All items tagged with ultra-low power (40)

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

November 13, 2024 by Joao Martins

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

InnoPhase IoT, a semiconductor company specializing in ultra-low power Wi-Fi, and GreenWaves Technologies, the company pioneering ultra-low power AI and DSP processors for hearables and connected devices, announced the development of a lossless audio reference design for Wi-Fi headphones. In collaboration with Danish pioneer IDUN Audio, InnoPhase and GreenWaves have created a platform that enables Spatial Audio for hearables and headphones with extended range and long battery life.

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

ZenVoice Bone Algorithm Delivers Superior Voice Clarity in Noisy Environments with Bosch Sensortec's Advanced BMA550 Bone Conduction Sensor

July 15, 2024 by Joao Martins

ZenVoice Bone Algorithm Delivers Superior Voice Clarity in Noisy Environments with Bosch Sensortec's Advanced BMA550 Bone Conduction Sensor

Aizip and Bosch Sensortec jointly received the 2024 Best of Sensors Award at the Sensors Converge Conference and Expo (June 24-26) for a noise reduction solution in hearables devices. The award recognized the fact that Aizip's ZenVoice Bone algorithm, coupled with Bosch Sensortec's latest BMA550 bone conduction sensor, delivers advanced noise reduction in true wireless stereo (TWS) earbuds. This collaboration leverages Aizip's advanced neural network architecture to deliver a new level of speech intelligibility.

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

June 28, 2024 by Joao Martins

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

Following a very successful presence at Sensors Converge 2024 in Santa Clara, CA (June 25-26), where TDK promoted its range of MEMS microphones and sensors, the company announced worldwide distribution of its InvenSense SmartSound T5848 bottom port I²S MEMS microphone. This device is ideal to enable intelligent keyword, voice command and sound detection applications in ultra-low power designs, such has hearables and wearables. Originally announced at CES 2022, this MEMS microphone only now is available for general distribution.

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

April 22, 2024 by Cristina Costa

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

Silicon Labs has announced its most energy-efficient Wireless SoC to date with energy harvesting-ready capabilities. To signal Earth Day 2024, Silicon Labs launched its new xG22E family of Wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E, with "E" standing for "energy conservation."

Qualcomm Unveils FastConnect 7900 Single Chip Wi-Fi, Bluetooth, and UWB

February 29, 2024 by Joao Martins

Qualcomm Unveils FastConnect 7900 Single Chip Wi-Fi, Bluetooth, and UWB

“Find My” type solutions will be available on more Android devices thanks to Qualcomm Technologies’ first single chip solution to integrate Wi-Fi 7, Bluetooth 5.4, and Ultra Wideband (UWB) technologies, enabling seamless proximity experiences such as digital key, object finding and indoor navigation. But FastConnect 7900 is also ready to power new audio, low-power product designs using Bluetooth LE Audio, Qualcomm’s XPAND (Wi-Fi, BLE convergence) and AI-enabled processing.

AKM Reveals Low-Power ADC Device With Acoustic Activity Sensor

February 7, 2024 by Joao Martins

AKM Reveals Low-Power ADC Device With Acoustic Activity Sensor

Asahi Kasei Microdevices Corporation (AKM) has developed the AK5707, a low-power monaural 16-bit A/D converter (ADC) equipped with an Acoustic Activity Analyzer (AAA) and Audio Buffer for detection of specific sounds. The new compact ADC is useful for smart sensors that are able to detect glass breaking sounds or emergency alarms in multiple applications. The acoustic activity detect feature works at only 34μA, ideal for wearables.

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

February 5, 2024 by Joao Martins

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

December 19, 2023 by Joao Martins

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.

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