All items tagged with ultra-low power (40)

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

November 9, 2022 by audioXpress Staff

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

MediaTek launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe. Most importantly for the audio industry, this new solution will bring Bluetooth LE Audio support to many smartphones in 2023.

NGK Showcases Ultra-Thin EnerCera Batteries for Connected Devices and Powerfoyle-Based Position Tracker at electronica 2022

November 9, 2022 by Joao Martins

NGK Showcases Ultra-Thin EnerCera Batteries for Connected Devices and Powerfoyle-Based Position Tracker at electronica 2022

NGK Insulators will participate in electronica 2022 from November 15-18, in Munich, Germany for the first time. The Japanese multinational will use the opportunity to showcase its latest solar powered indoor/outdoor position tracker using Exeger's Powerfoyle technology, together with its latest EnerCera thin and flexible ceramic batteries, ideal for wearable and small connected devices, including headphones and portable audio applications.

USound New High-Performing ASIC Linear Audio Amplifier Boosts the Battery Life of TWS and Hearing Aids

October 24, 2022 by Joao Martins

USound New High-Performing ASIC Linear Audio Amplifier Boosts the Battery Life of TWS and Hearing Aids

Austrian MEMS speaker pioneer USound continues to pursue the integration of its patented drivers in solutions that are ready for manufacturers to use. Following the release of a complete audio module for true wireless earbuds and hearing aids, the company now announced the launch of a new ASIC linear audio amplifier, Tarvos 1.0 UC-P3010, purposely designed to drive USound MEMS speakers. This new audio amplifier also boosts the battery life, meeting or exceeding current market requirements.

Exeger and Atmosic Technologies Partner to Create Energy Harvesting Solutions

September 12, 2022 by Joao Martins

Exeger and Atmosic Technologies Partner to Create Energy Harvesting Solutions

Exeger, the innovative Swedish company that created a unique solar cell flexible membrane that converts all forms of light into electrical energy continues to establish strategic partnerships and expand its proof-of-concept use cases. Exeger and US-based semiconductor company Atmosic Technologies are now working together to create attractive energy harvesting solutions for connected devices. Meanwhile, Exeger attended the IBC show in Amsterdam, to demonstrate a new TV remote control from Omni Remotes that will remain perpetually charged.

NFC Forum Defines Card Emulation Device Class Specification for Low-Cost Wearable Solutions

September 6, 2022 by Joao Martins

NFC Forum Defines Card Emulation Device Class Specification for Low-Cost Wearable Solutions

The NFC Forum unveiled a new NFC Device Class specification that provides device manufacturers and OEMs with a miniature, low-cost, sustainable solution for wireless wearable devices. The Card Emulation (CE) Device class is the first of its kind answering an industry need for wearable devices that provide basic functionality and longer battery life in a tiny footprint while maintaining interoperability with the current NFC ecosystem.

Bose to Launch New Wireless Earbuds Powered by Qualcomm S5 Audio SoC

September 2, 2022 by Joao Martins

Bose to Launch New Wireless Earbuds Powered by Qualcomm S5 Audio SoC

At IFA 2022 in Berlin, Qualcomm Technologies and Bose highlighted their continued collaboration during Cristiano Amon’s opening keynote. Bose is integrating Qualcomm wireless voice and music platforms across their portfolio of premium earbuds, headphones, speakers and soundbars. Qualcomm also confirmed that the new Bose QuietComfort Earbuds II, which are scheduled to be unveiled September 7, will be Powered by the new Qualcomm S5 Sound Platform.

August 30, 2022 by Joao Martins

Exeger Establishes Partnerships to Improve Efficiency of Its Powerfoyle Energy-Harvesting Technology

Exeger, the innovative Swedish technology company behind the revolutionary solar cell technology Powerfoyle, announced its partnership with Switzerland-based semiconductor manufacturer EM Microelectronic to develop boost-converter solutions that can expand the efficiency of energy-harvesting applications. In early 2022, Exeger had already announced a partnership with NGK to use EnerCera thin and flexible batteries combined with Powerfoyle technology.

Nordic Semiconductor Announces Its First Wi-Fi Chip

August 19, 2022 by Cristina Costa

Nordic Semiconductor Announces Its First Wi-Fi Chip

Following the acquisition of the Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group in 2020, Nordic Semiconductor announced its entry into the Wi-Fi wireless market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC. The launch enables Nordic Semiconductor to offer all three of the world’s most popular wireless connectivity technologies: Bluetooth, Wi-Fi, and cellular, paving the way for new market opportunities.

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

July 21, 2022 by Cristina Costa

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

Dolphin Design, an advanced chip design company and leading specialist in Edge Computing and AI platforms, and Big Fish Semiconductor have entered into a long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership. The high-performance recording capabilities of the U2 BLE 5.2 Audio AI SoC are made possible by Dolphin Design's 24-bit delta-sigma audio ADC, which combines superior audio performance, small area and ultra-low power consumption.

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

June 22, 2022 by audioXpress Staff

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of typical competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is priced to start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.

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