AMPACS Announces Industry's First 2-Way Over-Ear Headphone Reference Design Based on xMEMS MEMS Speakers

Furthering the integration of solid-state microspeakers in over-the-ear headphones, global ODM/OEM AMPACS announced a turnkey 2-way headphone solution designed in collaboration with MEMS pioneer xMEMS Labs. The patented 2-way module architecture improves spatial audio accuracy and reduces weight, among other benefits versus conventional single-driver architectures. Pre-production prototypes are ready now, and the production-ready solution will be available in September 2024.
 
The concept using an xMEMS' Cowell MEMS driver on a 2-way over-ear headphone design was presented at CES 2024, and intrigued many industry professionals that visited the xMEMS Labs suite. This module architecture offers many benefits to both consumers and headphone manufacturers. For example, improved spatial audio accuracy, improved mid- and high-end frequency reproduction for cleaner vocals, lighter weight for improved wearing comfort, and much simpler back-volume acoustic design for faster time to market.

The design leverages xMEMS' Cowell MEMS microspeaker as a miniature midrange-tweeter, and a 35 to 40-millimeter dynamic driver from AMPACS delivering the deep, satisfying bass. The result is a ready-made, modular solution that headphone manufacturers can plug into virtually any headphone design, including open-back, closed-back, wired, and wireless, for next-level gaming and music listening experiences.

According to xMEMS VP of Marketing and Business Development Mike Housholder, xMEMS developed the 2-way headphone reference concept to provide audio brands with a faster time-to-market solution that reduces production costs. "Our collaboration with AMPACS is driven by our firm belief that solid-state MEMS speakers will redefine all forms of personal audio," Housholder says. "And in creating this 2-way design, we’re moving the headphone market one step closer to a solid-state future. We encourage all interested brands to contact AMPACS so they can immediately begin producing headphones quicker and more affordably, while ensuring their products are lighter and better sounding than anything currently available." Additionally, despite including the latest in solid-state technology, replacing exotic dynamic driver diaphragm materials with this simple 2-way system can actually cut costs for manufacturers. The low end can actually be reproduced by a smaller-than-usual (for high-end headphones) 40-millimeter dynamic driver from AMPACS, and existing designs can be adapted with a drop-in replacement module for a 50mm dynamic driver.

According to AMPACS the 2-way design will not increase costs. In fact, replacing graphene, carbon fiber or other exotic dynamic driver diaphragm materials with this simple 2-way system can actually cut BOM cost. "As a global leader in headphone ODM designs, AMPACS is uniquely positioned to bring xMEMS' industry-changing innovations to audio brands and manufacturers throughout the world," says James Hsu, AMPACS Vice Chairman. "Leveraging our robust research and development team and advanced production technology, we’ve designed and integrated a truly disruptive solution that sounds better and costs less than single-driver headphones on the market today."

Interested parties are encouraged to contact AMPACS. Established in 1998, the company is one of the international leaders in electroacoustic product design and manufacturing, with extensive highly integrated production solutions from plastic molding and injection to SMT and product assembly, and a complete R&D team ready to support the industry.
www.ampacscorp.com
www.xmems.com