The new development solution for True Wireless Stereo earbuds includes built-in audio processing blocks and product-ready algorithms from DSP Concepts and third party developers. Those include already algorithms from Mimi Hearing Technologies and VisiSonics.
The near-turnkey TWS earbuds toolkit is built on Audio Weaver, the audio experience design platform that powers sound and voice features in many of the world’s most prestigious consumer electronics and automotive brands. With Audio Weaver, developers are able to accelerate audio feature development, with a deep level of optimization of all the differentiating features of new designs. And working with Audio Weaver for true wireless earbuds also facilitates collaboration, creating an essential environment for innovation in these increasingly complex systems.
"We anticipate a step change in the complexity of TWS products powered by the latest SoCs that will bring a new wave of advanced features to consumers," says Chin Beckmann, CEO and co-founder of DSP Concepts. "Our TWS toolkit gives OEMs the solution they need to create remarkable audio experiences, manage complexity, and reduce development risk."
Algorithm highlights in the new TWS toolkit include personalized listening technologies from Mimi Hearing Technologies and 3D spatial audio from VisiSonics. Mimi Sound Personalization, driven by cutting-edge audiology research and processing technology, adapts sound based on an individual’s hearing profile, compensating for less than perfect hearing. VisiSonics RealSpace 3D spatial audio offers support for physics-based modeling and simultaneous ambisonics and object-based rendering. Personalized HRTFs and audiogram measurements, created through a RealSpace-powered mobile application, can be used to enhance situational awareness, reduce listener fatigue and improve reaction time, optimizing the experience for each end user.
The offering includes the Rapid Audio Prototyping Device (RAPID) TWS Kit from DSP Concepts. RAPID is an R&D system featuring a functional earbud prototype from Knowles Corporation. With the RAPID TWS Kit, developers can refine audio features before product design is completed and ahead of access to the target SoC. This accelerates the design and evaluation of audio processing chains, enabling OEMs to focus on differentiating their products.
With this new toolkit DSP Concepts reinforces its position in the Audio of Things market, enabling further creation possibilities with Audio Weaver, the audio experience design platform. The Audio of Things, represents the full range of audio processing technologies that deliver sound and voice features to any products with microphones or speakers, including voice control, voice communications, playback, and sensing. Unlike conventional audio feature development, DSP Concepts offers products and services that are processor-agnostic and fully customizable.
Based in Silicon Valley, DSP Concepts is able to support developers with real-time workflows to quickly stand up prototypes, collaborate and modify designs across teams, and deploy to the most popular chipsets from leading semiconductor companies including MediaTek, NXP Semiconductors, Qualcomm, STMicroelectronics, Cadence Design Systems, Arm, and others.
DSP Concepts technologies are embedded in millions of automotive and consumer products, delivering audio experience solutions to prestigious brands including Bang & Olufsen, BMW, Braun, Facebook, Garmin, GoPro, LG, Mercedes Benz, Panasonic, Peloton, Porsche, Samsung, Sennheiser, Spotify, Tesla, and many more.
www.dspconcepts.com
