All items tagged with MWC 2019 (18)

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

February 26, 2019 by audioXpress Staff

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.

Dirac Debuts Latest Version of Dirac 3D Audio at MWC19

February 25, 2019 by audioXpress Staff

Dirac Debuts Latest Version of Dirac 3D Audio at MWC19

At MWC19, Dirac Research announced the debut of its latest version of Dirac 3D Audio for mobile devices, headphones and VR/AR headsets. Using patent-pending Dynamic HRTFs (head-related transfer functions), Dirac 3D Audio enables positional audio reproduction with one degree of resolution in all three dimensions, and offers an unparalleled level of 360-degree audio immersion on mobile devices, ideal for on-the-go gaming and videos.

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

February 25, 2019 by audioXpress Staff

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

Xperi Corporation will showcase its latest mobile imaging, audio and semiconductor solutions from its brands, FotoNation, DTS and Invensas at MWC 2019 (February 25-28), in Barcelona. Xperi will showcase DTS audio solutions specifically targeted at the gaming market, including DTS Headphone:X 2.0 (for Gaming Headphones); DTS:X Ultra (for Windows and Android); DTS:X Game Audio; and DTS:X Premium.

Dirac Research to Debut New Calibre of Mobile Audio with Breakthrough Dirac Bass Solution at MWC 2019

February 21, 2019 by audioXpress Staff

Dirac Research to Debut New Calibre of Mobile Audio with Breakthrough Dirac Bass Solution at MWC 2019

Dirac Research, the Swedish pioneer of digitally optimized sound solutions, announced the debut of its breakthrough Dirac Bass solution that enables smartphones, smart speakers, and wireless & portable speakers to reproduce deeper bass with higher transparency than ever before. Dirac will feature a new Dirac Bass demo experience developed in partnership with leading micro-speaker manufacturer AAC Technologies, showcasing the next-generation of mobile audio performance at MWC 2019, in Barcelona.

HEAD acoustics Exhibits Next-Generation Measurement Technology at MWC 2019

February 21, 2019 by audioXpress Staff

HEAD acoustics Exhibits Next-Generation Measurement Technology at MWC 2019

HEAD acoustics will be exhibiting its comprehensive solutions for optimizing voice and audio quality at the Mobile World Congress (MWC) in Barcelona. The company will introduce 3PASS reverb, the new option for simulating room reverberation, to a large audience for the first time in Hall 7, Stand 7J65. The experts on-site show next generation measurement technology, in order to test super-wideband- and fullband-capable mobile phones, voice-controlled IoT devices and ANC headphones.

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

February 20, 2019 by audioXpress Staff

Nanusens Nano-Sensor Technology Allows True Wireless Earbud Manufacturers to Increase Battery Life by up to 20%

Nanusens, a research venture working on nano-sensors built inside CMOS devices, has announced that its proprietary technology can significantly increase the operational life of earbuds by up to 20%. This can be achieved by replacing the MEMS sensors in an earbud with a single multi-sensor chip solution that is up to ten times smaller, freeing up space for larger batteries. The company will be announcing this technology solution at MWC 2019 in Barcelona, Spain.

New ANC, True Wireless, and Intelligent Connectivity Sensor Solutions from ams at MWC 2019

February 13, 2019 by audioXpress Staff

New ANC, True Wireless, and Intelligent Connectivity Sensor Solutions from ams at MWC 2019

ams, a leading worldwide supplier of high performance sensor solutions, is a rising force in the industry with many important innovations that are meeting next-gen consumer demands. And that includes many of the main market trends for the audio industry, such as hearing enhancers, hearables, voice capture and recognition and acoustic sensing. The Austrian company will showcase several industry-first technologies for mobile devices at MWC 2019 in Barcelona later this month, including exciting developments in active noise cancelling.

Zylia and Infineon Present New Approach to Six Degrees of Freedom Technology in VR/AR at Mobile World Congress 2019

February 13, 2019 by audioXpress Staff

Zylia and Infineon Present New Approach to Six Degrees of Freedom Technology in VR/AR at Mobile World Congress 2019

Zylia, the start-up company that surprised the global market with its spherical microphone array for 3D audio recording and production, together with Infineon Technologies AG, will present an innovative and unique approach to Six Degrees of Freedom (6DoF) technology in virtual and augmented reality (VR/AR) during Mobile World Congress 2019 (Feb. 25-28) in Barcelona. According to Zylia, the presentation will offer a valuable contribution to help users stay on top of current trends in the development of VR and AR solutions.

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