Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.
This dedicated 12nm test-chip reaffirms Dolphin Design's ambitions to lead in mixed signal IPs, inspiring confidence to audio manufacturers by accelerating time-to-market. According to the French semiconductor IP specialist, the optimized silicon footprint is able to deliver superior sound quality and functionality for battery powered applications, delivering best-in-class performance, and ensuring robust product designs.
Creating a dedicated test-chip is a crucial step in asserting the company position as a leader in power management and audio IPs to continually improve performance and quality. Dolphin Design continues to increase its level of expertise in advanced processes used by its customers, as this was done for TSMC 22 uLL and GF 22 FDX. Characterizing and mastering a process enables Dolphin Design to deliver the best performance when designing a new IP or doing a migration.
The insights gained from this test chip development play a pivotal role in matching the company’s aggressive performance roadmap. It can ensure that the company IPs continue to evolve and meet the ever-increasing demands in performance and low power.
This new test chip in 12nm embeds four top-of-the-line low-power audio ADCs, designed to drastically reduce the power consumption as expected in true wireless stereo (TWS) and voice-controlled devices. The new chip also features Dolphin Design's class-D headphone DAC tailored to offer ultra-low power capabilities, low latency, and high THD+N, specifically targeting TWS earbuds where power efficiency is critical. Finally, the test chip embeds an ultra-compact digital PWM DAC to drive speaker amplifiers.
"Dolphin Design is relentlessly pursuing innovation and is now at the forefront of industry-leading technologies. With its new set of IPs, Dolphin Design is positioned as the preferred choice for low-consumption, high-performance audio IPs. This achievement underlines our commitment to delivering groundbreaking solutions to our customers and reinforces our dedication to continuous innovation in semiconductor IPs," says Hakim Jaafar, VP of Marketing at Dolphin Design.
Dolphin Design specializes in ASIC and IP design and is a subsidiary of Soitec, a large manufacturer of semiconductor materials listed in the Euronext Paris. Dolphin Design develops cutting-edge technologies for AI computing, power management, and high-quality audio, among other applications.
www.dolphin-design.fr
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Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices
February 5 2024, 02:10
Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.
About Joao Martins
Since 2013, Joao Martins leads audioXpress as editor-in-chief of the US-based magazine and website, the leading audio electronics, audio product development and design publication, working also as international editor for Voice Coil, the leading periodical for... Read more