Qualcomm Snapdragon Sound: Questions, Development, Audio Momentum and the Market

In early March 2021, following a series of announcements in development platforms and solutions for wireless audio, Qualcomm announced Qualcomm Snapdragon Sound, a new end-to-end approach to promote high-resolution digital audio and enhanced voice communications across devices. The systems' approach combines and optimizes multiple Qualcomm technologies for mobile platforms, processing, connectivity, plus the latest aptX Adaptive audio technologies needed to improve the sound experience for consumers. But how can manufacturers and new brands benefit? Will there be a lossless extension for aptX Adaptive? We asked the questions to Jonny McClintock, Director of aptX Sales & Marketing at Qualcomm.

Tempow, the Bluetooth-specialist, Paris-based startup, announced a new partnership with Zhuhai Jieli Technology, a leading chipset manufacturer in the TWS Bluetooth SoC segment. Jieli Technology is joining Tempow's chipset partner program to deploy TempowOS, an operating system for True Wireless Earbuds, on its flagship AC897N and AD697N extreme low power Bluetooth TWS solutions.

At CES 2020, the Bluetooth Special Interest Group (SIG) announced the upcoming release of LE Audio, the next generation of Bluetooth audio. Two years on the making, Bluetooth LE Audio will enhance the performance of wireless audio, add support for hearing aids, and introduce Audio Sharing, a new use case with the potential to once again change the way we experience audio and connect with the world around us as Bluetooth did when it cut the cord 20 years ago to create the wireless audio market.