COMSOL it’s now possible to build applications that integrate simulation and 3D design. The software integrates highly productive model building, app design based on COMSOL models created from a Solidworks software geometry.