All items tagged with ZigBee (38)

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17, 2021 by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.

STMicroelectronics Accelerates Wireless Product Development with STM32 Microcontroller Ecosystem

September 17, 2021 by audioXpress Staff

STMicroelectronics Accelerates Wireless Product Development with STM32 Microcontroller Ecosystem

STMicroelectronics is easing the design of competitively priced and power-efficient wireless equipment for smart applications in buildings and infrastructure by introducing new development tools and software for STM32WB wireless microcontrollers (MCUs). The company announced that his STM32Cube ecosystem was extended to support STM32WB wireless MCUs, with new STM32CubeWB firmware, upgrades to programmer and RF test tool, and an enhanced wireless power estimator for calculating battery runtime.

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

September 6, 2021 by audioXpress Staff

Laird Connectivity Launches BL5340 Bluetooth 5.2 Modules for High Performance LE Audio Applications

The new BL5340 Series of Bluetooth 5.2 and 802.15.4 modules from Laird Connectivity are now available. Based on Nordic Semiconductor’s nRF5340 system-on-chip (SoC), the BL5340 Series delivers a secure, high-performance dual-core MCU wireless solution with a choice of modules - BL5340 with nRF5340, or a power amplified variant (BL5340PA with nRF5340 + nRF21540), with integrated pre-certified PCB or Trace pad antenna options, and multiple tools for advanced Bluetooth LE product development.

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

May 18, 2021 by audioXpress Staff

Toshiba Announces Smallest Bluetooth LE Module for Wearables Using Nordic’s nRF52811 SoC

Nordic Semiconductor announced that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’.

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

April 23, 2021 by audioXpress Staff

Skyworks Solutions Acquires the Infrastructure and Automotive Business of Silicon Labs

Silicon Labs announced that it has entered into a definitive asset purchase agreement to sell its Infrastructure & Automotive (I&A) business to Skyworks Solutions, in order to focus on the wireless connectivity market. The $2.75 billion transaction includes Silicon Labs’ power/isolation, timing and broadcast products, intellectual property and associated employees. Silicon Labs also announced Matt Johnson has been appointed President. Tyson Tuttle will continue as CEO.

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

Amazon Reimagines Echo Smart Speaker Family for 2020

September 29, 2020 by Joao Martins

Amazon Reimagines Echo Smart Speaker Family for 2020

Amazon.com introduced its all-new line-up of Echo devices, featuring completely new designs, enhanced audio, more powerful hardware, and experiences that make Alexa voice assistant more engaging, and helpful. Most of the new Amazon products will be available at the end of October 2020, and that includes an all-new Echo (4th Gen), now with better sound and integrated smart home hub; the new Echo Dot and Echo Dot Kids Edition featuring the new spherical designs and improved audio, and Echo Show 10, the smart speaker with screen.

New Renesas RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards

August 6, 2020 by Cristina Costa

New Renesas RYZ012 Module Provides Multi-Standard Wireless Communication Supporting Bluetooth Low Energy 5 and IEEE802.15.4 Based Standards

Renesas Electronics announced sample shipment availability of the new RYZ012 Bluetooth module targeting ultra-low power applications in connected devices. The RYZ012 is Renesas' first Bluetooth Low Energy 5 module. It integrates a 2.4 GHz RF transceiver supporting the IEEE802.15.4 multi-standard wireless protocol, Bluetooth Low Energy (LE), Bluetooth LE Mesh, and ZigBee. The RYZ012 features a power draw of only 0.4µA during deep sleep (without SRAM retention) allowing developers to extend battery life.

Qualcomm Introduces New Amazon Alexa Development Kit for Affordable Smart Home Products

October 31, 2019 by audioXpress Staff

Qualcomm Introduces New Amazon Alexa Development Kit for Affordable Smart Home Products

Qualcomm Technologies, a subsidiary of Qualcomm, announced a new development kit based on the Qualcomm QCA4020 multimode SoC that is qualified by Amazon’s Alexa Voice Service (AVS) for AWS IoT Core connected devices. The new Qualcomm Home Hub 100 kit supports Alexa Voice Service using a microcontroller (MCU) and Real-Time Operating System (RTOS) with Multimode Connectivity and adds to Qualcomm's’ line up of voice enabling products including kits that can allow OEMs to easily integrate Alexa into smart speakers and hearables.

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