All items tagged with wearables (162)

USound Introduces Next-Generation Waterproof MEMS Speakers Targeting Wearable Category

September 7, 2020 by audioXpress Staff

USound Introduces Next-Generation Waterproof MEMS Speakers Targeting Wearable Category

USound, the Austrian company pioneering MEMS audio technology, has developed its next generation of MEMS speakers, surpassing market demands with its IPX8 water submersion resistance. Directly targeting wearable and hearable devices, these next-generation MEMS speakers withstand permanent submersion in water and are ready to power more efficient, low-power earbuds. USound also reports full bandwidth reproduction from a single MEMS speaker and competitive sound pressure level with no magnetic field or heat generation.

NXP Enables Industry-First Single Controller for In-Vehicle Multi-Device Wireless Charging

August 28, 2020 by Cristina Costa

NXP Enables Industry-First Single Controller for In-Vehicle Multi-Device Wireless Charging

NXP Semiconductors announced that the first multi-device vehicle wireless charging solution driven by a single MWCT controller is now available in production vehicles. The solution charges two mobile devices simultaneously at up to 2x15 Watts using a single MWCT controller and supports all Qi wireless charging enabled phones including latest iPhone models, and products from Samsung, Huawei and others. Optional NFC is available for convenience features such as BLE/Wi-Fi pairing, smart car access with NFC, in-car purchases and NFC card damage protection.

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

August 6, 2020 by audioXpress Staff

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

TDK Corporation introduced the InvenSense ICS-40638 MEMS analog microphone, a new high-performance solution enabling clear audio capture in loud and noisy conditions, with an extended frequency response from 35 Hz to 20kHz. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

New Vesper VM3011 Piezo MEMS Microphone With Adaptive ZeroPower Listening Extends Battery in Voice-Activated Designs

July 28, 2020 by audioXpress Staff

New Vesper VM3011 Piezo MEMS Microphone With Adaptive ZeroPower Listening Extends Battery in Voice-Activated Designs

Vesper introduced its new VM3011 intelligent digital microphone featuring Adaptive ZeroPower Listening, a new power saving architecture that enables a 10x extension of battery standby life, combined with best-in-class acoustic performance. Significant to manufacturers, the VM3011 is an IP57 device, resistant to dust and moisture and doesn't require a protective mesh, which allows preserving key acoustic performance metrics such as sensitivity and SNR at the system level, ideal for voice-activated smart home designs and wearables.

AKM Develops Ultra-Low Power Intelligent System Wakeup ADC With Integrated Acoustic Activity Analyzer

July 21, 2020 by audioXpress Staff

AKM Develops Ultra-Low Power Intelligent System Wakeup ADC With Integrated Acoustic Activity Analyzer

Asahi Kasei Microdevices Corporation (AKM) has developed the AK5706, a high-performance 24-bit stereo A/D converter (ADC) with an integrated Acoustic Activity Analyzer (AAA) wakeup solution consuming only 30μA, audio buffer, and support for digital and high-SNR microphones. Designed for systems that must listen for specific types of audio activity while consuming very low power, the AK5706 is ideal for products such as speech recognition systems, as well as security and smart home devices.

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

June 29, 2020 by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

June 19, 2020 by audioXpress Staff

Nordic Unveils New Bluetooth 5.2 SoC Optimized for Compact, Two-Layer PCB Wireless Products

Nordic Semiconductor announced the nRF52805 Bluetooth 5.2 System-on-Chip (SoC), the seventh addition to its popular and proven nRF52 Series. The new nRF52805 SoC offers Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 for improved coexistence, and 2.4 GHz proprietary protocols for cost-constrained applications. This SoC is an ideal Bluetooth LE solution for high-volume, compact wireless applications.

Murata Develops Compact Multilayer Ceramic Capacitor

June 5, 2020 by audioXpress Staff

Murata Develops Compact Multilayer Ceramic Capacitor

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.

Gesture-Controlled and Edge-AI In-Ear Headphones Joint Development Effort Funded in Sweden

June 3, 2020 by Joao Martins

Gesture-Controlled and Edge-AI In-Ear Headphones Joint Development Effort Funded in Sweden

Swedish companies Acconeer, Imagimob and Flexworks decided to join forces in a project to develop gesture-controlled in-ear headphones. Using the profound expertise of the three companies, the project will be a unique combination of research in advanced radar technology, expertise in AI (deep learning) and expertise in designing and manufacturing consumer electronics products. A first working prototype is expected within the first year of the project.

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

May 28, 2020 by audioXpress Staff

Cirrus Logic Launches Advanced Haptic and Sensing IC Solutions for Richer, Immersive User Experiences

With the goal of elevating the user experience for a wide range of consumer devices, Cirrus Logic is leveraging its low-power, low-latency mixed-signal processing technology to develop an advanced product portfolio of haptic and sensing integrated circuits (ICs) that enable increased functionality and sleek buttonless designs for smartphones, PCs, wearables, gaming, virtual reality and automotive applications. Cirrus Logic’s haptic products and sophisticated haptic feedback technology enable sleeker, more robust end products with fewer mechanical controls for new responsive and immersive user experiences.

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