
The new Alango Sound Processing Module (ASPM) was developed to accelerate development and simplify testing with Alango's DSP software technologies for voice, hearing, and audio processing applications. Enabling a modular approach to implement the most advanced audio algorithms and processing technologies, the module ensures optimal performance for intelligible voice transmission, voice interfaces, audio entertainment, hearing assistance and enhancement, as well as hearing protection applications.
The new Alango module supports Bluetooth Low Energy (BLE), BLE Audio, and Auracast, offering robust connectivity options for modern audio applications. This enables designing low power wearable and portable designs but also device-to-device communication applications with high-quality, low-latency audio streaming, and innovative Auracast broadcast transmitter applications. The module specifications include I²S/PCM/TDM up to 32‑bit/384kHz, up to 5x pairs of DMIC interfaces, four ADCs for differential and single-ended modes, and built-in stereo DAC up to 120 dBAW SNR/DR.
As a renown provider of advanced signal processing technologies, Alango designed the Alango Sound Processing Module to support multiple microphones, enabling arrays and advanced directional applications, with adaptive noise suppression and filtering. Benefiting from all the advanced specifications of Qualcomm's SoCs, the module is also ready to power advanced music enhancement and speech recognition features.

As a pre-integrated, modular software solution running on qualified hardware the Alango Sound Processing Module accelerates development and simplifies testing. It is available in two variants depending on the application. One configuration directly addresses communication systems, enabling applications such as intercom, conference phones, and USB sound cards with advanced DSP features. Another configuration enables consumer and smart home applications, combining the features required for headphones, Bluetooth and Smart speakers, voice activated products, home theater systems, personal sound amplification products, smart hearing protection, sound reinforcement systems, and remote microphones.
The two hardware module iterations can combine either Qualcomm's QCC7226 (S7) or QCC5229 (S5 Gen3) SoC ICs, which include a main DSP for audio use cases with low power consumption. The multicore compute architecture with dedicated low latency audio and AI accelerators includes dual-mode Bluetooth and integrated QSPI flash memory. Product designers can embedded the Alango Sound Processing Module directly as a pre-built sound processing solution in mass-market devices, enabling advanced audio features without the need for custom sound engineering.

The ASPM EVB and accompanying kit enables real time monitoring of the digital input and output audio streams within the DSP and allows setting VCP parameters on the fly for tuning VCP processing. The board combines interfaces for analog and digital audio, USB interface for power, communication, audio tuning, and software development, push buttons and multicolor LED for manual control, battery power option, and Bluetooth antenna.
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