All items tagged with audio processing (190)
Alango Unveils Hearing Augmentation Technology on Snapdragon S7 at CES 2025
December 20, 2024 by Joao Martins

Alango Unveils Hearing Augmentation Technology on Snapdragon S7 at CES 2025

Hearables and hearing augmentation applications are major trends for consumer electronics, and at CES 2025 Alango Technologies will reveal what the company describes as "a transformative breakthrough". As a member of the Qualcomm Voice and Music Extension Program, Alango will be one of the first companies to unveil a complete hearing augmentation solution running on Qualcomm Technologies' advanced Snapdragon S7 Sound platform. This collaboration allows Alango to bring a ready-to-market solution for personalized audio in true wireless earbuds.
Read more...
IDUN Audio Partners with Merry Electronics to Enable Spatial Audio in New Headphone Designs
December 17, 2024 by Joao Martins

IDUN Audio Partners with Merry Electronics to Enable Spatial Audio in New Headphone Designs

IDUN audio, the Danish embedded spatial audio technology specialists announced a strategic partnership with Taiwan-based Merry Electronics. IDUN audio will showcase three new spatial audio integrations for personal audio during CES 2025, all running on Merry's brand new reference designs for true wireless stereo (TWS) earbuds, a new OWS open ear clip solution, and the recently announced new dual driver headphones.
Read more...
STMicroelectronics NPU-Accelerated STM32 Microcontrollers Boost Edge AI Development
December 13, 2024 by Cristina Costa

STMicroelectronics NPU-Accelerated STM32 Microcontrollers Boost Edge AI Development

STMicroelectronics is making embedded artificial intelligence (AI) on-device widely available with its new STM32 microcontroller series. These new NPU-accelerated microcontrollers, which have been available to selected companies since October 2023 and are now available in high volumes, integrate accelerated machine-learning (ML) capabilities for the first time. This makes it possible to run computer vision, audio processing, sound analysis and more directly in low-power, cost-sensitive products.
Read more...
Fraunhofer to Present Uphear Flexible Rendering at CES 2025
December 5, 2024 by Joao Martins

Fraunhofer to Present Uphear Flexible Rendering at CES 2025

Once again the Fraunhofer Institute for Integrated Circuits (Fraunhofer IIS) will present its most recent advanced audio technologies at CES 2025. Targeting new consumer audio applications, the highlight will be upHear Flexible Rendering, a new technology that automatically combines all available speakers to generate an enveloping immersive sound field. This greatly simplifies high-quality immersive sound experiences on consumer audio reproduction devices, including loudspeakers, soundbars, and TVs.
Read more...
Alango Unveils Sound Processing Module for Qualcomm S7 SoC
November 4, 2024 by Joao Martins

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

Alango Technologies announced a new digital sound processing module for Qualcomm's Bluetooth SoCs, including the latest S7 Gen1 Sound platform that features five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to previous solutions. According to Alango, this first to market platform offers a pre-integrated, ready-to-use modular solution for the latest generation of hearables and advanced audio designs.
Read more...
Røde Appoints Nick Engel as Senior Director of Engineering
October 9, 2024 by audioXpress Staff

Røde Appoints Nick Engel as Senior Director of Engineering

Røde announced the appointment of Nick Engel as Senior Director of Engineering. Nick joins Røde with a wealth of experience in the audio technology industry, having held senior engineering positions at Dolby and Apple. With over 20 years of experience developing cutting-edge audio technology for consumer products, Nick is a key hire as Røde continues to innovate and expand its product offerings into entirely new frontiers.
Read more...
Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications
September 24, 2024 by audioXpress Staff

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

Ceva and Edge Impulse announced a collaboration to rapidly develop, train and deploy advanced embedded machine learning (ML) applications on Ceva's neural processing units with cycle-accurate performance, even before physical hardware is available. This first-of-its-kind collaboration based around Ceva's NPU IP ensures that developers can accurately benchmark and refine the performance of their edge AI models using Edge Impulse's platform, significantly accelerating the time-to-market.
Read more...
IDUN audio Introduces Source-Independent, Low-Latency Head Tracking
September 23, 2024 by Joao Martins

IDUN audio Introduces Source-Independent, Low-Latency Head Tracking

Danish spatial audio specialists IDUN audio announced Aura, an innovative way of applying head tracking to spatialized multichannel content. The latest addition to the company's suite of software processing technologies, Aura is specifically designed for listening to content mixed to Dolby Atmos, Sony 360 Reality Audio, and other media formats, through conventional Bluetooth headphones and earbuds, independently of the playback device.
Read more...
Syntiant to Acquire Knowles' Consumer MEMS Microphone Division
September 19, 2024 by Joao Martins

Syntiant to Acquire Knowles' Consumer MEMS Microphone Division

Syntiant Corp., announced it has signed a definitive agreement to acquire certain assets of Knowles Corporation's Consumer MEMS Microphones (CMM) business. The $150 Million transaction will bolster Syntiant market strategy in Edge AI solutions with voice, audio, and speech applications. As a recognized pioneer in low power edge AI deployments, the Irvine, CA-based company intends to offer complete turnkey solutions integrating sensors, processors and software.
Read more...
Cadence Tensilica HiFi 5 DSPs Power NXP's Next-Gen Audio DSP Family
September 19, 2024 by audioXpress Staff

Cadence Tensilica HiFi 5 DSPs Power NXP's Next-Gen Audio DSP Family

Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) are a key component in NXP Semiconductors' latest SAF9xxx family of automotive audio DSPs, enabling advanced audio capabilities for next-generation software-defined vehicles. According to Cadence, this development is a significant achievement for the automotive industry, addressing the growing need for sophisticated audio processing to support traditional DSP tasks, artificial intelligence, and machine learning (AI/ML) applications.
Read more...