All items tagged with Bluetooth 5.4 (20)

beyerdynamic Introduces New Flagship Wireless Headphones and TWS Earbuds

September 9, 2024 by Joao Martins

beyerdynamic Introduces New Flagship Wireless Headphones and TWS Earbuds

During IFA 2024, beyerdynamic introduced two new additions to its wireless headphones and earbuds lineup. The all-new flagship AVENTHO 300, packed with advanced features, hybrid ANC, and Dolby Head Tracking technology, now leads beyerdynamic’s headphone range, while the AMIRON 300 offers a fresh approach to the company's true wireless stereo (TWS) earbuds. Both products represent a bold reinvention of the AVENTHO and AMIRON lines, combining cutting-edge wireless technology and chipsets with premium materials.

Bowers & Wilkins Launches New Pi6 and Pi8 True Wireless ANC Earbuds

August 21, 2024 by Joao Martins

Bowers & Wilkins Launches New Pi6 and Pi8 True Wireless ANC Earbuds

Bowers & Wilkins introduced two all-new premium True Wireless earbuds, the Pi6 and Pi8, developed by the same design and engineering teams responsible for the brand's Px7 S2e and Px8 headphones. Coming from the renowned audio brand, the two models are focused on sound quality, combining fit and comfort, excellent noise cancellation and premium aesthetics. Based on Qualcomm's latest chipsets, the Pi6 and Pi8 earbuds offer a great combination of premium technologies and features, including the innovative Pi8 Smartcase.

Google Introduces AI-Assisted Pixel Buds Pro 2 Earbuds

August 13, 2024 by Joao Martins

Google Introduces AI-Assisted Pixel Buds Pro 2 Earbuds

Tuesday, August 13 was scheduled as Pixel day, when Google promoted its ninth "Made by Google" event to unveil an extensive range of hardware devices, including new Pixel 9 phones, the Pixel 9 Pro Fold, Pixel Watch 3 and Pixel Buds Pro 2. The smartphones are what one would expect at this time, a best of all the Android smartphones available until now. The Pixel Buds Pro 2 are Google's best attempt in the category with better ANC and battery life.

Managing Expectations: The Bluetooth LE Audio Calendar

August 8, 2024 by Joao Martins

Managing Expectations: The Bluetooth LE Audio Calendar

Fear of Missing Out on Bluetooth LE Audio? Are We There Yet? How many more days? When should you trigger that OTA firmware update? Should you ship Auracast-enabled products now? Should you be the first? No one wants to be the first.

EarFun Introduces Air Pro 4 Adaptive ANC Wireless Earbuds with LE Audio and Auracast

August 5, 2024 by Joao Martins

EarFun Introduces Air Pro 4 Adaptive ANC Wireless Earbuds with LE Audio and Auracast

Factories in China are starting to bring out the new generation of Bluetooth LE Audio and Auracast-enabled true wireless earbuds, now that the chips are becoming available. Some more aggressive brands are using this opportunity to jump ahead of the crowd. EarFun managed a number of firsts in the new Air Pro 4 earbuds, the first Qualcomm Snapdragon Sound Bluetooth 5.4 model with support for both LDAC and aptX Adaptive codecs, ready for LE Audio and Auracast.

Samsung Unveils New Galaxy Buds 3 and Galaxy Buds 3 Pro

July 16, 2024 by Joao Martins

Samsung Unveils New Galaxy Buds 3 and Galaxy Buds 3 Pro

Samsung promoted its Galaxy Unpacked event in Paris to unveil its latest range of folding smartphones, Galaxy Z Fold 6 and Galaxy Z Flip 6, two new smart watches, and a smart ring. Included in the series of announcements was the unveiling of Samsung's latest Galaxy Buds 3 Series true wireless earbuds, which surprised everyone for the radical departure from its original design in the previous generations. The new Galaxy Buds 3 and Galaxy Buds 3 Pro now look exactly like the earbud shapes of the AirPods.

EDIFIER Announces STAX Spirit S5 Wireless Planar Magnetic Headphones

July 11, 2024 by Joao Martins

EDIFIER Announces STAX Spirit S5 Wireless Planar Magnetic Headphones

Edifier just unveiled its STAX Spirit S5 Wireless Planar magnetic headphones, its second product since it acquired the famous brand. The STAX Spirit S5 improves on the quality of the audio experience with its 2nd gen EqualMass wiring technology, 2μm thin film and a new calibration approach of the planar drivers, which Edifier say achieve a performance comparable to legendary electrostatic headphones. Based on the Qualcomm QCC5181 Snapdragon Sound Bluetooth audio SoC, the new Spirit S5 headphones also deliver an expanded range of wireless audio options.

Edifier Unveils W830NB ANC Headphones with Hybrid Active Noise Cancellation

July 1, 2024 by audioXpress Staff

Edifier Unveils W830NB ANC Headphones with Hybrid Active Noise Cancellation

Edifier International, the audio design powerhouse from Beijing, has announced its new W830NB over-ear headphones that are able to achieve -45dB of active noice cancellation and are packed full of outstanding features with all the latest technologies, while retailing for USD $79.99. According to Edifier, the upgraded hybrid digital ANC technology is able to achieve an 18% increase compared to its previous generation, blocking all surrounding noises for over 50 hours on a single charge.

From Home to Personal: Sonos Debuts Ace Headphones

May 22, 2024 by Joao Martins

From Home to Personal: Sonos Debuts Ace Headphones

Sonos announced the launch of its first-ever headphones. The Sonos Ace headphones are a very nice design, updated with all the technologies expected today. A Bluetooth 5.4 platform based on Qualcomm's Snapdragon Sound, with Active Noise Cancellation, advanced noise control for voice and calls, support for aptX lossless streaming, and spatial audio with Dolby Head Tracking. The TV audio swap is a core distinctive feature, allowing users to switch to headphones from Sonos soundbars.

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

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