All items tagged with voice recognition (310)
Fortemedia Introduces Low-Power iM501 Voice Processor for Wearables and Smart Home Applications
April 11, 2017 by audioXpress Staff

Fortemedia Introduces Low-Power iM501 Voice Processor for Wearables and Smart Home Applications

Voice processing has become one of the indispensable technologies on smart home and wearable devices. Precise and prompt voice command recognition, along with minimizing power consumption are key for these applications. Small array microphone and voice acoustic processing technology specialists, Fortemedia introduced its new iM501 voice processor, embedding a high-end Tensilica HiFi Mini DSP core, and providing a best-in-class solution for always-on voice detection with low power consumption.
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3PASS flex: New Background Noise Simulation System for Multi-Microphone Arrangements
April 11, 2017 by audioXpress Staff

3PASS flex: New Background Noise Simulation System for Multi-Microphone Arrangements

3PASS flex is HEAD acoustics new simulation system for measuring speech quality performance in the presence of background noise. It is particularly suited for testing multi-microphone systems, microphone arrays or beamforming microphones in real world conditions where multi-point noise simulation with flexible microphone and loudspeaker arrays is required. 3PASS flex reproduces any previously recorded sound field at distinct microphone positions, representative of typical use cases.
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Philips Launches Brand-New Music and Voice Audio Recorder with Three Microphones
March 22, 2017 by audioXpress Staff

Philips Launches Brand-New Music and Voice Audio Recorder with Three Microphones

Austrian company Speech Processing Solutions, a Philips subsidiary, has announced a new audio recorder, which expands the company's tradition with voice recording also as a recording device for music enthusiasts. The Philips VoiceTracer audio recorder DVT7500 has been specially developed for high quality recordings, combining three high-quality microphones, an XLR and line-in connector, as well as 16GB of internal storage space. And of course, it still supports the company's famous voice to text applications.
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Infineon and XMOS Cooperate on New Voice-Recognition Platform that Combines Radar with MEMS Microphones and Audio Processing
March 2, 2017 by audioXpress Staff

Infineon and XMOS Cooperate on New Voice-Recognition Platform that Combines Radar with MEMS Microphones and Audio Processing

At Mobile World Congress 2017, Barcelona, Infineon Technologies and XMOS partner to deliver a new building block for voice recognition. It features a combination of Infineon’s BGT60TR24B 60GHz 2Tx/4Rx radar IC with accompanying antenna, 70dB SNR silicon microphone sensors, based on Infineon’s dual backplate MEMS technology, and an audio processor from XMOS. In combination, the solution provides far field voice capture by audio beamforming combined with radar target presence detection.
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STMicroelectronics, DSP Group, and Sensory Create Keyword-Smart Microphone for Voice-Controlled Devices
February 28, 2017 by audioXpress Staff

STMicroelectronics, DSP Group, and Sensory Create Keyword-Smart Microphone for Voice-Controlled Devices

Top MEMS supplier STMicroelectronics, DSP Group, and Sensory, a leading technology provider of voice interface and keyword-detect algorithms, have revealed details for a highly power-efficient, voice-detecting and -processing microphone that delivers keyword-recognition capabilities in a compact package. Ultra-low power voice processing and MEMS microphone circuitry enables sound detection and keyword recognition in a miniaturized single package.
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HEAD acoustics Presents Improved Speech and Audio Analysis Systems at MWC 2017
February 21, 2017 by audioXpress Staff

HEAD acoustics Presents Improved Speech and Audio Analysis Systems at MWC 2017

Speech and audio quality specialists, HEAD acoustics GmbH from Herzogenrath, Germany, will be presenting its range of solutions at the Mobile World Congress (​​February 27 to March 2, 2017). Like many key development technology companies, HEAD acoustics will use the Barcelona show to demonstrate a new evaluation software of VoCAS (Voice Control Analysis System), as well as an update of its communication analysis software ACQUA 3.5.100.
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Conexant Showcases Next-Gen Voice as an Interface and USB-C Headset Solutions at CES 2017
January 4, 2017 by audioXpress Staff

Conexant Showcases Next-Gen Voice as an Interface and USB-C Headset Solutions at CES 2017

In line with market trends, at CES 2017 Conexant is showing new hardware and software solutions designed to enable new voice-enabled AI assistant devices and next-gen USB-C type headphones. Conexant is showcasing its latest embedded hardware and software solutions designed to make it easy for CE manufacturers to develop new high-performance voice-enabled products and USB-C digital headphones.
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Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017
December 27, 2016 by Cristina Costa

Nordic Semiconductor to Demonstrate Bluetooth 5 Enhancements at CES 2017

Nordic Semiconductor in collaboration with its design partners are unveiling latest Bluetooth low energy and IEEE 802.15.4-enabled innovations at International CES 2017 in Las Vegas. The Norwegian company will demonstrate the capabilities of its Bluetooth 5-compatible nRF52 Series SoCs. Product demonstrations include contactless payment, wearables wireless charging, thread networking, voice-activated remote control, educational platforms, home automation and Bluetooth 5 enhancements.
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Audyssey Unveils eVR Enhanced Far Field Voice Recognition Suite
November 24, 2016 by audioXpress Staff

Audyssey Unveils eVR Enhanced Far Field Voice Recognition Suite

Audyssey eVR is a complete suite of advanced acoustic and voice algorithms to enable accurate voice recognition and clear voice communication on any device. According to the Los Angeles audio solutions company, this new embeddable platform allows best-in-class far field performance in consumer electronics products that rely on voice-based user interaction. The new Audyssey eVR suite of audio technologies is now available to manufacturers.
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IBM Launches Experimental Platform for Embedding Watson into Any Device
November 11, 2016 by audioXpress Staff

IBM Launches Experimental Platform for Embedding Watson into Any Device

IBM unveiled an experimental release of Project Intu, a new, system-agnostic platform designed to enable embodied cognition. The new platform allows developers to embed IBM Watson artificial intelligence functions into various end-user device form factors, offering a next generation architecture for building cognitive-enabled experiences. The initiative allows developers to extend Watson speech, language, vision and empathy capabilities to new form factors.
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