All items tagged with wearables (175)

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.

Global Sources 2024 Hong Kong Shows With Record Number of Exhibitors and Less Visitors

November 5, 2024 by audioXpress Staff

Global Sources 2024 Hong Kong Shows With Record Number of Exhibitors and Less Visitors

The October 2024 Global Sources Hong Kong Shows at AsiaWorld-Expo have concluded after an intense month of activities. The three-phase show program, spanning multiple sectors including Consumer Electronics, Electronic Components, Smart Home, Lifestyle, Sports & Outdoor, and Baby & Children, attracted nearly 5,000 premium Asian suppliers and showcased over 500,000 innovative products, setting a new record for exhibitor participation.

Bose and Bragi Unite to Provide Brands with Turn-Key, Licensable Audio Solutions for Headphones and Earbuds

August 28, 2024 by Special Content

Bose and Bragi Unite to Provide Brands with Turn-Key, Licensable Audio Solutions for Headphones and Earbuds

Bose, a global leader in audio innovation for the home, car and on-the-go, and Bragi, the pioneer of AI headphones, have announced a partnership aimed at delivering cutting-edge, turn-key licensable audio wearable solutions – simplifying the process of building high-quality audio products for brands worldwide.

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

June 28, 2024 by Joao Martins

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

Following a very successful presence at Sensors Converge 2024 in Santa Clara, CA (June 25-26), where TDK promoted its range of MEMS microphones and sensors, the company announced worldwide distribution of its InvenSense SmartSound T5848 bottom port I²S MEMS microphone. This device is ideal to enable intelligent keyword, voice command and sound detection applications in ultra-low power designs, such has hearables and wearables. Originally announced at CES 2022, this MEMS microphone only now is available for general distribution.

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

June 24, 2024 by audioXpress Staff

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

Ceva, a leading licensor of silicon and software IP that enables edge devices to connect, sense and infer data more reliably and efficiently, announced that it has extended its Ceva-NeuPro family of NPUs. These meet growing demand for efficient and specialized AI applications at the Edge, where power and processing power is often limited, particularly in consumer products such as TWS earbuds, wearables, smart speakers, smart appliances, home automation devices, cameras, and more.

TDK Introduces Ultra-Thin Noise Suppression Permalloy Sheets

May 21, 2024 by Joao Martins

TDK Introduces Ultra-Thin Noise Suppression Permalloy Sheets

TDK Corporation extended its Flexield family of permalloy thin film sheets with the new IPM01 series, which features high-permeability and high loss in a lightweight and 0.006 mm ultra-thin design. This new material made possible due to TDK's proprietary manufacturing method, effectively shields lower-frequency band noise, which is becoming a growing issue in electric vehicles (EVs). Mass production of the product began May 2024.

World's First UWB Personal Wireless Audio Platform Features AntennaWare Technology

May 10, 2024 by Joao Martins

World's First UWB Personal Wireless Audio Platform Features AntennaWare Technology

Launched at High End 2024, Remora PRO is the world's first wireless audio device to deliver a reliable and robust experience for consumer and professional applications, including latency-critical uses. Based on the platform developed by Sonical with its CosmOS and “appable” software ecosystem, Remora PRO utilizes BodyWave antenna technology to make wireless Ultra Wideband (UWB) audio work flawlessly in a wearable and portable form-factor.

Goodix Technology Launches Next Generation Smart Amplifier for Mobile Applications

April 8, 2024 by audioXpress Staff

Goodix Technology Launches Next Generation Smart Amplifier for Mobile Applications

Goodix Technology launched a new generation smart amplifier targeting mobile audio designs. The new TFA9865 device leverages a proprietary, fully digital architecture and advanced manufacturing processes to improve audio performance. With extremely compact dimensions of just 2.2x2.2mm², the TFA9865 audio amplifier establishes a benchmark for the audio industry, offering higher power efficiency, and enhanced sound volume with reduced noise.

Sonical and Sigma Connectivity Accelerate Hearables Product Development

April 2, 2024 by Joao Martins

Sonical and Sigma Connectivity Accelerate Hearables Product Development

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps has confirmed a development partnership with Sigma Connectivity, the leading Swedish technology design and engineering house. Sigma will help Sonical accelerate the market transition to Headphone 3.0 and the adoption of user driven wearable audio devices.

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