All items tagged with machine learning (112)
STMicroelectronics NPU-Accelerated STM32 Microcontrollers Boost Edge AI Development
December 13, 2024 by Cristina Costa

STMicroelectronics NPU-Accelerated STM32 Microcontrollers Boost Edge AI Development

STMicroelectronics is making embedded artificial intelligence (AI) on-device widely available with its new STM32 microcontroller series. These new NPU-accelerated microcontrollers, which have been available to selected companies since October 2023 and are now available in high volumes, integrate accelerated machine-learning (ML) capabilities for the first time. This makes it possible to run computer vision, audio processing, sound analysis and more directly in low-power, cost-sensitive products.
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Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads
November 7, 2024 by Cristina Costa

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

The Balletto Bluetooth MCU family was announced by Alif Semiconductor in April 2024, and the company is now sampling its development kit, the DK-B1, to enable rapid prototyping of products that require ultra-low power Bluetooth Low Energy or 802.15.4 wireless connectivity. The MCU is also the world's first BLE/Matter solution to feature a DSP engine and an NPU for efficient hardware acceleration of AI/ML workloads.
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Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications
September 24, 2024 by audioXpress Staff

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

Ceva and Edge Impulse announced a collaboration to rapidly develop, train and deploy advanced embedded machine learning (ML) applications on Ceva's neural processing units with cycle-accurate performance, even before physical hardware is available. This first-of-its-kind collaboration based around Ceva's NPU IP ensures that developers can accurately benchmark and refine the performance of their edge AI models using Edge Impulse's platform, significantly accelerating the time-to-market.
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Cadence Tensilica HiFi 5 DSPs Power NXP's Next-Gen Audio DSP Family
September 19, 2024 by audioXpress Staff

Cadence Tensilica HiFi 5 DSPs Power NXP's Next-Gen Audio DSP Family

Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) are a key component in NXP Semiconductors' latest SAF9xxx family of automotive audio DSPs, enabling advanced audio capabilities for next-generation software-defined vehicles. According to Cadence, this development is a significant achievement for the automotive industry, addressing the growing need for sophisticated audio processing to support traditional DSP tasks, artificial intelligence, and machine learning (AI/ML) applications.
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Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer
July 31, 2024 by Joao Martins

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

Particle, a company from San Francisco focused on edge-to-cloud connectivity and platforms, has launched Tachyon, its first Qualcomm Snapdragon-powered single-board computer (SBC), comprising a powerful NPU for AI/ML workloads, built-in high-bandwidth cellular 5G and Wi-Fi 6E connectivity, and a Linux-powered Ubuntu operating system. The board is now available for pre-order on Kickstarter starting at $149.
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Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs
July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.
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Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors
July 10, 2024 by Cristina Costa

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

Real-time, compute intensive applications such as fully adaptive noise cancellation, voice separation and Machine Learning (ML) are pushing the boundaries of embedded processing requirements, demanding more power-efficiency, hardware-level security and high reliability at the edge. With the launch of its PIC64 portfolio, Microchip Technology expanded its computing range to meet this rising demands.
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Accentize dxRevive Pro Version 1.2 Software Adds Enhanced Speech Restoration Capabilities
July 8, 2024 by audioXpress Staff

Accentize dxRevive Pro Version 1.2 Software Adds Enhanced Speech Restoration Capabilities

Software startup Accentize released dxRevive Pro Version 1.2.0, a significant update to their flagship speech restoration plugin. This new version, based on feedback from audio professionals, introduces three innovative algorithms designed to further refine and enhance dialogue restoration, all available as a free update for existing users. The update includes two enhanced versions of existing algorithms – Studio 3 and Natural 2 – alongside an entirely new algorithm, EQ Restore.
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Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere
June 24, 2024 by audioXpress Staff

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

Ceva, a leading licensor of silicon and software IP that enables edge devices to connect, sense and infer data more reliably and efficiently, announced that it has extended its Ceva-NeuPro family of NPUs. These meet growing demand for efficient and specialized AI applications at the Edge, where power and processing power is often limited, particularly in consumer products such as TWS earbuds, wearables, smart speakers, smart appliances, home automation devices, cameras, and more.
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BdSound and NXP Announce Automotive Audio Partnership
June 20, 2024 by Joao Martins

BdSound and NXP Announce Automotive Audio Partnership

BdSound and NXP Semiconductors have joined forces to combine advanced audio signal processing and voice technology with NXP's latest automotive SAF9100 audio DSP device. BdSound aims to provide cutting-edge integrations to improve voice user experience in next-generation vehicles, through NXP’s recently announced high-performance SAF9100 audio DSP. This platform features dedicated neural-network engines that BdSound will be able to fully explore.
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