All items tagged with MediaTek (23)

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

September 19, 2022 by Joao Martins

Airoha Confirms Bluetooth LE Audio Certification. Chips to Be Available H1 2023

Taiwan-based Airoha Technology announced that its new series of Bluetooth audio chips have successfully completed the latest Bluetooth Low Energy Audio Qualification Process and will be "widely available" to manufacturers in the first half of 2023. Airoha is one of the most important suppliers of chips for true wireless earbuds and the LE Audio certification is also an important R&D achievement for its Bluetooth audio R&D team consisted of hundreds of engineers.

MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets

August 22, 2022 by Joao Martins

MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets

MediaTek, the semiconductor company from Taiwan, and Fraunhofer IIS, primary developer of the MPEG-H 3D Audio standard, have once again collaborated for bringing the most advanced audio experience to consumer homes. In January 2022, MPEG-H Audio was selected by the SBTVD Forum as the sole mandatory audio codec for the TV 3.0 Brazilian broadcast system. MediaTek has now integrated MPEG-H Audio into its Pentonic series.

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

Wireless Innovation Accelerates in 2022 with Wi-Fi 6 and UWB

November 23, 2021 by audioXpress Staff

Wireless Innovation Accelerates in 2022 with Wi-Fi 6 and UWB

According to global technology intelligence firm ABI Research, 2022 will represent a key year for wireless connectivity innovation as Wi-Fi 6, 6E, and Ultra-Wideband adoption accelerates across a growing number of end markets. The latest wireless technologies will see strong double-digit growth as 6 GHz Wi-Fi 6E shipments triple in the next year, reaching well over 1.5 billion annual chipset shipments. Ultra-Wideband (UWB) devices are expected to reach nearly half-a-billion units as adoption increases within smartphones, wearables, speakers, personal trackers, and location tracking (RTLS) applications, forecasts ABI Research.

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

October 1, 2021 by audioXpress Staff

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

MediaTek unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. The highly integrated chipsets offer fast, reliable connectivity with enhanced performance for broadband routers, mesh systems, enterprise access points and retail routers. Two high-performance, power-efficient Wi-Fi 6/6E chipsets with high computation capabilities and a rich set of features.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

September 30, 2020 by audioXpress Staff

Dirac Introduces Spatial Audio Solution for Direct Chipset Integration Into Next-Generation Wireless Headphones

Swedish digital audio pioneer Dirac announced that its latest spatial audio solution, which leverages the company's patented Dynamic HRTF technology, is now available for direct integration into the digital signal processors (DSP) of Bluetooth wireless headphones. The solution is now compatible with chipsets from Qualcomm, BES, and MediaTek and allows headphone manufacturers to deliver spatial audio to consumers, independent of playback devices or media players.

Amazon Announces Voice Interoperability Initiative with Leading Technology Companies

September 26, 2019 by audioXpress Staff

Amazon Announces Voice Interoperability Initiative with Leading Technology Companies

Amazon, Baidu, Sony, BMW, Microsoft, Bose, Tencent, Orange, Salesforce, Harman, Logitech, Verizon, Sonos, Spotify, Sound United, and more are joining forces to promote choice by supporting multiple, interoperable voice services on a single device. The idea is to offer multiple, simultaneous wake words, so users can access multiple voice services by simply saying the corresponding wake word – from Alexa and Cortana to Orange’s Djingo, Salesforce’s Einstein, and more.

StreamUnlimited Announces StreamSDK availability on MediaTek MT8516 SOC

April 19, 2019 by audioXpress Staff

StreamUnlimited Announces StreamSDK availability on MediaTek MT8516 SOC

StreamSDK, acknowledged in the audio industry for its feature-rich wireless audio streaming software stack, is now available on the MT8516 chipset from MediaTek. StreamUnlimited developed StreamSDK to be flexible enough to run on multiple hardware configurations, allowing manufacturers to remain with their chosen SoC supplier or to select the best hardware module for the product feature set, price point and target market. StreamUnlimited also confirmed AirPlay 2 is now available in StreamSDK, and hardware platforms across major SOC suppliers.

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

February 25, 2019 by audioXpress Staff

Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019

Xperi Corporation will showcase its latest mobile imaging, audio and semiconductor solutions from its brands, FotoNation, DTS and Invensas at MWC 2019 (February 25-28), in Barcelona. Xperi will showcase DTS audio solutions specifically targeted at the gaming market, including DTS Headphone:X 2.0 (for Gaming Headphones); DTS:X Ultra (for Windows and Android); DTS:X Game Audio; and DTS:X Premium.

«
1
2
3
»