TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

TDK introduced three new MEMS microphones as part of the SmartSound family of products for mobile and consumer connected devices. The new TDK T5919 is a high performance PDM digital MEMS microphone and is the first with built in particle ingress filter (PIF) for harsh environments. The new T3903 is a high performance PDM digital MEMS microphone with very low power and wide dynamic range, while the also T4086 is an analog output MEMS microphone in a tiny package, ideal for very space constrained applications.

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.

Syntiant, a California-based AI chip company focused on moving machine learning from the cloud to edge devices, announced a partnership with Infineon Technologies, to service the rising demand for voice user interface (VUI) in electronic devices. Optimized for battery-powered devices from true wireless earbuds to mobile phones to smart speakers, Syntiant’s partnership with Infineon enables more efficient voice control and custom command detection to numerous product configurations.