Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

Qualcomm Technologies International unveiled an addition to the Qualcomm S3 Gen 2 Sound platform portfolio. This newly enhanced solution is optimized for gaming and ready for use in dongles and adapters. It combines Snapdragon Sound and LE Audio to deliver ultra-low latency of less than 20ms for lag-free wireless audio with voice back-channel for in-game chat. When delivering game audio only, the latency is further reduced.

At Embedded World 2023, Packetcraft announced their latest Bluetooth 5.4 host and controller software is enabling EM Microelectronic’s flagship em | bleu (EM9305). The em | bleu single chip is a small form factor and ultra-low energy consuming Bluetooth LE SoC or companion IC solution supporting the very latest Bluetooth technology including PAwR, LE Audio and Auracast broadcast audio.

Ellisys, the provider of test and analysis solutions for Bluetooth, Wi-Fi, Universal Serial Bus (USB), and other wired and wireless communications technologies, announced the availability of qualification testing and protocol analyzer features supporting the latest version 5.4 of the Bluetooth Core Specification. According to the Arizona-based company, its Ellisys Bluetooth Qualifier is ready for the updated testing requirements.

The Bluetooth SIG has just released a new ultra-low power networking feature that is expected to enable high-volume applications including Electronic Shelf Labels (ESL) for retail. This is the main update in the latest Bluetooth 5.4 core specification adding Periodic Advertising with Responses (PAwR) features that support ESL and wireless applications in the retail market. There are no changes related with audio applications.