All items tagged with DSP Group (28)

Panasonic Shows Strong True Wireless Ambitions at CES 2020

January 13, 2020 by audioXpress Staff

Panasonic Shows Strong True Wireless Ambitions at CES 2020

CES 2020 will be remembered as the strongest show for true wireless stereo product announcements so far, and also a pivotal moment for technology evolution in the segment. Among the first companies to make a strong statement at CES 2020 was Panasonic - and its affiliated brand Technics - with three different products, two of which already feature one of the most advanced Hybrid Noise-Cancelling Technology platforms currently available.

Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission

October 14, 2019 by audioXpress Staff

Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission

Chirp, the pioneer of data-over-sound technology, and DSP Group, the specialist in wireless chipsets for smart-enabled devices, announced a turnkey solution leveraging embedded data-over-sound to improve user experiences with enhanced provisioning for consumer applications. The design kit combines Chirp’s ultrasonic signaling protocol for smart-enabled devices with DSP Group’s SmartVoice technology to allow connectivity between nearby devices without requiring any set up, pairing, or configuration.

Voice Algorithm Software Ecosystem Expected to Increase Significantly

May 14, 2019 by audioXpress Staff

Voice Algorithm Software Ecosystem Expected to Increase Significantly

The massive growth in the voice assistant market has created a vibrant ecosystem and significant opportunities for hardware and software developers. Total voice software unit shipments are expected to increase significantly to 2024, according to SAR Insight & Consulting. The firm latest report forecasts a larger increase in voice software, especially within home devices such as smart speakers, soundbars, smart TVs and smart appliances.

Libre Wireless Technologies Partners with Gigaset to Create New Amazon Alexa Built-In DECT Devices

April 24, 2019 by audioXpress Staff

Libre Wireless Technologies Partners with Gigaset to Create New Amazon Alexa Built-In DECT Devices

Leading embedded wireless voice/AI solutions provider Libre Wireless Technologies announced the launch of new voice enabled communications products with Gigaset, Europe’s largest Telco producer and top five in the world. These audio products are industry leading smart communications products featuring Alexa Voice Assistant Built-In that is seamlessly integrated with advanced voice calling features on traditional DECT and PSTN phone systems, combining technology from Libre and DSP Group.

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

February 26, 2019 by audioXpress Staff

DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture

DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.

Libre Wireless MAVID Device and Software Now with Amazon Alexa Built-in

February 8, 2019 by audioXpress Staff

Libre Wireless MAVID Device and Software Now with Amazon Alexa Built-in

Leading embedded wireless voice/AI solutions provider Libre Wireless Technologies announced that its MAVID (Multiprotocol, Audio, Voice, IoT Device) super compact, ultra-low power mic-to-cloud platform and software SDK, now supports the Alexa Voice Service (AVS) built-in. The breakthrough platform incorporates a complete hardware and software solution for embedded voice, IoT, audio and wireless connectivity, and now features integrated AVS.

Vesper Microphones Powers Innovative Line of Voice-Activated Trash Cans

January 7, 2019 by audioXpress Staff

Vesper Microphones Powers Innovative Line of Voice-Activated Trash Cans

Vesper announced that its piezoelectric MEMS microphones will be embedded in the voice-activated sensor trash can from luxury housewares designer simplehuman. The brand will introduce the next-generation of its voice-activated Sensor Can range at CES 2019, providing an excellent example of an implementation that needs to be low-cost, low-power, and robust in any environmental conditions. It needs to support simple voice controls in any circumstance, in exactly the type of product that users appreciate not having to touch.

R&D Stories: Engineering Voice-Enabled Smart Gadgets

July 18, 2018 by Ofer Elyakim

R&D Stories: Engineering Voice-Enabled Smart Gadgets

The first step companies face in enabling a voice user interface (VUI) experience is to decide whether to partner with a current market offering or to build a proprietary voice solution, which requires a significant amount of resources. In this article, Ofer Elyakim (Chief Executive Officer, DSP Group) offers an overview of DSP Group’s experience in enabling voice in a variety of new consumer electronics devices, using its open audio/voice DSP platform. This article was originally published in audioxpress, June 2018.

DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service

June 29, 2018 by audioXpress Staff

DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service

Wireless communications chipset solutions specialists DSP Group announced the availability of its HDClear 3-Microphone Development Kit for Amazon Alexa Voice Service (AVS). This Alexa certified solution features DBMD5, DSP Group’s advanced audio/voice processor, and its best-in-class HDClear voice enhancement processing technology, creating a complete development platform for low-power applications, including smart speakers, wearable computing devices, smart home devices and remote controls.

New Exciting Dimensions in Audio Brought to You in audioXpress June 2018

May 9, 2018 by audioXpress Staff

New Exciting Dimensions in Audio Brought to You in audioXpress June 2018

The June 2018 edition of audioXpress is now available. In this edition, read how MPEG-H audio is introducing new dimensions to television sound, how to deal with mixing and mastering music for music streaming services, and how to design new voice-enabled smart gadgets. You can also build a turntable speed measurement device, and learn more about MQA streaming. And be sure to read the interview with Robert Oliveira, the founder of Comply Foam. Get your issue now.

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