GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.

AONDevices, the AI processing company from Irvine, California, announced AONDenoise, a compact, efficient edge AI denoising solution that enable customizable noise cancellation running in real-time, completely on-device. Designed for applications that require minimal power and latency, AONDenoise is one of the smallest denoising algorithms available, making it an ideal AI speech enhancement for use in hearing aids, wireless earbuds, and wearables.

GreenWaves Technologies, a fabless semiconductor company based in Grenoble, France, has received the funding needed to support the production of its second-generation GAP9 processor. As demonstrated at CES 2023, this advanced AI processor revolutionizes the next generation of true wireless earbuds, hearables, and connected devices with ultra-low latency noise cancellation, neural network-based background elimination and 3D sound.

Syntiant, the company focused on making edge AI a reality for always-on applications, announced a new reference design that will enable ODMs and OEMs to easily and quickly deploy ultra-low-power, edge AI voice processing applications in true wireless earbuds. The solution enables multi-lingual custom wake words and speech commands, supported by data training and modeling, providing a complete, end-to-end solution for edge AI processing.

Taiwan-based semiconductor design house Sounds Great is unveiling prototypes of its Motion Microchip and Semiconductor Dynamic Speaker (SDS) solutions at CES 2022 in Las Vegas. The company's technology is the smallest speaker solution of its type, and will be presented as a 1.5x1.5mm single driver or an SDS array, enabling applications from earphones to stereo reproduction in consumer devices. In its second year at CES, the company shows a promising speaker concept with large potential for ultra low-power designs.