All items tagged with ultra-low power (47)

ZenVoice Bone Algorithm Delivers Superior Voice Clarity in Noisy Environments with Bosch Sensortec's Advanced BMA550 Bone Conduction Sensor

July 15, 2024 by Joao Martins

ZenVoice Bone Algorithm Delivers Superior Voice Clarity in Noisy Environments with Bosch Sensortec's Advanced BMA550 Bone Conduction Sensor

Aizip and Bosch Sensortec jointly received the 2024 Best of Sensors Award at the Sensors Converge Conference and Expo (June 24-26) for a noise reduction solution in hearables devices. The award recognized the fact that Aizip's ZenVoice Bone algorithm, coupled with Bosch Sensortec's latest BMA550 bone conduction sensor, delivers advanced noise reduction in true wireless stereo (TWS) earbuds. This collaboration leverages Aizip's advanced neural network architecture to deliver a new level of speech intelligibility.

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

June 28, 2024 by Joao Martins

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

Following a very successful presence at Sensors Converge 2024 in Santa Clara, CA (June 25-26), where TDK promoted its range of MEMS microphones and sensors, the company announced worldwide distribution of its InvenSense SmartSound T5848 bottom port I²S MEMS microphone. This device is ideal to enable intelligent keyword, voice command and sound detection applications in ultra-low power designs, such has hearables and wearables. Originally announced at CES 2022, this MEMS microphone only now is available for general distribution.

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

April 22, 2024 by Cristina Costa

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

Silicon Labs has announced its most energy-efficient Wireless SoC to date with energy harvesting-ready capabilities. To signal Earth Day 2024, Silicon Labs launched its new xG22E family of Wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E, with "E" standing for "energy conservation."

Qualcomm Unveils FastConnect 7900 Single Chip Wi-Fi, Bluetooth, and UWB

February 29, 2024 by Joao Martins

Qualcomm Unveils FastConnect 7900 Single Chip Wi-Fi, Bluetooth, and UWB

“Find My” type solutions will be available on more Android devices thanks to Qualcomm Technologies’ first single chip solution to integrate Wi-Fi 7, Bluetooth 5.4, and Ultra Wideband (UWB) technologies, enabling seamless proximity experiences such as digital key, object finding and indoor navigation. But FastConnect 7900 is also ready to power new audio, low-power product designs using Bluetooth LE Audio, Qualcomm’s XPAND (Wi-Fi, BLE convergence) and AI-enabled processing.

AKM Reveals Low-Power ADC Device With Acoustic Activity Sensor

February 7, 2024 by Joao Martins

AKM Reveals Low-Power ADC Device With Acoustic Activity Sensor

Asahi Kasei Microdevices Corporation (AKM) has developed the AK5707, a low-power monaural 16-bit A/D converter (ADC) equipped with an Acoustic Activity Analyzer (AAA) and Audio Buffer for detection of specific sounds. The new compact ADC is useful for smart sensors that are able to detect glass breaking sounds or emergency alarms in multiple applications. The acoustic activity detect feature works at only 34μA, ideal for wearables.

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

February 5, 2024 by Joao Martins

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

December 19, 2023 by Joao Martins

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.

AONDevices Introduces Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement

October 16, 2023 by Joao Martins

AONDevices Introduces Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement

AONDevices, the AI processing company from Irvine, California, announced AONDenoise, a compact, efficient edge AI denoising solution that enable customizable noise cancellation running in real-time, completely on-device. Designed for applications that require minimal power and latency, AONDenoise is one of the smallest denoising algorithms available, making it an ideal AI speech enhancement for use in hearing aids, wireless earbuds, and wearables.

GlobalScale Launches Energy Harvesting Bluetooth LE 5.3 Module with SoC from Atmosic Technologies

October 12, 2023 by Cristina Costa

GlobalScale Launches Energy Harvesting Bluetooth LE 5.3 Module with SoC from Atmosic Technologies

GlobalScale has once again partnered with Atmosic Technologies, an innovator in extreme-low-power wireless communication platforms, to create a new Bluetooth 5.3 module with integrated energy harvesting capabilities. The new module leverages Atmosic's energy harvesting technology, enabling developers to create battery-free applications, including sensors, electronic shelf labels, and connected devices. GlobalScale has chosen the ATM3330e, which is part of Atmosic's ATM33/e series of SoCs, as the core silicon used in the newest member of the RistrettoBin family of Bluetooth LE modules.

Infineon Acquires Ultra-Wideband Startup with Plans to Strengthen its Streaming Connectivity Portfolio

October 6, 2023 by Joao Martins

Infineon Acquires Ultra-Wideband Startup with Plans to Strengthen its Streaming Connectivity Portfolio

Infineon Technologies has acquired Zurich-based startup 3db Access AG (3db), a pioneer in secured low power Ultra-Wideband (UWB) technology and already today a preferred IP provider for major automotive brands. The German semiconductor giant had experience working with 3db and decided to fully acquire the company to fully explore the possibilities of UWB technology, including low-power audio streaming applications.

«
1
2
3
4
5
»