All items in category Industry News
AuviTran Celebrates 20 Years of Bridging the Audio Network Gap
by audioXpress Staff

AuviTran Celebrates 20 Years of Bridging the Audio Network Gap

The French audio network specialist and equipment manufacturer AuviTran celebrated its 20th anniversary during the JTSE (Journées Techniques du Spectacle et de l'Événement) show held in Paris, November 29-30, 2023. Recently acquired by Digigram, the celebration was a perfect occasion for the AuviTran team to gather long-time partners, clients and integrators, and raise their glasses to 20 years of bridging technological gaps in the audio industry and to future endeavors.
Read more...
dbx-tv Audio Processing Solutions Are Now Total Sonics
by audioXpress Staff

dbx-tv Audio Processing Solutions Are Now Total Sonics

Originating in the 1980s, dbx-tv evolved to offer complete DSP audio enhancement solutions and is now called Total Sonics. Proud of its 40-year legacy of television audio excellence, the company embraced a broader mission to make any device with speakers deliver the best sound possible, even those with the tightest of design constraints. Total Sonics is headquartered outside Boston, with representation in Shanghai, Tokyo, and Seoul.
Read more...
Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle
by Joao Martins

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps, will partner with XMOS for its Headphone 3.0 demonstrations at CES 2024. The two companies will showcase a first joint development that will greatly enhance wireless audio quality with huge benefits to the feature set in Sonical's roadmap.
Read more...
Imersiv D1 Multi-Path Digital-to-Analog Converter Completes 32-bit Audio Chain
by Jan Didden

Imersiv D1 Multi-Path Digital-to-Analog Converter Completes 32-bit Audio Chain

Unveiled at the 2023 AES Conference in New York, the new Imersiv D1 Digital-to-Analog Converter is the first product from a new brand created by Millennia founder John La Grou, and the first to introduce to the market his approach to multi-path technology. The results of years of research and development, his triple-patented Imersiv D1 DAC explores a multi-path architecture to achieve a breakthrough dynamic range performance of 162dB, broadband, unweighted.
Read more...
Three-Day Lecture by Wolfgang Klippel Scheduled for 2024
by audioXpress Staff

Three-Day Lecture by Wolfgang Klippel Scheduled for 2024

Klippel is promoting a new 3-Day Lecture, following the popular format of previous editions. The main topic for 2024 will be Sound Quality of Audio Systems, Modeling, Measurement & Control. The three-day event combines both theory and practice and will take place March 4-6, at the Technical University of Dresden, Germany. Registration for the lecture is now open for a fee for general admission and is free for students.
Read more...
WiSA Technologies Reports Progress in Industry Support for WiSA E
by audioXpress Staff

WiSA Technologies Reports Progress in Industry Support for WiSA E

WiSA Technologies, the multichannel wireless audio technology pioneer, announced the integration of WiSA E software technology onto the Amlogic S905X4 application processor. This advanced embedded SoC design is ideal for the OTT/IP streaming Set-Top Box market, and its availability follows the announcement that WiSA just confirmed the first WiSA E software licensing with a major global TV brand.
Read more...
d&b audiotechnik Expands Cue Automation and Show Control Possibilities for Soundscape Software
by Joao Martins

d&b audiotechnik Expands Cue Automation and Show Control Possibilities for Soundscape Software

d&b audiotechnik released version 3 of En-Snap, the d&b Soundscape cue automation and show control software provided in collaboration by d&b and Gareth Owen Sound. This major update enables positioning and editing of Soundscape objects, focusing on creative workflows and FoH for immersive live applications. d&b also introduced En-Bridge software, expanding Soundscape interoperability with 3rd party systems, improved console control, new BlackTrax tracking system support, and more.
Read more...
Ora Graphene Audio Partners with Merry Electronics to Develop the First Off-the-Shelf GrapheneQ Headphone Drivers
by Joao Martins

Ora Graphene Audio Partners with Merry Electronics to Develop the First Off-the-Shelf GrapheneQ Headphone Drivers

Ora Graphene Audio, the Montreal-based graphene technology pioneer announced a strategic partnership with Merry Electronics, the renowned Taiwan-based electronics manufacturer, to develop the world's first commercially available GrapheneQ headphone drivers. This collaboration marks a significant milestone in the adoption of graphene technologies. Both 40mm and 50mm headphone drivers powered by Ora's groundbreaking graphene audio technology will be available for pre-orders Q1 2024.
Read more...
Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices
by Joao Martins

Airoha Works with Intel to Facilitate the Development of New Bluetooth LE Audio Devices

Airoha Technology, a subsidiary of Mediatek and one of the world's top designers of Bluetooth audio ICs, announced a collaboration with Intel and Engineered for Intel Evo laptop accessory program, which is the first of its kind to fully embrace Bluetooth LE Audio support. Airoha will supply its SoCs and Software Development Kit (SDK) to support development of new Bluetooth LE Audio devices.
Read more...
Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
by audioXpress Staff

Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation

Ceva, Inc., introduced a fresh new brand visual identity, logo design and web domain ”ceva-ip.com,” reflecting the company’s commitment to "being the partner of choice for transformative IP solutions that power the smart edge." Ceva is a leading provider of silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets.
Read more...