All items tagged with ultra-low power (40)

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

February 25, 2022 by audioXpress Staff

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

Renesas Electronics announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth Low Energy (LE) low-power, near-field communication standard. The new technologies also achieve a smaller mounting area and better power efficiency. Renesas presented these technologies at International Solid-State Circuits Conference 2022 (ISSCC 2022), held between February 20 and 24 in San Francisco.

TDK Expands SmartSound Family of Performance MEMS Microphones and Introduces New MEMS Microphone with SoundWire at CES 2022

January 11, 2022 by audioXpress Staff

TDK Expands SmartSound Family of Performance MEMS Microphones and Introduces New MEMS Microphone with SoundWire at CES 2022

TDK introduced new digital MEMS microphones as part of its SmartSound family of products for mobile, TWS, and other consumer devices, providing advanced feature sets in small package footprints. The T5848 offers the highest dynamic range with I2S direct audio connectivity to a wide variety of SoCs, MCUs and IoT processors. And TDK also introduced the T5828 MEMS microphone with MIPI SoundWire functionality, adding 68dBA SNR and Acoustic Activity Detect features with always-on ultra-low power mode.

Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications

January 7, 2022 by Joao Martins

Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications

Syntiant, the company focused on making edge AI a reality for always-on applications, announced a new reference design that will enable ODMs and OEMs to easily and quickly deploy ultra-low-power, edge AI voice processing applications in true wireless earbuds. The solution enables multi-lingual custom wake words and speech commands, supported by data training and modeling, providing a complete, end-to-end solution for edge AI processing.

Sounds Great Unveils Motion Microchip and Semiconductor Dynamic Speakers at CES 2022

January 4, 2022 by Joao Martins

Sounds Great Unveils Motion Microchip and Semiconductor Dynamic Speakers at CES 2022

Taiwan-based semiconductor design house Sounds Great is unveiling prototypes of its Motion Microchip and Semiconductor Dynamic Speaker (SDS) solutions at CES 2022 in Las Vegas. The company's technology is the smallest speaker solution of its type, and will be presented as a 1.5x1.5mm single driver or an SDS array, enabling applications from earphones to stereo reproduction in consumer devices. In its second year at CES, the company shows a promising speaker concept with large potential for ultra low-power designs.

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

CEVA Expands Wireless Connectivity Options for Developers with New RivieraWaves UWB Platform

June 24, 2021 by audioXpress Staff

CEVA Expands Wireless Connectivity Options for Developers with New RivieraWaves UWB Platform

CEVA unveiled its new ultra-low power RivieraWaves UWB platform IP targeting mobile, automotive, consumer and IoT applications, lowering the entry barriers for companies to include UWB in their chip designs. With this new solutions, developers are able to benefit from CEVA's combined IP offering of Bluetooth and UWB technologies for new use cases in emerging high-volume applications.

Nordic Launches Apple Find My Network Compatible Software Development Kit

May 27, 2021 by audioXpress Staff

Nordic Launches Apple Find My Network Compatible Software Development Kit

Nordic Semiconductor announced the availability of its Apple Find My network compatible Software Development Kit (SDK). The SDK enables manufacturers and brands to easily build Find My network capable Bluetooth Low Energy (Bluetooth LE) devices that maximize battery performance leveraging Nordic’s nRF52 or nRF53 Series System-on-Chip's (SoC) ultra-low power consumption.

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

Renesas Combines Cyberon Algorithm in New Voice Recognition and Smart Control Reference Design

December 30, 2020 by audioXpress Staff

Renesas Combines Cyberon Algorithm in New Voice Recognition and Smart Control Reference Design

Renesas has announced a new reference design and combined solution for the development of voice recognition applications. The company offers an offline voice recognition algorithm that performs real time control, the Cyberon CSpotter, in a reference design that incorporates a low cost, ultra-low power RA6M1 MCU, a ISL32743E isolated high-speed RS-485 transceiver, an ISL80505 high-performance 0.5A LDO and a PS2561F-1 optically coupled UL approved isolator.

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