All items tagged with MediaTek (29)

LG and MediaTek Showcase Android-Based Concurrent Multi-User Framework Mobility Solution at Auto Shanghai 2025

April 29, 2025 by Joao Martins

LG and MediaTek Showcase Android-Based Concurrent Multi-User Framework Mobility Solution at Auto Shanghai 2025

LG Electronics (LG) and MediaTek showcased their Android-based Concurrent Multi-User (CMU) framework applied to In-Vehicle Infotainment (IVI) systems at the Auto Shanghai 2025 show, one of Asia's largest and most influential automotive exhibitions. The CMU framework is the first of its kind to be implemented on Google's Android Automotive OS (AAOS), and enables passengers to simultaneously use multiple displays on a single Android OS.

Dirac and MediaTek Partner to Advance In-Car Audio Experiences Through Integrated Automotive SoCs

April 28, 2025 by Joao Martins

Dirac and MediaTek Partner to Advance In-Car Audio Experiences Through Integrated Automotive SoCs

Dirac and MediaTek announced a strategic collaboration to enhance in-car audio performance through the integration of Dirac's digital audio software into MediaTek's automotive-grade systems-on-chips (SoCs). Yes, software-defined vehicles benefit from a tighter integration at the chipset level, and the Swedish digital audio processing pioneer is determined to explore the possibilities with MediaTek's groundbreaking Dimensity Auto Cockpit chipsets.

Arkamys Announces SoundStage Suite Integration with MediaTek's Dimensity Auto Cockpit Platform for In-Car Audio

April 28, 2025 by Joao Martins

Arkamys Announces SoundStage Suite Integration with MediaTek's Dimensity Auto Cockpit Platform for In-Car Audio

Arkamys announced the compatibility of its SoundStage Suite with MediaTek's Dimensity Auto Cockpit platform. With this integration, original equipment manufacturers (OEMs) and Tier 1 suppliers can benefit from streamlined, premium sound solutions, allowing faster launches and scalable deployment in multiple vehicle segments, without compromising on cost or increasing complexity with additional hardware for in-car audio.

Number of Automotive Brands Supporting Dolby Atmos Has Doubled at Auto Shanghai 2025

April 23, 2025 by Joao Martins

Number of Automotive Brands Supporting Dolby Atmos Has Doubled at Auto Shanghai 2025

Dolby Laboratories kicked off the 21st Shanghai International Automobile Industry Exhibition (Auto Shanghai 2025) by showcasing the next generation of in-car entertainment experiences powered by Dolby Vision HDR imaging and Dolby Atmos immersive sound. A growing number of leading auto makers are showing new models at the Shanghai show featuring Dolby Atmos and also Dolby Vision screens.

CES 2025: An Automotive Audio Perspective

January 23, 2025 by Roger Shively

CES 2025: An Automotive Audio Perspective

Roger Shively shares his Automotive Audio perspective of CES 2025. An evolutionary year, more tempered after the explosive nature of the software-defined vehicle becoming reality last year. Narrow and Deep AI, Machine Learning, and Generative AI had their roles in developing and maintaining most of the software and platforms for automotive audio at CES 2025. The “Ploughman's Lunch” of Automotive Audio, Shively was going to call his chronicle from the automotive-filled West Hall and the Beach Lot across the street.

MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences

January 9, 2025 by Joao Martins

MediaTek and Ceva Expand Spatial Audio Mobile Entertainment Experiences

Ceva and MediaTek announced a partnership to enhance the mobile entertainment experience, bringing the Ceva-RealSpace Elevate multichannel spatial audio with head tracking solution to the recently introduced MediaTek Dimensity 9400 flagship 5G smartphone chip using Bluetooth LE Audio. At CES 2025, Ceva demonstrated impressive spatial audio examples, creating a true-to-life listening experience beyond traditional stereo and surround sound systems on True Wireless Stereo (TWS) earbuds and headphones.

Airoha Technology Launches Flagship Wireless AI Audio SoC

December 30, 2024 by Joao Martins

Airoha Technology Launches Flagship Wireless AI Audio SoC

Airoha Technology announced the launch of a new flagship wireless audio chip with integrated AI processing. The AB1595 chip integrates essential functions that currently require multiple chips into one single system-on-chip (SoC). The announcement follows a recent press conference where the MediaTek subsidiary confirmed its intention to lead the market as a Bluetooth audio supplier and to outgrow the industry with AI-powered solutions in 2025.

January 11, 2024 by Joao Martins

Wi-Fi Alliance Introduces Wi-Fi Certified 7

To complicate an extremely busy week in technology news, the Wi-Fi Alliance decided to announce the release of its certification for Wi-Fi 7, which is the closest thing the organization offers as its official release. Although already implemented in a large number of products by many manufacturers, Wi-Fi 7 - or IEEE 802.11be - didn't exactly exist until this announcement. And this is a big one for wireless audio, bringing greater capacity, and less latency.

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

December 6, 2023 by Joao Martins

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

Airoha Technology, a subsidiary of Mediatek and one of the world's top designers of Bluetooth audio ICs, announced a collaboration with Intel and Engineered for Intel Evo laptop accessory program, which is the first of its kind to fully embrace Bluetooth LE Audio support. Airoha will supply its SoCs and Software Development Kit (SDK) to support development of new Bluetooth LE Audio devices.

MediaTek’s Chairman Ming-Kai Tsai Awarded IEEE Robert N. Noyce Medal

November 29, 2023 by audioXpress Staff

MediaTek’s Chairman Ming-Kai Tsai Awarded IEEE Robert N. Noyce Medal

MediaTek announced that its chairman Ming-Kai Tsai has been awarded the IEEE Robert N. Noyce Medal, one of the most prestigious awards in the electronics industry. Chairman Tsai was recognized for his vision and leadership in the global semiconductor industry, democratizing technology access for billions of people. The award will be presented to Tsai in-person at the IEEE Honors Ceremony, which will be held May 3, 2024 in Boston.

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