All items tagged with MediaTek (24)

MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences

January 9, 2025 by Joao Martins

MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences

Ceva and MediaTek announced a partnership to enhance the mobile entertainment experience, bringing the Ceva-RealSpace Elevate multichannel spatial audio with head tracking solution to the recently introduced MediaTek Dimensity 9400 flagship 5G smartphone chip using Bluetooth LE Audio. At CES 2025, Ceva demonstrated impressive spatial audio examples, creating a true-to-life listening experience beyond traditional stereo and surround sound systems on True Wireless Stereo (TWS) earbuds and headphones.

Airoha Technology Launches Flagship Wireless AI Audio SoC

December 30, 2024 by Joao Martins

Airoha Technology Launches Flagship Wireless AI Audio SoC

Airoha Technology announced the launch of a new flagship wireless audio chip with integrated AI processing. The AB1595 chip integrates essential functions that currently require multiple chips into one single system-on-chip (SoC). The announcement follows a recent press conference where the MediaTek subsidiary confirmed its intention to lead the market as a Bluetooth audio supplier and to outgrow the industry with AI-powered solutions in 2025.

January 11, 2024 by Joao Martins

Wi-Fi Alliance Introduces Wi-Fi Certified 7

To complicate an extremely busy week in technology news, the Wi-Fi Alliance decided to announce the release of its certification for Wi-Fi 7, which is the closest thing the organization offers as its official release. Although already implemented in a large number of products by many manufacturers, Wi-Fi 7 - or IEEE 802.11be - didn't exactly exist until this announcement. And this is a big one for wireless audio, bringing greater capacity, and less latency.

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

December 6, 2023 by Joao Martins

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

Airoha Technology, a subsidiary of Mediatek and one of the world's top designers of Bluetooth audio ICs, announced a collaboration with Intel and Engineered for Intel Evo laptop accessory program, which is the first of its kind to fully embrace Bluetooth LE Audio support. Airoha will supply its SoCs and Software Development Kit (SDK) to support development of new Bluetooth LE Audio devices.

MediaTek’s Chairman Ming-Kai Tsai Awarded IEEE Robert N. Noyce Medal

November 29, 2023 by audioXpress Staff

MediaTek’s Chairman Ming-Kai Tsai Awarded IEEE Robert N. Noyce Medal

MediaTek announced that its chairman Ming-Kai Tsai has been awarded the IEEE Robert N. Noyce Medal, one of the most prestigious awards in the electronics industry. Chairman Tsai was recognized for his vision and leadership in the global semiconductor industry, democratizing technology access for billions of people. The award will be presented to Tsai in-person at the IEEE Honors Ceremony, which will be held May 3, 2024 in Boston.

MediaTek Expands Wi-Fi and Bluetooth 5.4 Portfolio with New Chipsets for Mainstream Devices

November 21, 2023 by audioXpress Staff

MediaTek Expands Wi-Fi and Bluetooth 5.4 Portfolio with New Chipsets for Mainstream Devices

MediaTek, one of the first adopters of the upcoming Wi-Fi 7 technology, now has the industry's most comprehensive Wi-Fi 7 portfolio with the introduction of the latest Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek's platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.

Creative Technology Launches LE Audio Ready Wireless Headphones

September 13, 2023 by Joao Martins

Creative Technology Launches LE Audio Ready Wireless Headphones

Creative Technology released its all-new range of Creative Zen Hybrid Pro wireless headphones and their accompanying bundles, the Creative Zen Hybrid Pro Classic and Creative Zen Hybrid Pro SXFI. Equipped with nifty features such as Hybrid Active Noise Cancellation (ANC) and Ambient Mode, a powerful 40mm Neodymium driver, and an impressive battery life of up to 100 hours, these latest headphones are also Bluetooth LE Audio Ready, thanks to the latest Airoha LE Audio (Mediatek) platform.

MediaTek Enhances On-Device Generative AI Processing

August 28, 2023 by Cristina Costa

MediaTek Enhances On-Device Generative AI Processing

MediaTek is already powering more than two billion connected edge devices every year and now the company confirmed that it is working closely with Meta's Llama 2 next-generation open-source Large Language Model (LLM). Combining this recently announced LLM with its latest APUs and NeuroPilot AI Platform, MediaTek aims to build a complete edge computing ecosystem designed to accelerate AI application development on smartphones, consumer connected devices, vehicles, smart home, etc.

MediaTek Partners With NVIDIA to Provide Platform Roadmap to the Automotive Industry

May 29, 2023 by Cristina Costa

MediaTek Partners With NVIDIA to Provide Platform Roadmap to the Automotive Industry

MediaTek announced a partnership with NVIDIA to deliver a complete range of in-vehicle computing and advanced AI cabin solutions for the next generation of software-defined vehicles. The collaboration combines the strength of each company's automotive portfolios to deliver solutions for state-of-the-art connected cars integrating NVIDIA GPU chiplets into the MediaTek Dimensity Auto platform.

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

January 23, 2023 by audioXpress Staff

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

Fluent.ai announced an embedded voice recognition solution for True Wireless Stereo (TWS) and other hearable products running on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary. The solution is part of an integration available on DSP Concepts’ Audio Weaver platform, which provides OEMs a rapid way to design and prototype audio features and capabilities.

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