xMEMS Labs continues to accelerate its go-to-market solutions featuring its solid-state True MEMS microspeaker technology, creating ready to use reference designs and modules for true wireless stereo earbuds, in-ear monitors, and other personal audio devices. With over 100 granted patents worldwide for its monolithic transduction MEMS technology, xMEMS implements both actuation and diaphragm in silicon producing the world’s fastest and most precise microspeakers. This results in the most accurate time domain music reproduction, with a consistency and tolerance to sound tuning that was simply not available previously.
The company has now partnered with Bujeon Electronics, a leading OEM/ODM manufacturer of advanced acoustics technology with a heritage of 30 years since its establishment in 1988. Headquartered in South Korea, Bujeon operates two vertically-integrated production sites in Vietnam with automated manufacturing capabilities.
The result of this collaboration with Bujoen - first demonstrated at CES 2023 - resulted in a reference design for TWS earbuds that uses an xMEMS' Cowell tweeter, chosen for its superior high frequency response, combined with a dynamic driver in a single combined module. The design enables a wider soundstage versus single-driver TWS earbuds, delivering new levels of clarity and presence to speech, vocals and instrumentals, allowing the woofer to focus on the low frequency energy required for deep bass response and active noise cancelation.
The BEM-1xx and BEM-2xx family of 2-way woofer/tweeter modules are sampling now and offer a thin and compact footprint: 4.5mm height (speakers only) and 9.52mm diameter. The woofer and tweeter have been perfectly matched in the module design, eliminating the need, cost and complexity of analog or digital crossovers. TWS manufacturers are offered several configuration options to best suit their individual earbud designs, including the ability to integrate a feedback microphone onto the module and to integrate the xMEMS Aptos amplifier onto the module or to move this circuitry to their main PCB. Mass production of the modules will start in Q2’23.
"The leap forward in fidelity offered by xMEMS solid-state MEMS speakers comes at the perfect time as TWS manufacturers prepare solutions supporting hi-res, lossless codecs," says Mike Housholder, xMEMS VP of Marketing and Business Development. "Our partnership with Bujeon leverages their proven manufacturing prowess spanning dynamic drive speakers, speaker module design and mass production of complete TWS earbuds with leading consumer brands to offer solutions to our mutual customers that accelerate time-to-market."
"It is a great honor to have had the opportunity to work with xMEMS on an innovative audio solution. Through a close collaboration, xMEMS’ pioneering MEMS speakers and Bujeon's various audio experience and technology have successfully combined to develop a complete audio module for TWS. We are confident that we can deliver superb performance to TWS earbud OEMs, achieving next-level sound fidelity not possible with conventional approaches," says Dong Hyun Seo, President of Bujeon Electronics.
www.bujeon.com
www.xmems.com
