All items tagged with ultra-low power (39)

GlobalScale Launches Energy Harvesting Bluetooth LE 5.3 Module with SoC from Atmosic Technologies

October 12, 2023 by Cristina Costa

GlobalScale Launches Energy Harvesting Bluetooth LE 5.3 Module with SoC from Atmosic Technologies

GlobalScale has once again partnered with Atmosic Technologies, an innovator in extreme-low-power wireless communication platforms, to create a new Bluetooth 5.3 module with integrated energy harvesting capabilities. The new module leverages Atmosic's energy harvesting technology, enabling developers to create battery-free applications, including sensors, electronic shelf labels, and connected devices. GlobalScale has chosen the ATM3330e, which is part of Atmosic's ATM33/e series of SoCs, as the core silicon used in the newest member of the RistrettoBin family of Bluetooth LE modules.

Infineon Acquires Ultra-Wideband Startup with Plans to Strengthen its Streaming Connectivity Portfolio

October 6, 2023 by Joao Martins

Infineon Acquires Ultra-Wideband Startup with Plans to Strengthen its Streaming Connectivity Portfolio

Infineon Technologies has acquired Zurich-based startup 3db Access AG (3db), a pioneer in secured low power Ultra-Wideband (UWB) technology and already today a preferred IP provider for major automotive brands. The German semiconductor giant had experience working with 3db and decided to fully acquire the company to fully explore the possibilities of UWB technology, including low-power audio streaming applications.

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

June 27, 2023 by audioXpress Staff

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection.

SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development

March 13, 2023 by Joao Martins

SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development

SPARK Microsystems announced the closing of CDN $34 million Series B financing, with an additional CDN $14 million available subject to meeting operational milestones. Led by Idealist Capital, a prominent investment firm focused on the energy transition and decarbonization, the round includes existing investors Cycle Capital, Economic Development Canada (EDC), Real Ventures, and ND Capital. The new funding will drive mass market commercialization for ultra-energy efficient, UWB-based wireless electronic devices and sensors.

GreenWaves Ramps Up Production of GAP9 Hearables Platform

March 9, 2023 by Joao Martins

GreenWaves Ramps Up Production of GAP9 Hearables Platform

GreenWaves Technologies, a fabless semiconductor company based in Grenoble, France, has received the funding needed to support the production of its second-generation GAP9 processor. As demonstrated at CES 2023, this advanced AI processor revolutionizes the next generation of true wireless earbuds, hearables, and connected devices with ultra-low latency noise cancellation, neural network-based background elimination and 3D sound.

Infineon Announces AIROC CYW43022 Wi-Fi 5 and Bluetooth Combo for Low Power Designs

March 6, 2023 by Cristina Costa

Infineon Announces AIROC CYW43022 Wi-Fi 5 and Bluetooth Combo for Low Power Designs

Infineon Technologies announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth 5.3 combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products. The CYW43022 ultra-low power architecture delivers industry-leading performance, with up to a 65 percent reduction in power usage during "deep sleep," significantly extending battery life for applications in connected smart home devices and wearables.

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

February 14, 2023 by Joao Martins

Syntiant Launches NDP115 Neural Decision Processor for Always-On Speech and Sensor-Fusion

It was one of the key audio-related demonstrations at the Syntiant suite during CES 2023, and the new NDP115 Neural Decision Processor is now positioned as a key strategic platform for new compact, ultra-low-power designs with always-on voice and sensor fusion applications. The newest addition to Syntiant's family of special purpose silicon is built using the company’s Syntiant Core 2 inference engine that can run multiple neural network loads at under 1mW.

Exeger and E-Peas Partner to Create Energy Harvesting Solutions for Connected Devices

December 21, 2022 by audioXpress Staff

Exeger and E-Peas Partner to Create Energy Harvesting Solutions for Connected Devices

Exeger, the Swedish company behind the revolutionary solar cell technology Powerfoyle, announced a partnership with Belgium-based Ultra Low Power Management semiconductor company e-peas. Experts in ultra-low power, high efficiency Power Management Integrated Circuits (PMICs) for energy harvesting, e-peas' Ambient Energy Manager (AEM) products portfolio, combined with the complete Energy Harvesting ecosystem provide clear benefits to many industry segments such as consumer electronics.

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

November 15, 2022 by audioXpress Staff

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

CEVA announced the availability of its WhisPro speech recognition and control software to support designs using the Texas Instruments (TI) SimpleLink Wi-Fi CC3235x wireless MCU family, bringing ultra-low power, robust voice user interface to connected devices. The WhisPro Software Development Kit (SDK) allows full project customization, including choice of wake words and voice commands, and runs entirely on-device, without the need for a network connection.

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

November 9, 2022 by audioXpress Staff

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

MediaTek launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe. Most importantly for the audio industry, this new solution will bring Bluetooth LE Audio support to many smartphones in 2023.

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