All items tagged with wearables (172)

CEVA to Host Online Seminar Series for Wireless Connectivity, Bluetooth LE Audio, and Voice User Interfaces

May 27, 2020 by audioXpress Staff

CEVA to Host Online Seminar Series for Wireless Connectivity, Bluetooth LE Audio, and Voice User Interfaces

CEVA, a leading licensor of cutting-edge wireless connectivity and smart sensing technologies, announced that it will host a series of online seminars in June, exploring the benefits of including smart sensing and AI at the Edge in embedded designs, and the latest IoT and 5G cellular connectivity solutions. The “CEVA Technology Virtual Seminar 2020: Spring Edition” will be held over four dates, with each educational seminar focused on the challenges and trends in a specific technology domain, and hosted by CEVA product specialists and engineering experts.

Number of Voice Assistant Devices in Use to Reach 8.4 Billion

April 29, 2020 by audioXpress Staff

Number of Voice Assistant Devices in Use to Reach 8.4 Billion

A new report from Juniper Research has found that consumers will interact with voice assistants on over 8.4 billion devices by 2024; overtaking the world’s population and growing 113% compared to the 4.2 billion voice control devices expected to be in use by year end 2020. The value chain for voice assistants and interfaces is rapidly expanding to include more and more players, and device OEMs (from smartphones, speakers and wearables to cars and fridges), system integrators, apps developers and cloud providers are all escalating efforts to provide personalized voice solutions.

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

April 7, 2020 by audioXpress Staff

Next-Generation SIMO Power Management IC from Maxim Integrated Extends Battery Life for Wearables and Hearables

Designers of compact consumer devices like hearables can now slash solution size by half and extend battery life by 20 percent with the MAX77654 single inductor, multiple output (SIMO) power management IC (PMIC) from Maxim Integrated Products. The breakthrough new SIMO technology replaces traditional power management architectures for the most demanding designs in wearables and personal audio devices, reducing BOM count by up to 40 percent, with 23 percent lower BOM cost compared to discrete solutions.

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

March 11, 2020 by audioXpress Staff

Ambiq Micro Licenses CEVA’s Bluetooth Low Energy IP for Next-Generation SPOT Platforms

CEVA announced that Ambiq Micro has licensed CEVA’s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity. CEVA’s Bluetooth low energy (BLE) IP is already powering Ambiq Micro’s Apollo3 Blue Family Wireless System-on-Chip (SoC), used in applications requiring intelligence everywhere, from wearables to animal trackers to smart home devices.

MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging

February 25, 2020 by audioXpress Staff

MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging

MagnaChip Semiconductor, a designer and manufacturer of analog and mixed-signal semiconductor products from South Korea, announced the company is entering the wireless earphone market with the introduction of a new MOSFET solution that helps preventing the battery in these wireless devices from overcharging. This MOSFET is designed to control excessive current flowing into wireless earphones while recharging the battery in order to protect wireless earphones from being damaged.

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

February 24, 2020 by Joao Martins

Goodix Licenses and Deploys CEVA Bluetooth Low Energy IP in SoCs Targeting Connected Devices

CEVA announced that Goodix Technology has licensed and deployed CEVA’s RivieraWaves Bluetooth low energy IP in its GR551x series of Bluetooth low energy System-on-Chip (SoCs). The GR551x series is designed to help users develop low-power Bluetooth-based products including smart mobile devices, wearables, and connected applications. Goodix just acquired NXP’s Voice and Audio Solutions (VAS) business.

New Single Contact Charging and Communication Solution for True Wireless Earbuds from Maxim

February 5, 2020 by audioXpress Staff

New Single Contact Charging and Communication Solution for True Wireless Earbuds from Maxim

Designers of ultra-low-power portables and wearables can shrink the size of a power and communication interface to the charging dock by up to 80 percent with the new MAX20340, the industry’s smallest 2-pin bi-directional DC powerline communications (PLC) device from Maxim Integrated Products. Each MAX20340 PLC IC is only 1.84mm2 and does not require any large external components such as inductors, while hosting communication and power over the same line reduces potential points of failure and cost.

MWC Barcelona 2020 Cancelled!

January 20, 2020 by audioXpress Staff

MWC Barcelona 2020 Cancelled!

The 2020 edition of the Mobile World Congress (MWC) will take place again in Barcelona, even with all the political instability in the region, with no Uber service, and with all the geo-political pressures against the Chinese telecom giant Huawei, which is a major sponsor of the event. Indifferent to all this, MWC Barcelona 2020 will once again allow a unique perspective on the future of advanced audio applications, smart speakers, voice recognition and, obviously, true wireless earbuds.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

ON Semiconductor to Demonstrate Advanced Audio Processing at CES 2020

December 18, 2019 by Cristina Costa

ON Semiconductor to Demonstrate Advanced Audio Processing at CES 2020

ON Semiconductor will showcase a wide range of innovative technologies for smart home, connected buildings and personal connected devices at CES 2020. Powering portable voice-controlled applications will be the latest LC823455 ultra-low-power audio processor, supporting high-resolution audio processing. This highly integrated SoC, featuring an Arm Cortex−M3 Dual Core CPU and proprietary 32−bit DSP Core (LPDSP32) wit support for high−resolution 32−bit/192kHz audio.

«
1
2
...
8
9
10
11
12
13
14
...
17
18
»