All items tagged with beamforming (91)
Audioscenic Amphi Technology High Dimensional Sound
January 22, 2025 by Marcos Simón and Adam Levenson

Audioscenic Amphi Technology High Dimensional Sound

This article describes how Audioscenic's Amphi Technology effectively enables an evolution in 3D sound and immersive reproduction through loudspeakers. Audioscenic developed a sound reproduction technology that allows for the real-time adjustment of spatial audio systems, providing an effective and natural ability to hear in three dimensions without the need for the listener to be constrained within a specific sweet spot.
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ARIA Sensing Unveils Hydrogen 3D UWB Radar System-On-Chip for 3D Detection
December 31, 2024 by Cristina Costa

ARIA Sensing Unveils Hydrogen 3D UWB Radar System-On-Chip for 3D Detection

Italian company ARIA Sensing announced the launch of Hydrogen, a groundbreaking Ultra-Wideband (UWB) Radar System-On-Chip (SoC) that sets a new benchmark as the first to offer 3D beamforming with programmable bandwidth up to 1.8GHz. The new UWB radar SoC delivers scalable 1D/2D/3D detection and unparalleled radar-waveform features, becoming an ideal device to sense presence, position, vital-signs, and gestures, with the world's highest resolution and ultra-low power consumption.
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Audioscenic Unveils Amphi Hi-D Multichannel 3D Sound Technology
December 6, 2024 by Joao Martins

Audioscenic Unveils Amphi Hi-D Multichannel 3D Sound Technology

Audioscenic announced Amphi Hi-D, a new multichannel, position-adaptive technology that takes 3D sound to a whole new level. Already recognized for its unique Amphi 2-channel, loudspeaker crosstalk cancellation technology that generates a convincing tridimensional soundfield, the UK-based audio technology innovator is now pioneering multichannel High-Dimensional 3D audio. Audioscenic will demonstrate the first implementation of Amphi Hi-D at CES 2025.
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Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads
November 7, 2024 by Cristina Costa

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

The Balletto Bluetooth MCU family was announced by Alif Semiconductor in April 2024, and the company is now sampling its development kit, the DK-B1, to enable rapid prototyping of products that require ultra-low power Bluetooth Low Energy or 802.15.4 wireless connectivity. The MCU is also the world's first BLE/Matter solution to feature a DSP engine and an NPU for efficient hardware acceleration of AI/ML workloads.
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Cirrus Logic, Audioscenic, and Zylux Reveal Laptop Design Featuring Multichannel Spatial Audio at Computex 2024
June 5, 2024 by Joao Martins

Cirrus Logic, Audioscenic, and Zylux Reveal Laptop Design Featuring Multichannel Spatial Audio at Computex 2024

During Computex 2024, Audioscenic revealed a multichannel laptop reference design built through a special collaboration with Cirrus Logic and Zylux. The reference design combines Audioscenic Amphi position-adaptive 3D sound with DSP smart amplifier technology from Cirrus Logic, and micro-transducers from Zylux. Once again, Audioscenic showcases the full potential of multichannel spatial audio to enhance audio reproduction, even under the most extreme hardware constraints.
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Microphone Array Beamforming with Optical MEMS Microphones
May 14, 2024 by Michael Tuttle and Jakob Vennerød

Microphone Array Beamforming with Optical MEMS Microphones

This article, written by the experts in optical MEMS microphones from sensiBel expands on the technologies that will undoubtedly contribute to making the next generation of hearables and advanced audio systems. As the Norwegian company enters the market with its first-generation products, the authors explain how 80dB SNR optical MEMS microphones will enhance Microphone Array Beamforming and the different types of beamforming algorithms.
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Audioscenic Announces New Head of Business Development to Drive Advancements in Spatial Technology
April 10, 2024 by audioXpress Staff

Audioscenic Announces New Head of Business Development to Drive Advancements in Spatial Technology

Audioscenic, the innovative 3D audio beamforming technology startup from the United Kingdom, announced the appointment of Angela Lee as their Head of Business Development. Lee joins the company with twelve years of experience in marketing and business development, and a speciality of immersive technology, including VR and glasses-free 3D and will help promote the unique Audioscenic spatial audio technology in new consumer electronic form factors.
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Holoplot Showcases Broader Possibilities for 3D Audio-Beamforming and Wavefield Synthesis at ISE 2024
January 31, 2024 by Joao Martins

Holoplot Showcases Broader Possibilities for 3D Audio-Beamforming and Wavefield Synthesis at ISE 2024

Berlin-based Holoplot returns to ISE 2024 to showcase its new approach to sound reinforcement to the broader global installation market. As its acclaimed X1 product series - now recognized as “the sound of Sphere” - once again takes center stage, Holoplot is also showing how the company will address small to large scale commercial audio installations and speech-focused requirement with its new, more compact X2 Matrix Array.
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Acer Unveils New 3D Monitors Using Audioscenic Amphi AI Beamforming Technology
January 9, 2024 by Joao Martins

Acer Unveils New 3D Monitors Using Audioscenic Amphi AI Beamforming Technology

Audioscenic unveiled a collaboration with Acer to integrate their patented user-adaptive 3D audio technology with the newest Acer SpatialLabs 3D 4K monitors: the SpatialLabs View Pro 27 and the Predator SpatialLabs View 27. The UK-based audio technology company enables fully immersive audio that perfectly complements the 3D viewer experience, without the need for headphones.
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Audioscenic Announces Headphone Audio Support for Amphi Suite
November 21, 2023 by Joao Martins

Audioscenic Announces Headphone Audio Support for Amphi Suite

Audioscenic, the UK-based spatial computing startup that enabled the very first consumer-focused true 3D audio speaker, announced that its Amphi software package now also supports headphone processing. The Amphi software suite integrates 3D audio beamforming technology with a wide range of consumer computing devices, and this update adds HRTF virtualization for multichannel surround content giving users the ability to also listen through headphones.
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