New HEAD acoustics ArtemiS SUITE Release 15 Introduces Important Productivity and Feature Enhancements

HEAD acoustics has overhauled ArtemiS SUITE, its state-of-the-art software platform for sound and vibration, psychoacoustic, and structural dynamics analysis. The new release 15 brings substantial improvements in ease of use, performance, scope of operability, and connectivity. Outstanding features include improved model creation and calculation of transfer functions, export for binaural analysis and synthesis, an updated interface to the Augmented Reality solution from HoloMetrix, and third party hardware and software support.

German test and measurement specialist HEAD acoustics announced the latest update to its modular software platform for sound and vibration measurements and analysis, introducing enhancements and optimizations for a more efficient user experience. With the new release 13.6, HEAD acoustics has further optimized ArtemiS SUITE for efficient analysis of product and environmental noise as well as structural dynamics.

HEAD acoustics announced a new interesting integration of an Augmented Reality (AR) solution from German startup HoloMetrix to enable highly efficient sound power and sound intensity measurements. The integration with HEAD acoustics Artemis SUITE allows the creation of sound intensity maps for fast source localization, with assistance functions that guide the user through the measurements and offer automatic quality checks with acoustic or visual feedback.

With the release of ArtemiS SUITE 12.5, HEAD acoustics introduced a complete structural analysis package, offering Time Domain Animation, Operational Deflection Shape (ODS), Shape Comparison Tool and Modal Analysis. This will allow a unified software environment for simulation and project engineers to address structural dynamic issues within the ArtemiS SUITE with ease and efficiency.

This article addresses how modern methods of acoustical virtual product development make it possible to assess and optimize quality and performance problems throughout the entire product development process. Using a combination of modeling, simulation, and measurement tools, everything can be analyzed in-depth before building the physical product, the two authors explain. This article was originally published in audioXpress, September 2020.