All items tagged with ZigBee (42)

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

September 16, 2022 by Joao Martins

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.

LG Joins Home Connectivity Alliance and Leads Matter Smart Home Interoperability Efforts

August 25, 2022 by Joao Martins

LG Joins Home Connectivity Alliance and Leads Matter Smart Home Interoperability Efforts

LG Electronics (LG) has been named to the Board of Directors of the Home Connectivity Alliance (HCA), an organization dedicated to delivering better smart home experiences through open collaboration and innovation. This latest announcement just reinforces LG's determination to bring greater interconnectivity, safety and security in all its products, as already clear from the fact that it was also named to the Board of Directors of the Connectivity Standards Alliance (CSA), focused on developing and promoting the Matter smart home standard.

The Standards We Need: Do Audio Technologies Matter in the Smart Home?

February 10, 2022 by Joao Martins

The Standards We Need: Do Audio Technologies Matter in the Smart Home?

Matter is an industry-unifying standard for the Smart Home that promises reliable, secure connectivity — a seal of approval that devices will work seamlessly together. But... Do audio technologies matter in the Smart Home? The audio industry needs to get involved in this convergence and interoperability effort. After all, we can already tell a speaker to play a song - thanks to voice recognition technology, AI, and wireless networks - but we still don’t have a transparent wireless audio standard to stream audio to speakers or headphones because basically audio remains restricted by specifications that were not written with audio in mind.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17, 2021 by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.

STMicroelectronics Accelerates Wireless Product Development with STM32 Microcontroller Ecosystem

September 17, 2021 by audioXpress Staff

STMicroelectronics Accelerates Wireless Product Development with STM32 Microcontroller Ecosystem

STMicroelectronics is easing the design of competitively priced and power-efficient wireless equipment for smart applications in buildings and infrastructure by introducing new development tools and software for STM32WB wireless microcontrollers (MCUs). The company announced that his STM32Cube ecosystem was extended to support STM32WB wireless MCUs, with new STM32CubeWB firmware, upgrades to programmer and RF test tool, and an enhanced wireless power estimator for calculating battery runtime.

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

September 6, 2021 by audioXpress Staff

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

The new BL5340 Series of Bluetooth 5.2 and 802.15.4 modules from Laird Connectivity are now available. Based on Nordic Semiconductor’s nRF5340 system-on-chip (SoC), the BL5340 Series delivers a secure, high-performance dual-core MCU wireless solution with a choice of modules - BL5340 with nRF5340, or a power amplified variant (BL5340PA with nRF5340 + nRF21540), with integrated pre-certified PCB or Trace pad antenna options, and multiple tools for advanced Bluetooth LE product development.

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

May 18, 2021 by audioXpress Staff

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

Nordic Semiconductor announced that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’.

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

April 23, 2021 by audioXpress Staff

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

Silicon Labs announced that it has entered into a definitive asset purchase agreement to sell its Infrastructure & Automotive (I&A) business to Skyworks Solutions, in order to focus on the wireless connectivity market. The $2.75 billion transaction includes Silicon Labs’ power/isolation, timing and broadcast products, intellectual property and associated employees. Silicon Labs also announced Matt Johnson has been appointed President. Tyson Tuttle will continue as CEO.

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