All items tagged with wireless earbuds and ultra-low power (8)

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

ZenVoice Bone Algorithm Delivers Superior Voice Clarity in Noisy Environments with Bosch Sensortec's Advanced BMA550 Bone Conduction Sensor

July 15, 2024 by Joao Martins

ZenVoice Bone Algorithm Delivers Superior Voice Clarity in Noisy Environments with Bosch Sensortec's Advanced BMA550 Bone Conduction Sensor

Aizip and Bosch Sensortec jointly received the 2024 Best of Sensors Award at the Sensors Converge Conference and Expo (June 24-26) for a noise reduction solution in hearables devices. The award recognized the fact that Aizip's ZenVoice Bone algorithm, coupled with Bosch Sensortec's latest BMA550 bone conduction sensor, delivers advanced noise reduction in true wireless stereo (TWS) earbuds. This collaboration leverages Aizip's advanced neural network architecture to deliver a new level of speech intelligibility.

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

June 28, 2024 by Joao Martins

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

Following a very successful presence at Sensors Converge 2024 in Santa Clara, CA (June 25-26), where TDK promoted its range of MEMS microphones and sensors, the company announced worldwide distribution of its InvenSense SmartSound T5848 bottom port I²S MEMS microphone. This device is ideal to enable intelligent keyword, voice command and sound detection applications in ultra-low power designs, such has hearables and wearables. Originally announced at CES 2022, this MEMS microphone only now is available for general distribution.

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

December 19, 2023 by Joao Martins

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.

AONDevices Introduces Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement

October 16, 2023 by Joao Martins

AONDevices Introduces Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement

AONDevices, the AI processing company from Irvine, California, announced AONDenoise, a compact, efficient edge AI denoising solution that enable customizable noise cancellation running in real-time, completely on-device. Designed for applications that require minimal power and latency, AONDenoise is one of the smallest denoising algorithms available, making it an ideal AI speech enhancement for use in hearing aids, wireless earbuds, and wearables.

GreenWaves Ramps Up Production of GAP9 Hearables Platform

March 9, 2023 by Joao Martins

GreenWaves Ramps Up Production of GAP9 Hearables Platform

GreenWaves Technologies, a fabless semiconductor company based in Grenoble, France, has received the funding needed to support the production of its second-generation GAP9 processor. As demonstrated at CES 2023, this advanced AI processor revolutionizes the next generation of true wireless earbuds, hearables, and connected devices with ultra-low latency noise cancellation, neural network-based background elimination and 3D sound.

Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications

January 7, 2022 by Joao Martins

Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications

Syntiant, the company focused on making edge AI a reality for always-on applications, announced a new reference design that will enable ODMs and OEMs to easily and quickly deploy ultra-low-power, edge AI voice processing applications in true wireless earbuds. The solution enables multi-lingual custom wake words and speech commands, supported by data training and modeling, providing a complete, end-to-end solution for edge AI processing.

Sounds Great Unveils Motion Microchip and Semiconductor Dynamic Speakers at CES 2022

January 4, 2022 by Joao Martins

Sounds Great Unveils Motion Microchip and Semiconductor Dynamic Speakers at CES 2022

Taiwan-based semiconductor design house Sounds Great is unveiling prototypes of its Motion Microchip and Semiconductor Dynamic Speaker (SDS) solutions at CES 2022 in Las Vegas. The company's technology is the smallest speaker solution of its type, and will be presented as a 1.5x1.5mm single driver or an SDS array, enabling applications from earphones to stereo reproduction in consumer devices. In its second year at CES, the company shows a promising speaker concept with large potential for ultra low-power designs.