All items tagged with development kit (70)

Qualcomm Announces QCC5141 Occluded Earbud Reference Design Platform to Simplify True Wireless Development

November 11, 2020 by Joao Martins

Qualcomm Announces QCC5141 Occluded Earbud Reference Design Platform to Simplify True Wireless Development

Truly wireless earbuds are growing rapidly in popularity as consumers discover everything that the Apple AirPods and Apple AirPods Pro are capable of and experiment other products, demanding similarly rich functionalities from their devices. To allow manufacturers to stay ahead of the curve by bringing innovative new features to market quickly with Bluetooth 5.2, Qualcomm made available its QCC5141 Occluded Earbud Reference Design with Qualcomm TrueWireless Mirroring and Qualcomm Hybrid ANC.

XMOS Announces All-New Software Development Kit for Artificial Intelligence Development

October 7, 2020 by audioXpress Staff

XMOS Announces All-New Software Development Kit for Artificial Intelligence Development

XMOS announced its all-new software development kit (SDK) for the artificial intelligence of things (AIoT). Designed to harness xcore.ai, the company's latest crossover processor, combining high performance AI, DSP, I/O and control in a single economical device, the new AIoT SDK makes it easier for engineers to develop connected products that can sense, think, decide and act. The XMOS SDK incorporates TensorFlowLite for Microcontroller development tools.

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

September 18, 2020 by audioXpress Staff

Microchip Launches Industry’s First SoC FPGA Development Kit Based on the RISC-V Instruction Set Architecture

The rising adoption of the free and open RISC-V Instruction Set Architecture (ISA) is driving the need for an affordable, standardized development platform that embeds RISC-V technology and leverages the diverse RISC-V ecosystem. To meet this need, Microchip Technology is offering the industry’s first RISC-V based System-on-Chip (SoC) Field-Programmable Gate Array (FPGA) development kit for its own low-power, low-cost, PolarFire SoC FPGA.

Audinate Announces Authorized Implementer Program for Dante AV Products and New Reference Design for Dante Embedded Platform

June 16, 2020 by audioXpress Staff

Audinate Announces Authorized Implementer Program for Dante AV Products and New Reference Design for Dante Embedded Platform

Audinate, the developer of the industry-leading Dante audio networking technology and now also of the Dante AV networking solution, announced a new Authorized Implementer Program for manufacturers seeking to fast-track the development of new Dante AV products. And to better support developers, Audinate launched a reference design kit for Dante Embedded Platform on the popular NXP i.MX 8M Mini QuadLite SoC which provides Dante audio-over-IP to OEMs as on-chip software.

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

April 28, 2020 by audioXpress Staff

Libre Wireless Technologies Single Chip MAVID Solution is Now Amazon AWS IoT Core Certified

Libre Wireless Technologies, the embedded wireless audio and voice/AI development platform company, announced that its MAVID low power mic-to-cloud edge computing solution expanded its unique RTOS platform to include new SDK releases. The company's flexible SDK for connected devices now features Amazon AWS IoT Core certification and leverages the responsive Free RTOS OS, combined in a scalable feature rich platform. The new development environment offers unique connectivity and libraries for manufacturers and ODMs developing on Libre Wireless's MAVID platform.

Audinate Confirms Dante AV Product Design Suite for Dante AV Available to Manufacturers

February 6, 2020 by audioXpress Staff

Audinate Confirms Dante AV Product Design Suite for Dante AV Available to Manufacturers

Audinate, the company behind the industry-leading Dante audio networking technology, announced that the new Dante AV Product Design Suite (“Dante AV PDS”), a complete development kit solution, will be shipping in Q1 2020 to manufacturers who have ordered. This will allow even more companies to develop new AV-over-IP products that employ Dante AV technology, which combines a video signal with uncompressed Dante audio.

Qualcomm Introduces New Amazon Alexa Development Kit for Affordable Smart Home Products

October 31, 2019 by audioXpress Staff

Qualcomm Introduces New Amazon Alexa Development Kit for Affordable Smart Home Products

Qualcomm Technologies, a subsidiary of Qualcomm, announced a new development kit based on the Qualcomm QCA4020 multimode SoC that is qualified by Amazon’s Alexa Voice Service (AVS) for AWS IoT Core connected devices. The new Qualcomm Home Hub 100 kit supports Alexa Voice Service using a microcontroller (MCU) and Real-Time Operating System (RTOS) with Multimode Connectivity and adds to Qualcomm's’ line up of voice enabling products including kits that can allow OEMs to easily integrate Alexa into smart speakers and hearables.

XMOS VocalFusion 2-Mic Dev Kit for Alexa Voice Service Qualified by Amazon

October 29, 2019 by audioXpress Staff

XMOS VocalFusion 2-Mic Dev Kit for Alexa Voice Service Qualified by Amazon

Amazon has qualified the VocalFusion 2-mic dev kit for Alexa Voice Services launched by XMOS for smart TVs and set-top boxes in July 2019. The qualification highlights the opportunity for manufacturers to build Amazon Alexa voice capabilities into their products more easily and cost effectively than ever before. Amazon highlights the product’s engineering innovation, enabling lower cost voice capabilities with all the performance of a 4-mic solution, and paving the way for mass market implementation of far-field applications.

Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission

October 14, 2019 by audioXpress Staff

Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission

Chirp, the pioneer of data-over-sound technology, and DSP Group, the specialist in wireless chipsets for smart-enabled devices, announced a turnkey solution leveraging embedded data-over-sound to improve user experiences with enhanced provisioning for consumer applications. The design kit combines Chirp’s ultrasonic signaling protocol for smart-enabled devices with DSP Group’s SmartVoice technology to allow connectivity between nearby devices without requiring any set up, pairing, or configuration.

Chirp Announces Data-Over-Sound on Arduino Boards

August 16, 2019 by audioXpress Staff

Chirp Announces Data-Over-Sound on Arduino Boards

Chirp, the pioneer of data-over-sound technology and Arduino, the open-source electronics platform, announced the first official integration of data-over-sound on Arduino’s range of boards. The partnership with Arduino makes it easier to rapid prototype acoustic networking, and fully support developers with a seamless software-defined solution when building projects using data-over-sound.

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