All items tagged with TSMC (12)

Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

January 2, 2025 by Joao Martins

Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

Ceva announced the first complete multi-protocol wireless connectivity platform that supports Bluetooth High Data Throughput (HDT). This next generation technology meets the pressing need for Bluetooth devices looking to support streaming of even larger media at higher data rates. The new Ceva-Waves Links200 IP platform is designed to dramatically enhance wireless audio capabilities and support advanced applications like 7.1 audio systems.

PIMIC and ZillTek Launch Integrated Edge AI and Microphone Noise Cancellation Solution

December 23, 2024 by Joao Martins

PIMIC and ZillTek Launch Integrated Edge AI and Microphone Noise Cancellation Solution

PIMIC, a new company working on ultra-low-power AI technology, unveiled the Clarity NC100, a Deep Neural Network (DNN)-based Environmental Noise Cancellation (ENC) chip that sets a new benchmark for performance and edge AI compute efficiency. Working in partnership with Taiwan-based MEMS microphone developer ZillTek, at CES 2025 the Californian company will present an integrated edge AI chip and digital microphone designed to address noise cancellation challenges in a single package.

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

February 5, 2024 by Joao Martins

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.

State of the Audio Economy: Macroeconomic Headwinds Also for the Audio Industry?

July 20, 2023 by Joao Martins

State of the Audio Economy: Macroeconomic Headwinds Also for the Audio Industry?

How well is the audio industry doing? Is there anything specific we in the audio industry can do, or are we just floating with the tide? Any attempt to characterize the state of the economy for the audio industry is limited to reading the signs from what are apparently very distinct, broader product segments. Yet, understanding these larger and wide-reaching product classes enables a better understanding of the overall macroeconomic picture and trends in consumer behavior.

xMEMS Announces General Availability of First Solid-State Fidelity, All-Silicon Microspeakers

April 18, 2023 by Joao Martins

xMEMS Announces General Availability of First Solid-State Fidelity, All-Silicon Microspeakers

Following the announcement of the world's first true MEMS microspeaker in July 2020, xMEMS Labs now announced general availability of three solutions for immediate integration into next-generation true wireless stereo (TWS) earphones, in-ear-monitors (IEMs), hearing aids, and other emerging personal audio designs. Offering the advantages of Solid-State Fidelity and DynamicVent technology, xMEMS is determined to change the market through vastly superior audio experiences and improved consumer listening comfort.

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

July 21, 2022 by Cristina Costa

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

Dolphin Design, an advanced chip design company and leading specialist in Edge Computing and AI platforms, and Big Fish Semiconductor have entered into a long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership. The high-performance recording capabilities of the U2 BLE 5.2 Audio AI SoC are made possible by Dolphin Design's 24-bit delta-sigma audio ADC, which combines superior audio performance, small area and ultra-low power consumption.

Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA

June 27, 2022 by Joao Martins

Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA

Flex Logix Technologies and CEVA, have announced the world’s first successful silicon implementation using Flex Logix’s EFLX embedded FPGA (eFPGA) connected to a CEVA-X2 DSP instruction extension interface. Enabling flexible and changeable instruction sets to meet demanding and changing processing workloads, the ASIC, known as SOC2, was designed and taped out in a TSMC 16nm technology by Bar-Ilan University SoC Lab, as part of the HiPer Consortium, backed by the Israeli Innovation Authority (IIA).

xMEMS Samples Ultra-Small Full-Range Microspeaker

November 4, 2021 by Mike Klasco

xMEMS Samples Ultra-Small Full-Range Microspeaker

Back in January 2015, I gave a talk about MEMS loudspeakers, and I have regularly written about MEMS speaker progress. A half decade later, it seems we are finally now moving beyond the industry's joke that MEMS’ development progress can be measured in dog years: it takes 7 human years for each year of MEMS’ progress! The big news is xMEMS Labs, a company founded just in January 2018, has announced it is now in mass production of its Montara, a monolithic MEMS “µspeaker” with a slim 1mm profile, and announced Cowell, the world’s smallest monolithic MEMS µSpeaker, at just 1.15mm high and 3.2mm wide.

xMEMS Announces Cowell Microspeaker for TWS and Hearing Aid Applications

November 2, 2021 by audioXpress Staff

xMEMS Announces Cowell Microspeaker for TWS and Hearing Aid Applications

xMEMS Labs today introduced Cowell, the world’s smallest monolithic MEMS µspeaker, targeting the replacement of balanced armature drivers in true wireless earbuds and hearing aid designs. At just 22mm3, 56 milligrams, and with a 3.2mm diameter side-firing package, Cowell delivers an impressive 110dB SPL at 1kHz. Cowell is the first speaker to use xMEMS’ 2nd generation M2 speaker cell architecture offering improved SPL/mm2 enabling increased loudness in smaller form factors.

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