All items tagged with development kit (70)

Unified Computer Intelligence Corporation Launches Alexa and Google Assistant for Ubi Kit Development Platform

January 2, 2018 by audioXpress Staff

Unified Computer Intelligence Corporation Launches Alexa and Google Assistant for Ubi Kit Development Platform

Unified Computer Intelligence Corporation (UCIC) announced the support of Google Assistant on its developer and hardware AI platform, Ubi Kit. The Ubi Kit already supports Amazon’s Alexa Voice Service, and with this new implementation developers can now add Google Assistant to their hardware projects with unprecedented simplicity and ease, using any compatible far field solution, and supporting wake word engines from Sensory, Kitt.AI, Cognitech, and others.

XMOS Announces First True-Stereo AEC Linear Voice Processor and Far-Field Voice Kit for Smart Devices

December 4, 2017 by audioXpress Staff

XMOS Announces First True-Stereo AEC Linear Voice Processor and Far-Field Voice Kit for Smart Devices

XMOS announced the XVF3500 voice processor which delivers 2-channel full duplex acoustic echo cancellation (AEC), along with the world’s first stereo AEC far-field linear microphone array solution, the VocalFusion Stereo Evaluation Kit (XK-VF3500-L33). The XVF3500 voice processor is designed for developers working in the growing voice-enabled smart TV, soundbar, set-top box, and digital media adapter markets, all of which require stereo-AEC support for “across the room” voice-interface solutions.

Rigado Edge Connectivity Tool Suite Supports Bluetooth 5

November 29, 2017 by audioXpress Staff

Rigado Edge Connectivity Tool Suite Supports Bluetooth 5

Rigado has announced its Edge Connectivity Suite with full support for Bluetooth 5. Designed for large-scale commercial connected deployments, Rigado’s Edge Connectivity solution is comprised of Bluetooth 5 end-device modules and the Vesta IoT Gateway, which includes cloud-based tools for secure deployment and updating. The solution is based on Nordic Semiconductor’s nRF52840 Bluetooth Low Energy (Bluetooth LE) advanced multiprotocol System-on-Chip (SoC).

Intel Announces New Development Kit for Far-Field Alexa-Enabled Products

November 2, 2017 by audioXpress Staff

Intel Announces New Development Kit for Far-Field Alexa-Enabled Products

Intel has announced the Intel Speech Enabling Developer Kit, designed for manufacturers and developers to quickly bring new Alexa-enabled products to market. This kit is the first audio front end solution that combines far-field voice processing and "Alexa" wake word detection on a single chip. It is based on a new digital signal processor (DSP) architecture from Intel that enables high-quality voice capture in acoustically challenging environments.

New Synaptics and NXP Alexa Development Kit Available at Arrow Electronics

November 1, 2017 by audioXpress Staff

New Synaptics and NXP Alexa Development Kit Available at Arrow Electronics

NXP has teamed up with Arrow Electronics, Synaptics and Amazon to develop the Synaptics AudioSmart 2-Mic and NXP Pico i.MX7Dual Development Kit for Amazon Alexa Voice Service (AVS). This newly available development kit is one of the first to be qualified with production-ready system-on-chip (SoC), voice processor, and the AVS Device SDK. It enables device makers to quickly and cost-effectively integrate Alexa into a fully functioning prototype and then take that work into design for manufacturing and production.

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

November 1, 2017 by audioXpress Staff

TDK InvenSense MEMS Microphones Available with Synaptics AudioSmart Solution

TDK Corporation showcased a Synaptics AudioSmart solution for voice recognition, using InvenSense high performance MEMS microphones. The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with Synaptics AudioSmart Amazon Voice Services (AVS) solution. TDK also announced the worldwide availability of its SmartMotion Platform encompassing 4 unique development kits with multiple sensors.

Vesper Partners with Synaptics on Far-field Voice Interfaces for Amazon Alexa Voice Service

October 11, 2017 by audioXpress Staff

Vesper Partners with Synaptics on Far-field Voice Interfaces for Amazon Alexa Voice Service

Vesper, developer of the world’s most advanced piezoelectric acoustic sensors, announced a collaboration with Synaptics Incorporated, to improve developers’ ability to create ultra-durable, high-performance and highly stable voice interfaces for Amazon Alexa Voice Service (AVS) devices. Synaptics has selected Vesper piezoelectric MEMS microphones for its two- and four-microphone Amazon AVS development kits.

Infineon High SNR MEMS Microphones Complement Amazon AVS Far-Field Development Kit from XMOS

October 9, 2017 by audioXpress Staff

Infineon High SNR MEMS Microphones Complement Amazon AVS Far-Field Development Kit from XMOS

XMOS' VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS) for far-field applications integrates Infineon’s high SNR MEMS microphones to ensure highest performance and reliability, creating the first Amazon AVS development kit with a linear mic array for far-field applications. The 4-Mic Development Kit features crystal clear voice capturing even in noisy environments. This enables commands to be accurately captured from across the room for processing by the Alexa cloud-based speech recognition system.

XMOS Delivers Amazon Alexa Voice Service Development Kit with Linear Mic Array for Far-Field Voice Capture

October 5, 2017 by audioXpress Staff

XMOS Delivers Amazon Alexa Voice Service Development Kit with Linear Mic Array for Far-Field Voice Capture

XMOS announced its VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS). A far-field linear mic array solution available, the XMOS kit is ideal for developers who want to integrate Alexa into smart panels, kitchen appliances, and other commercial and industrial electronics. Being a leading supplier of voice and audio solutions to the consumer electronics market, XMOS can combine its unique silicon architecture and software at the interface between voice processing, biometrics and artificial intelligence.

Conexant Delivers AudioSmart Voice Solutions for Baidu’s New DuerOS AI Development Kits and Reference Designs

July 7, 2017 by audioXpress Staff

Conexant Delivers AudioSmart Voice Solutions for Baidu’s New DuerOS AI Development Kits and Reference Designs

Conexant announced a collaboration with Chinese company Baidu to release development kits and reference designs for far-field voice-enabled artificial intelligent (AI) devices running on Baidu’s DuerOS platform. The development kits and reference designs will be powered by Conexant's CX20924 4-microphone and CX20921 2-microphone voice input processing solutions. DuerOS is a conversation-based AI system that already supports access to a voice-activated digital assistant for mobile phones, TVs, speakers, and other devices.

«
1
2
3
4
5
6
7
»