Better Acoustics, Better Designs in audioXpress August 2024!

Better Acoustics, Better Designs in audioXpress August 2024!
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Audio Amplification Meets Product Development in audioXpress July 2024

Audio Amplification Meets Product Development in audioXpress July 2024
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The Audio Voice - Weekly Newsletter for audioXpress and Voice Coil Communities

The Audio Voice - Weekly Newsletter for audioXpress and Voice Coil Communities
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Aiming for Better Loudspeaker Designs in Voice Coil July 2024

Aiming for Better Loudspeaker Designs in Voice Coil July 2024
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OCA Alliance Introduces New Technologies, New Standards, and Receives Support From New Members
by Joao Martins

OCA Alliance Introduces New Technologies, New Standards, and Receives Support From New Members

The ISE 2023 show in Barcelona saw the OCA Alliance bring forward several new developments and announcements that will continue to push the horizons of the AES70 control standard. During the show, presentations, demonstrations, and new members to the trade association showcased current and future technologies and tools that will further broaden the Open Control Architecture (OCA) Ecosystem.
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Interested in a Consistent Testing Solution For Bluetooth Headphones? Join this Webinar April 5, 2023
by audioXpress Staff

Interested in a Consistent Testing Solution For Bluetooth Headphones? Join this Webinar April 5, 2023

The Audio Product Development Alliance (APDA), dedicated to improving the knowledge and skills of professionals involved in the development of audio products, in partnership with ALTI Association, present a webinar titled: "A Simplified Testing Solution for Bluetooth Headphones - Consistent and Accurate Production Line Results." April 5, 2023 - 9:00 AM Pacific - (12:00 PM Eastern). Registration is now open
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GreenWaves Ramps Up Production of GAP9 Hearables Platform
by Joao Martins

GreenWaves Ramps Up Production of GAP9 Hearables Platform

GreenWaves Technologies, a fabless semiconductor company based in Grenoble, France, has received the funding needed to support the production of its second-generation GAP9 processor. As demonstrated at CES 2023, this advanced AI processor revolutionizes the next generation of true wireless earbuds, hearables, and connected devices with ultra-low latency noise cancellation, neural network-based background elimination and 3D sound.
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    Patent Review: Low-Profile Loudspeaker Transducer
    by James Croft

    Patent Review: Low-Profile Loudspeaker Transducer

    This review looks at a patent awarded in October 2016 to George Bullimore, on behalf of Tymphany. Considering the number of patents on shallow drivers, and the fact that the inventor also previously developed transducers for Harman International and holds other key patents, this is no doubt an interesting document to analyze in depth. This article was originally published in Voice Coil, May 2017.
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    On the Subject of Standards: Filling in the Gaps Left by AES67
    by Ekin Binal

    On the Subject of Standards: Filling in the Gaps Left by AES67

    Is the AES67 interoperability standard a viable alternative as the core solution for audio-over-IP distribution? Crestron proved that it is with its DM NAX technology filling the existing gaps of network discovery and routing. Ekin Binal, Director, Product Management (AV Solutions) at Crestron shares the company's practical experience in embracing the AES67 standard for distributing audio over a residential audio installation. This article was originally published in audioXpress, February 2023.
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    A New Era of Sonos Speakers Starts Now
    by Joao Martins

    A New Era of Sonos Speakers Starts Now

    Sonos debuted Sonos Era 300 and Sonos Era 100, the company's next generation of connected, home audio speakers that also have smart features, but more importantly pave the way for a whole new chapter in sound and design innovation from the brand. The new Sonos Era 300 is a completely new design that is supposed to deliver some form of "spatial audio". The more compact Era 100 redefines the Sonos One concept with a more advanced design.
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    XMOS Launches XVF3800 High-Performance Voice Processor for Enterprise and Consumer Voice Conferencing Platforms
    by Joao Martins

    XMOS Launches XVF3800 High-Performance Voice Processor for Enterprise and Consumer Voice Conferencing Platforms

    Anticipating the company's presentation at Embedded World 2023, XMOS has launched the XVF3800, a quick-to-market, high-performance voice processor for enterprise and consumer voice conferencing platforms. The XVF3800 combines acoustic echo cancellation (AEC), multiple adaptive beamformers, noise suppression, AGC, and more, and will be available along with a development kit, the XK-VOICE-SQ66.
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    STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables
    by audioXpress Staff

    STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

    STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.
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    RH Consulting Releases 2023 Report on Networked Audio State of Adoption
    by Joao Martins

    RH Consulting Releases 2023 Report on Networked Audio State of Adoption

    Audio consultancy and networking experts RH Consulting (RHC) have been counting networked audio products and licensees since 2013 to chart the adoption of audio networking in the pro audio, AV and broadcast markets. The 2023 edition of this report on Networked Audio Products, which has meanwhile extended to cover also audio, video & control products, is now available and confirms the growing strength of AES67 and ST2110 standards.
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    Listen Announces SoundCheck Version 21 and New Portable Dual-Channel Audio Interface
    by audioXpress Staff

    Listen Announces SoundCheck Version 21 and New Portable Dual-Channel Audio Interface

    Listen released SoundCheck 21, the latest version of its flagship audio test software. The update includes a new enhanced Loose Particles algorithm for transient distortion measurements in a wide range of devices. It also offers increased measurement capability with the new multichannel FFT analyzer. SoundCheck 21 also introduces support for AudioConnect 2, Listen’s new compact and high resolution (up to 192kHz sampling rate) two-channel audio interface.
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